Patents by Inventor Takayuki Ashida

Takayuki Ashida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240042492
    Abstract: A cleaning device includes: a base that supports a liquid injection member that injects an electrolyte to a battery case; a cleaning unit that sprays a cleaning liquid onto the liquid injection member supported by the base; and an inspection unit that inspects the spraying condition of the cleaning liquid by receiving a spray of the cleaning liquid from the cleaning unit.
    Type: Application
    Filed: January 18, 2022
    Publication date: February 8, 2024
    Inventors: Yasushi TANIGUCHI, Kazutaka NISHIKAWA, Takayuki ASHIDA
  • Patent number: 11428251
    Abstract: Weld structures of metal members include: a first member; and a second member that is layered together with the first member, wherein at least one first solidified part that extends from a surface of the first member to the inside of the first member, at least one second solidified part that is formed by a molten area extending through the first member and the second member, and at least one third solidified member that is formed by a molten area extending through the first member and the second member are provided, and the third solidified part is located closer to a non-layered surface of the second member than the second member is.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: August 30, 2022
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Seiji Kumazawa, Tomomi Tanaka, Daisuke Shioga, Takayuki Ashida
  • Patent number: 11185947
    Abstract: A welding structure for a metal member includes a first member containing a metal member, a second member containing a metal member, a first solidifying portion, a second solidifying portion, and a third solidifying portion. The first solidifying portion is present from a first surface to a second surface of the first member. The second solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion is shorter than the second solidifying portion. The second solidifying portion and the third solidifying portion are separated from each other in the second member.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: November 30, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Seiji Kumazawa, Takayuki Ashida
  • Patent number: 11161197
    Abstract: A highly reliable joined structure and joining method by suppressing peeling at joined portions in the joined structure formed by joining metals together is provided. A joined structure includes a plurality of metals laminated and joined together. The plurality of metals are shaped to include a plurality of convex portions arranged on a surface positioned in a lamination direction, and flat portions arranged between the plural convex portions. Tip ends of the plurality of convex portions are formed as curved surfaces.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: November 2, 2021
    Assignee: Panasonic Intellectual Property Management Co. Ltd.
    Inventors: Takayuki Hirose, Yasushi Taniguchi, Seiji Kumazawa, Takayuki Ashida
  • Publication number: 20200009685
    Abstract: A welding structure for a metal member includes a first member containing a metal member, a second member containing a metal member, a first solidifying portion, a second solidifying portion, and a third solidifying portion. The first solidifying portion is present from a first surface to a second surface of the first member. The second solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion has a first end that is present in the second member and a second end that is connected to the first solidifying portion. The third solidifying portion is shorter than the second solidifying portion. The second solidifying portion and the third solidifying portion are separated from each other in the second member.
    Type: Application
    Filed: June 21, 2018
    Publication date: January 9, 2020
    Inventors: SEIJI KUMAZAWA, TAKAYUKI ASHIDA
  • Patent number: 10439191
    Abstract: A welded metal component, includes: a first component; a second component that is stacked on the first component and that is made of a material different from the first component; and at least one welded part that passes through the second component so as to reach the first component, wherein a proportion of an intermetallic compound present in the at least one welded part is from 15% to 60%, and the intermetallic compound includes a metal element that constitutes the first component, and a metal element that constitutes the second component. Further disclosed is a battery comprising the above welded metal component, wherein the second component serves as a bus bar, and the first component serves as an electrode for the battery.
    Type: Grant
    Filed: July 6, 2017
    Date of Patent: October 8, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Seiji Kumazawa, Takayuki Ashida, Shinya Mori, Hiroaki Takano
  • Publication number: 20190224776
    Abstract: A highly reliable joined structure and joining method by suppressing peeling at joined portions in the joined structure formed by joining metals together is provided. A joined structure according to the present disclosure is a joined structure in which a plurality of metals are laminated and joined together, the plural metals include a plurality of convex portions arranged on a surface positioned in a lamination direction and flat portions arranged between the plural convex portions, and tip ends of the plural convex portions are formed by curved surfaces.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 25, 2019
    Inventors: TAKAYUKI HIROSE, YASUSHI TANIGUCHI, SEIJI KUMAZAWA, TAKAYUKI ASHIDA
  • Publication number: 20180245616
    Abstract: Weld structures of metal members include: a first member; and a second member that is layered together with the first member, wherein at least one first solidified part that extends from a surface of the first member to the inside of the first member, at least one second solidified part that is formed by a molten area extending through the first member and the second member, and at least one third solidified member that is formed by a molten area extending through the first member and the second member are provided, and the third solidified part is located closer to a non-layered surface of the second member than the second member is. Further disclosed are welding processes for producing the same.
