Patents by Inventor Takayoshi Yajima
Takayoshi Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10566511Abstract: A light-emitting device includes a circuit board including a wiring on a surface of a substrate, the wiring including a raised portion, and a light-emitting element mounted on the raised portion. When the light-emitting element is of a flip-chip type, an element electrode thereof is connected to the raised portion such that an edge of the element electrode on an outer periphery side of the light-emitting element is located outside of the raised portion in a top view and an exposed portion of the element electrode is covered with a white or transparent resin. When the light-emitting element is of a face-up type, an element substrate thereof is bonded to the raised portion such that the raised portion is located inside the element substrate in the top view and an exposed portion of a bottom surface of the element substrate is covered with a white resin.Type: GrantFiled: June 9, 2017Date of Patent: February 18, 2020Assignee: TOYODA GOSEI CO., LTD.Inventors: Takayoshi Yajima, Hiroshi Ito, Seiji Yamaguchi
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Publication number: 20190019932Abstract: A light emitting device includes: a base member; an insulating layer stacked in a surface of the base member, the insulating layer having excellent adhesion to a sealing glass; and a light emitting element mounted on the insulating layer, wherein: the insulating layer is formed by directly supplying a material to the surface of the base member; and porosity of the insulating layer is 10% or less.Type: ApplicationFiled: June 19, 2018Publication date: January 17, 2019Inventors: Seiji Yamaguchi, Hiroshi Ito, Takayoshi Yajima
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Publication number: 20180053883Abstract: A light-emitting device includes a circuit board including a wiring on a surface of a substrate, the wiring including a raised portion, and a light-emitting element mounted on the raised portion. When the light-emitting element is of a flip-chip type, an element electrode thereof is connected to the raised portion such that an edge of the element electrode on an outer periphery side of the light-emitting element is located outside of the raised portion in a top view and an exposed portion of the element electrode is covered with a white or transparent resin. When the light-emitting element is of a face-up type, an element substrate thereof is bonded to the raised portion such that the raised portion is located inside the element substrate in the top view and an exposed portion of a bottom surface of the element substrate is covered with a white resin.Type: ApplicationFiled: June 9, 2017Publication date: February 22, 2018Inventors: Takayoshi YAJIMA, Hiroshi ITO, Seiji YAMAGUCHI
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Patent number: 9825206Abstract: A light-emitting device includes a first light-emitting element, a phosphor, and a second light-emitting element having a peak wavelength between peak wavelengths of two peaks that define a deepest dip in a composite emission spectrum of the first light-emitting element and the phosphor.Type: GrantFiled: February 15, 2017Date of Patent: November 21, 2017Assignee: TOYODA GOSEI, CO., LTD.Inventors: Takayoshi Yajima, Hiroshi Ito
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Publication number: 20170250319Abstract: A light-emitting device includes a first light-emitting element, a phosphor, and a second light-emitting element having a peak wavelength between peak wavelengths of two peaks that define a deepest dip in a composite emission spectrum of the first light-emitting element and the phosphor.Type: ApplicationFiled: February 15, 2017Publication date: August 31, 2017Inventors: Takayoshi YAJIMA, Hiroshi ITO
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Publication number: 20160276555Abstract: A light emitting device manufacturing method includes: bonding a second film having an adhesive layer formed thereon to a substrate having bonded on a surface of a first film and transferring the adhesive layer onto the surface of the substrate; peeling off and removing the second film from the substrate; adhering and fixing a lead member to the adhesive layer; peeling off and removing the first film from the substrate; mounting a light emitting element on the lead member; and sealing the light emitting element and the lead member with a sealing material using a potting method to form a package.Type: ApplicationFiled: March 11, 2016Publication date: September 22, 2016Inventors: Takayoshi YAJIMA, Hiroshi ITO
