Abstract: Novel organic silicon compounds are based on a benzene ring having two epoxy radicals and an alkoxysilane radical. They are useful as resin modifiers, adhesive aids for epoxy resins, and silane coupling agents. Inorganic fillers such as silica surface treated with the compounds are useful in encapsulating resin compositions.

Abstract: A device is provided for measuring an angle between two intersecting surfaces of a work. The device includes a light emitting device for inducing a light pattern on the surfaces of the work, a camera for picking up the pattern, and an image processor for processing the picture of the pattern and obtaining the angle of the work.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

Abstract: An epoxy resin composition comprising (A) a naphthalene ring-containing epoxy resin, (B) a biphenyl-containing epoxy resin, (C) a specific phenolic resin, and (D) an inorganic filler shows good flow and cures to products having low modulus of elasticity, especially at temperatures above Tg, a low coefficient of expansion, high Tg irrespective of low stresses, and minimized water absorption. Then semiconductor devices encapsulated with the present composition remain highly reliable even after being subject to thermal shocks upon surface mounting.

Abstract: A chromating liquid for forming a chromate film on a Zn or Zn-alloy plated steel sheet, is prepared by adding and mixing a silane coupling agent in a molar ratio of from 0.05 to 0.3 relative to Cr.sup.6+ contained in an aqueous chromating liquid which contains 1-30 g/l of Cr.sup.6+ and 1-30 g/l of Cr.sup.3+ at a weight ratio of Cr.sup.6+ /Cr.sup.3+ ranging from 0.1 to 2.0; and further contains 1-59 g/l of hydrofluoric acid and 1-59 g/l of phosphoric acid at total of hydrofluoric acid and phosphoric acid ranging from 2 to 60 g/l and at a weight ratio of (fluoride ions+phosphate ions)/Cr.sup.3+ ranging from 0.5 to 3.5. and, further said chromating liquid is applied on a surface of the zinc-based plated steel sheet and is then dried, thereby forming the chromate film having a coating amount of from 10 to 150 mg/m.sup.2 in terms of the chromium.

Abstract: A composition comprising an epoxy resin and a curing agent is blended with a thermoplastic resin impregnated with an organic silicon compound to provide an epoxy resin composition which cures into products having improved adhesion and thermal impact and is suitable for encapsulating semiconductor devices.The impregnated thermoplastic resin is formed by swelling the thermoplastic resin with a solvent and impregnating the swollen thermoplastic resin with the organic silicon compound.

Abstract: An epoxy resin having a propenyl group conjugated with an aromatic ring is heat resistant and is easily molded and cured into products having high strength and Tg. It is thus useful as a resin component or modifier.

Abstract: An epoxy resin composition comprising (A) a specific epoxy resin, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is suitable for encapsulating semiconductor devices.

Abstract: An epoxy resin composition comprising (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a phenolic resin having at least one naphthalene ring in a molecule, and (C) an inorganic filler has improved flow and cures into products having a low coefficient of expansion, high Tg, and low moisture absorption. The composition is thus suitable for encapsulating semiconductor devices.

Abstract: A light-emitting diode drive circuit of the present invention comprises: a current supply circuit (3) including a first transistor (16), the base of which receives a first drive pulse signal (S3) output from a signal input circuit, and a second transistor (15), the collector of which is connected to a light-emitting diode (2), the emitter of which is connected to a current source (24) together with the emitter of the first transistor (16), and the base of which receives a second drive pulse signal (S2) having a phase opposite to that of the first drive pulse signal (S3); a fall time shortening circuit (6) including a third transistor (13) which is connected in parallel with the light-emitting diode (2) and the base of which receives an input for short-circuiting both terminals of the light-emitting diode (2) during a turn-OFF time; and a rise time shortening circuit (5) including a circuit (4) for generating a peaking current during a turn-ON time of the light-emitting diode (2), and a fourth transistor (14)

Abstract: An aqueous solution of a reducing agent is applied to a chromate coated metal surface to reduce the extent to which the chromate coating undergoes dissolution during a subsequent cleaning process.

Abstract: A method of and apparatus for recognizing the figure pattern of parts used in factories is disclosed in which a pattern input device, such as an ITV camera creates an electrical image of the part which is A/D converted and then stored in binary coded form. The binary coded data is then processed and compared to known stored values, using one or more characteristics of the figure pattern, to determine the identity of the viewed part.