    Type: Application
    Filed: September 8, 2016
    Publication date: August 30, 2018
    Inventors: SEIJI KUMAZAWA, TOMOMI TANAKA, DAISUKE SHIOGA, TAKAYUKI ASHIDA
  • Publication number: 20180026252
    Abstract: A welded metal component, includes: a first component; a second component that is stacked on the first component and that is made of a material different from the first component; and at least one welded part that passes through the second component so as to reach the first component, wherein a proportion of an intermetallic compound present in the at least one welded part is from 15% to 60%, and the intermetallic compound includes a metal element that constitutes the first component, and a metal element that constitutes the second component. Further disclosed is a battery comprising the above welded metal component, wherein the second component serves as a bus bar, and the first component serves as an electrode for the battery.
    Type: Application
    Filed: July 6, 2017
    Publication date: January 25, 2018
    Inventors: SEIJI KUMAZAWA, TAKAYUKI ASHIDA, SHINYA MORI, HIROAKI TAKANO
  • Patent number: 8113899
    Abstract: A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: February 14, 2012
    Assignee: Panasonic Corporation
    Inventors: Tomohiro Okumura, Ryuichi Murai, Takahiro Takisawa, Hiroyoshi Sekiguchi, Takayuki Ashida, Yoshihiro Sakaguchi
  • Publication number: 20110279030
    Abstract: A front plate and a back plate are superposed with each other in parallel, and pressed onto each other. Moreover, the back plate and a gas-blowing jig are brought into close contact with each other. The glass pipe in which a glass fiber filter paper is placed is pressed onto the back plate, with a solid-state glass frit ring interposed therebetween. Thus, by using a glass pipe, a nitrogen, Xe, or Ne gas is supplied into the panel, or the inside of the panel is evacuated.
    Type: Application
    Filed: May 2, 2011
    Publication date: November 17, 2011
    Inventors: Takayuki ASHIDA, Tomohiro OKUMURA, Shuzo TSUCHIDA, Mamoru WATANABE
  • Publication number: 20110171871
    Abstract: A method for producing a plasma display panel includes: (i) providing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a barrier rib and a phosphor layer are formed on a substrate B; (ii) supplying a glass frit material onto a peripheral region of the substrate A or B to form a glass frit sealing member; (iii) opposing the front and rear panels with each other such that the glass frit sealing member is interposed therebetween; and (iv) heating the opposed front and rear panels to reach a softening point of the glass frit sealing member or a higher temperature than the softening point, while supplying a cleaning gas into a space formed between the opposed front and rear panels.
    Type: Application
    Filed: January 11, 2011
    Publication date: July 14, 2011
    Inventors: Hiroyoshi Sekiguchi, Yasuhiro Asaida, Takayuki Ashida, Tomohiro Okumura
  • Patent number: 7703064
    Abstract: A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.
    Type: Grant
    Filed: December 20, 2005
    Date of Patent: April 20, 2010
    Assignee: Fujitsu Limited
    Inventors: Takayuki Ashida, Kenichirou Tsubone
  • Publication number: 20100015877
    Abstract: A method for producing a plasma display panel, the method comprising the steps of: (i) preparing a front panel and a rear panel, the front panel being a panel wherein an electrode A, a dielectric layer A and a protective layer are formed on a substrate A, and the rear panel being a panel wherein an electrode B, a dielectric layer B, a partition wall and a phosphor layer are formed on a substrate B; (ii) applying a glass frit material onto a peripheral region of the substrate A or B, and then opposing the front and rear panels with each other such that the glass frit material is interposed therebetween; (iii) supplying a gas into a space formed between the opposed front and rear panels from a direction lateral to the opposed front and rear panels, under such a condition that the front and rear panels are heated; and (iv) melting the glass frit material to cause the front and rear panels to be sealed.
