Abstract: Weld structures of metal members include: a first member; and a second member that is layered together with the first member, wherein at least one first solidified part that extends from a surface of the first member to the inside of the first member, at least one second solidified part that is formed by a molten area extending through the first member and the second member, and at least one third solidified member that is formed by a molten area extending through the first member and the second member are provided, and the third solidified part is located closer to a non-layered surface of the second member than the second member is.

Abstract: A welding structure for a metal member includes a first member containing a metal member, a second member containing a metal member, a first solidifying portion, a second solidifying portion, and a third solidifying portion. The first solidifying portion is present from a first surface to a second surface of the first member. The second solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion is shorter than the second solidifying portion. The second solidifying portion and the third solidifying portion are separated from each other in the second member.

Abstract: A highly reliable joined structure and joining method by suppressing peeling at joined portions in the joined structure formed by joining metals together is provided. A joined structure includes a plurality of metals laminated and joined together. The plurality of metals are shaped to include a plurality of convex portions arranged on a surface positioned in a lamination direction, and flat portions arranged between the plural convex portions. Tip ends of the plurality of convex portions are formed as curved surfaces.

Abstract: A welding structure for a metal member includes a first member containing a metal member, a second member containing a metal member, a first solidifying portion, a second solidifying portion, and a third solidifying portion. The first solidifying portion is present from a first surface to a second surface of the first member. The second solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion is shorter than the second solidifying portion. The second solidifying portion and the third solidifying portion are separated from each other in the second member.

Abstract: A welded metal component, includes: a first component; a second component that is stacked on the first component and that is made of a material different from the first component; and at least one welded part that passes through the second component so as to reach the first component, wherein a proportion of an intermetallic compound present in the at least one welded part is from 15% to 60%, and the intermetallic compound includes a metal element that constitutes the first component, and a metal element that constitutes the second component. Further disclosed is a battery comprising the above welded metal component, wherein the second component serves as a bus bar, and the first component serves as an electrode for the battery.

Abstract: A highly reliable joined structure and joining method by suppressing peeling at joined portions in the joined structure formed by joining metals together is provided. A joined structure according to the present disclosure is a joined structure in which a plurality of metals are laminated and joined together, the plural metals include a plurality of convex portions arranged on a surface positioned in a lamination direction and flat portions arranged between the plural convex portions, and tip ends of the plural convex portions are formed by curved surfaces.

Abstract: Weld structures of metal members include: a first member; and a second member that is layered together with the first member, wherein at least one first solidified part that extends from a surface of the first member to the inside of the first member, at least one second solidified part that is formed by a molten area extending through the first member and the second member, and at least one third solidified member that is formed by a molten area extending through the first member and the second member are provided, and the third solidified part is located closer to a non-layered surface of the second member than the second member is. Further disclosed are welding processes for producing the same.

Abstract: A welded metal component, includes: a first component; a second component that is stacked on the first component and that is made of a material different from the first component; and at least one welded part that passes through the second component so as to reach the first component, wherein a proportion of an intermetallic compound present in the at least one welded part is from 15% to 60%, and the intermetallic compound includes a metal element that constitutes the first component, and a metal element that constitutes the second component. Further disclosed is a battery comprising the above welded metal component, wherein the second component serves as a bus bar, and the first component serves as an electrode for the battery.

Abstract: A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.

Abstract: A front plate and a back plate are superposed with each other in parallel, and pressed onto each other. Moreover, the back plate and a gas-blowing jig are brought into close contact with each other. The glass pipe in which a glass fiber filter paper is placed is pressed onto the back plate, with a solid-state glass frit ring interposed therebetween. Thus, by using a glass pipe, a nitrogen, Xe, or Ne gas is supplied into the panel, or the inside of the panel is evacuated.

Abstract: A method for producing a plasma display panel includes: (i) providing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a barrier rib and a phosphor layer are formed on a substrate B; (ii) supplying a glass frit material onto a peripheral region of the substrate A or B to form a glass frit sealing member; (iii) opposing the front and rear panels with each other such that the glass frit sealing member is interposed therebetween; and (iv) heating the opposed front and rear panels to reach a softening point of the glass frit sealing member or a higher temperature than the softening point, while supplying a cleaning gas into a space formed between the opposed front and rear panels.

Abstract: A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

Abstract: A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.

Abstract: A printed wiring board having a wiring layer formed by a wiring pattern for wiring an electronic circuit comprised of an electric part mounted thereon and including a connecting terminal, a first conductor layer formed by a first conductor pattern that is maintained at either a power potential or a ground potential when the electronic circuit is in operation, a second conductor layer formed by a second conductor pattern that is maintained at either the power potential or the ground potential when the electronic circuit is in operation; and a through hole having the connecting terminal of the electric part inserted therein and including, formed on an internal wall thereof, a conductor film that is directly connected to the first conductor pattern and not directly connected to the second conductor pattern.

Abstract: A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.

Abstract: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.

Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: An electronic device including a circuit part having a semiconductor chip. The device includes a first heat radiation member kept in contact with the circuit part for radiating the heat generated by the circuit part, a second heat radiation member, and an intermediate member 32. Fins of the intermediate member are fitted in or on the fins of the first heat radiation member, and the base portion of the intermediate member is coupled to the base portion of the second heat radiation member. Therefore, the second heat radiation member can be conveniently added to the first heat radiation member via the intermediate member.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.