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Patent number: 9305903Abstract: A light-emitting device includes a first light-emitting element disposed on a substrate, a convex-shaped first sealing resin that includes an annular portion formed in a closed annular shape in a top view and seals the first light-emitting element, a second light-emitting element disposed on the substrate in a region surrounded by the annular portion of the first sealing resin, and a second sealing resin filled in the region surrounded by the annular portion so as to seal the second light-emitting element. One of the first and second sealing resin includes a phosphor particle or the first and second sealing resins include a phosphor particle to emit a different fluorescent color from each other.Type: GrantFiled: July 15, 2014Date of Patent: April 5, 2016Assignee: TOYODA GOSEI CO., LTD.Inventors: Mitsushi Terakami, Takayoshi Yajima, Hiroshi Ito
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Patent number: 9040353Abstract: A method for manufacturing a semiconductor light emitting device comprises a sealing step of sealing a semiconductor chip fixed on a lead frame with a sealing member, a removal step of removing the sealing member until a surface of the semiconductor chip becomes exposed, an irregularity formation step of forming fine irregularities on a bond surface formed in the removal step, and a bonding step of bonding a wavelength conversion member to the bond surface.Type: GrantFiled: August 1, 2013Date of Patent: May 26, 2015Assignee: Toyoda Gosei Co., Ltd.Inventors: Takayoshi Yajima, Hiroshi Ito
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Publication number: 20150076534Abstract: A light-emitting device includes a first light-emitting element disposed on a substrate, a convex-shaped first sealing resin that includes an annular portion formed in a closed annular shape in a top view and seals the first light-emitting element, a second light-emitting element disposed on the substrate in a region surrounded by the annular portion of the first sealing resin, and a second sealing resin filled in the region surrounded by the annular portion so as to seal the second light-emitting element. One of the first and second sealing resin includes a phosphor particle or the first and second sealing resins include a phosphor particle to emit a different fluorescent color from each other.Type: ApplicationFiled: July 15, 2014Publication date: March 19, 2015Inventors: Mitsushi TERAKAMI, Takayoshi Yajima, Hiroshi Ito
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Publication number: 20140080235Abstract: A method for manufacturing a semiconductor light emitting device comprises a sealing step of sealing a semiconductor chip fixed on a lead frame with a sealing member, a removal step of removing the sealing member until a surface of the semiconductor chip becomes exposed, an irregularity formation step of forming fine irregularities on a bond surface formed in the removal step, and a bonding step of bonding a wavelength conversion member to the bond surface.Type: ApplicationFiled: August 1, 2013Publication date: March 20, 2014Applicant: Toyoda Gosei Co., LTD.Inventors: Takayoshi YAJIMA, Hiroshi Ito
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Patent number: 7754514Abstract: A method of making a light emitting element, the light emitting element with a semiconductor layer represented by: AlXInYGa1?X?YN (0?X?1, 0?Y?1, 0?X+Y?1), has the step of wet-etching a surface of the semiconductor layer by using an etching solution to have a roughened surface on the semiconductor layer. The wet-etching is conducted without irradiating the surface of the semiconductor layer with a light with a wavelength region corresponding to energy higher than bandgap energy of the semiconductor layer.Type: GrantFiled: August 21, 2007Date of Patent: July 13, 2010Assignee: Toyoda Gosei Co., Ltd.Inventors: Takayoshi Yajima, Masanobu Ando, Toshiya Uemura, Akira Kojima, Koji Kaga
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Publication number: 20090039373Abstract: A group III nitride-based compound semiconductor light emitting device includes a polarity inversion layer including a surface with a convex portion, and a transparent electrode formed on the polarity inversion layer. The polarity inversion layer may have a magnesium concentration of not less than 1×1020 atoms/cm3, or not less than 2×1020 atoms/cm3 and not more than 5×1021 atoms/cm3. The polarity inversion layer may be formed of AlxGa1?xN (0?x<1) doped with magnesium.Type: ApplicationFiled: July 22, 2008Publication date: February 12, 2009Applicant: TOYODA GOSEI CO., LTD.Inventors: Yoshiki Saito, Takayoshi Yajima, Yasuhisa Ushida
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Publication number: 20080254562Abstract: A method of making a light emitting element, the light emitting element with a semiconductor layer represented by: AlxInyGa1-x-yN (0?X?1, 0?Y?1, 0?X+Y?1), has the step of wet-etching a surface of the semiconductor layer by using an etching solution to have a roughened surface on the semiconductor layer. The wet-etching is conducted without irradiating the surface of the semiconductor layer with a light with a wavelength region corresponding to energy higher than bandgap energy of the semiconductor layer.Type: ApplicationFiled: August 21, 2007Publication date: October 16, 2008Applicant: TOYODA GOSEI CO., LTD.Inventors: Takayoshi Yajima, Masanobu Ando, Toshiya Uemura, Akira Kojima, Koji Kaga