    Type: Application
    Filed: July 14, 2009
    Publication date: January 21, 2010
    Inventors: Tomohiro Okumura, Ryuichi Murai, Takahiro Takisawa, Hiroyoshi Sekiguchi, Takayuki Ashida, Yoshihiro Sakaguchi
  • Publication number: 20080223611
    Abstract: A printed wiring board having a wiring layer formed by a wiring pattern for wiring an electronic circuit comprised of an electric part mounted thereon and including a connecting terminal, a first conductor layer formed by a first conductor pattern that is maintained at either a power potential or a ground potential when the electronic circuit is in operation, a second conductor layer formed by a second conductor pattern that is maintained at either the power potential or the ground potential when the electronic circuit is in operation; and a through hole having the connecting terminal of the electric part inserted therein and including, formed on an internal wall thereof, a conductor film that is directly connected to the first conductor pattern and not directly connected to the second conductor pattern.
    Type: Application
    Filed: March 14, 2008
    Publication date: September 18, 2008
    Applicant: FUJITSU LIMITED
    Inventor: Takayuki ASHIDA
  • Publication number: 20070079276
    Abstract: A multilayered board data input unit inputs design data of a multilayered circuit board provided with through holes penetrating and mutually connecting solid-layer conductors disposed in a multilayer manner. A limitation rule setting unit sets a limitation rule for limiting the number of solid-layer conductors to be connected to the through holes. A separation processing unit separates connections of the solid-layer conductors to the through holes in the design data based on the limitation rule. At this time, when a solid-layer conductor to be separated from the through holes is selected as a candidate, the separation processing unit determines whether the solid-layer conductor is isolated by separation, when the solid-layer conductor is not isolated, determines isolation, and when the solid-layer conductor is isolated, stops separation.
    Type: Application
    Filed: December 20, 2005
    Publication date: April 5, 2007
    Applicant: FUJITSU LIMITED
    Inventors: Takayuki Ashida, Kenichirou Tsubone
  • Patent number: 6388879
    Abstract: A circuit board packaging structure comprises a plurality of circuit boards disposed in parallel to each other and each packaged with electric circuit parts. The circuit board packaged with electric circuit parts exhibiting a larger exothermic quantity than those of the electric circuit parts packaged on the other circuit boards is disposed outermost among the plurality of circuit boards. The surface of the circuit board packed with the electric circuit parts exhibiting the larger exothermic quantity is directed outside the structure.
    Type: Grant
    Filed: February 9, 1995
    Date of Patent: May 14, 2002
    Assignee: Fujitsu Limited
    Inventors: Hiroyuki Otaguro, Takayuki Ashida, Hitoshi Yokemura, Hidenao Nakajima, Yoshimi Watanabe, Shuuhei Fujita
  • Patent number: 6216342
    Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.
    Type: Grant
    Filed: December 11, 1998
    Date of Patent: April 17, 2001
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 6116912
    Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.
    Type: Grant
    Filed: September 15, 1998
    Date of Patent: September 12, 2000
    Assignee: Fujitsu Limited
    Inventors: Masao Hosogai, Setuo Kojima, Hitoshi Yokemura, Rie Takada, Hiroyuki Otaguro, Takayuki Ashida, Toshio Abe
  • Patent number: 6067230
    Abstract: An electronic device including a circuit part having a semiconductor chip. The device includes a first heat radiation member kept in contact with the circuit part for radiating the heat generated by the circuit part, a second heat radiation member, and an intermediate member 32. Fins of the intermediate member are fitted in or on the fins of the first heat radiation member, and the base portion of the intermediate member is coupled to the base portion of the second heat radiation member. Therefore, the second heat radiation member can be conveniently added to the first heat radiation member via the intermediate member.
    Type: Grant
    Filed: November 10, 1998
    Date of Patent: May 23, 2000
    Assignee: Fujitsu Limited
    Inventors: Takayuki Ashida, Katsunori Kuroki, Takayoshi Tanemura