Abstract: The construction machine including an engine room having an engine, a radiator ii for cooling the engine, and a hydraulic pump which are arranged therein, and a counterweight area which is located adjacent to the engine room and in which batteries are installed, a ventilation passage for cooling the engine room and a ventilation passage for cooling the batteries are formed separately and independently in the substantially same direction, and a flowing direction of cooling air flowing in the ventilation passage for cooling the engine room and a flowing direction of cooling air flowing in the ventilation passage for cooling the batteries are substantially parallel to each other.

Abstract: [Object] To provide a cooling structure for a construction machine which can efficiently discharge heat generated in batteries and prevent exhaust air of an engine room from being sucked in the batteries. [Solution Means] In a cooling structure for a construction machine, the construction machine including an engine room 5 having an engine 4, a radiator 11 for cooling the engine 4, and a hydraulic pump 7 which are arranged therein, and a counterweight area 6 which is located adjacent to the engine room 5 and in which batteries 27 are installed, a ventilation passage 23 for cooling the engine room 5 and a ventilation passage 34 for cooling the batteries 27 are formed separately and independently in the substantially same direction, and a flowing direction of cooling air flowing in the ventilation passage 23 for cooling the engine room 5 and a flowing direction of cooling air flowing in the ventilation passage 34 for cooling the batteries 27 are substantially parallel to each other.

Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Abstract: A cooling jacket for cooling a heat-generating element through transmitting heat-generation into a coolant flowing within an inside of the cooling jacket, which is mounted within an electronic apparatus, and includes a base portion, and a cover portion. The base portion includes a heat-transfer surface in proximity to a surface of the heat-generating element, and a plurality of wall portions. Each wall portion is defined to extend into a direction perpendicular to the heat-transfer surface, thereby defining flow passages for the fluid coolant between the wall portions. The cover portion is attached on the base portion surrounding a periphery of the base portion, thereby defining a passage for guiding the fluid coolant into the base portion. The base portion builds up the sector-shaped flow passages and a summit portion at a central portion of the base, and has a configuration that is thermally isotropic to the heat-generating element.

Abstract: A disk array apparatus includes a plurality of disk drives arranged in at least one disk drive line in a direction of an airflow, at least one shield plate, a housing containing the disk drives and the at least one shield plate therein, and flow passages arranged between an upper surface of the disk drives and an inner wall of the housing for enabling the airflow to pass through. The at least one shield plate is arranged between at least two of the disk drives of the at least one disk drive line for controlling the airflow on a downstream side of the flow passages.

Abstract: An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

Abstract: A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read/write head, and a driving mechanism for driving the recording disk and the read/write head, and a control board for controlling the driving mechanism, the control board being mounted on the thin case. In the disk array system, the thin case and the unit box are composed of a thermally-conductive material, the unit box includes surfaces parallel to the thickness direction of the plurality of disk drives, and at least one of the surfaces has a cold plate filled with a refrigerant. Heat generated at the disk drives is transferred to the cold plate, thereby improving cooling performance.

Abstract: In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable therein on a rotatable axis, a casing holder on which the disk casing is mounted, and a second connector (detachably) connectable to corresponding one of the first connectors so that at least an electric connection between the disc casing and the corresponding one of the first connectors is capable of being formed through the second connector, the disk casing is connected to the casing holder in such a manner that a heat energy generated for at least one of recording an information onto the recording disc and reading out the information from the recording disk is capable of transferring from the disk casing to the casing holder.

Abstract: An edge light display unit includes light generating sources, a substrate mounting the light generating sources, a lens, a diffusion plate expanding light input in a side surface of the diffusion plate as to irradiate a front surface of the diffusion plate, and a heat sink thermally contacted with the substrate. A base portion of the heat sink has a substrate mounting surface and a fin constituting surface substantially perpendicular to the substrate mounting surface. At least one fin extends from the fin constituting surface in a direction substantially perpendicular thereto and along the plurality of light generating sources in a direction parallel to substrate. An air supply and exhaust surface of a cooling air are formed in a back surface side of the display unit.

Abstract: In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on a control section 1D of a disc array device 1. The circuit component 4A for realizing the NAS function, liable to become hot, is provided with a heat sink 5. The aperture of the main air inlet section (Wb) is covered with a top plate 8. Airflow guidance sections (Wa, Wc) are respectively provided on both sides of the main air inlet section. Since the fin pitch of the airflow guidance sections is set narrow, the air inflow resistance (airflow resistance) of these is higher than that of the main air inlet section. Due to this difference in airflow resistance, the air in the vicinity of the airflow guidance sections is guided into the main air inlet section. The top plate 8 prevents outflow of air that has flowed into the main air inlet section to outside the heat sink 5.

Abstract: In the case that the LED is used as a light source for a backlight such as a display unit or the like, if a lot of current is circulated for securing a brightness, a lot of heat is generated in view of a characteristic of the LED, so that the LED comes to a high temperature, and there is a problem that the characteristic of the LED itself is deteriorated such as a light output is lowered, a long-term service life can not secured, or the like. Further, in the case that a temperature difference exists between a plurality of LEDs, there is a problem that it appears as a brightness irregularity of a screen of the display unit.

Abstract: For achieving installation of disk drives at high density, as well as, a large capacity and a high speed of the disk array apparatus, the disk array apparatus comprises disk drives, a box containing a large number of the disk drives in a direction of thickness thereof, wherein a throttle of flow passage, which combines a sour absorbing material in common, is provided above the disk drives in the downstream side of the disk array apparatus.

Abstract: A cooling jacket for cooling a heat-generating element 300 through transmitting heat-generation therein into a coolant flowing within an inside thereof, which is mounted within an electronic apparatus, comprises a base portion 110, having a heat-transfer surface 111 to be contact on a surface of the heat-generating element, and a plural number of wall portions 113, each being defined to extend into a direction perpendicular to the heat-transfer surface, thereby defining flow passages 114 for the liquid coolant between the wall portions; and a cover portion 120, being attached on the base portion surrounding a periphery thereof, thereby defining a passage for guiding the liquid coolant into the base portion, wherein the base portion builds up the sector-like shaped flow passages and a summit portion at a central portion of the base, and has a configuration being thermally isotropic to the heat-generating element to be contact thereon.

Abstract: A disk array system includes a plurality of disk drives and at least one unit box including the plurality of disk drives aligned in the thickness direction of the disk drive, each disk drive including a thin case accommodating a recording disk, a read/write head, and a driving mechanism for driving the recording disk and the read/write head, and a control board for controlling the driving mechanism, the control board being mounted on the thin case. In the disk array system, the thin case and the unit box are composed of a thermally-conductive material, the unit box includes surfaces parallel to the thickness direction of the plurality of disk drives, and at least one of the surfaces has a cold plate filled with a refrigerant. Heat generated at the disk drives is transferred to the cold plate, thereby improving cooling performance.

Abstract: In this invention, the CPU of a NAS board, which is liable to become hot, is cooled by concentrating a larger amount of air onto a heat sink. A plurality of logic circuit boards 3 are mounted on a control section 1D of a disc array device 1. The circuit component 4A for realizing the NAS function, liable to become hot, is provided with a heat sink 5. The aperture of the main air inlet section (Wb) is covered with a top plate 8. Airflow guidance sections (Wa, Wc) are respectively provided on both sides of the main air inlet section. Since the fin pitch of the airflow guidance sections is set narrow, the air inflow resistance (airflow resistance) of these is higher than that of the main air inlet section. Due to this difference in airflow resistance, the air in the vicinity of the airflow guidance sections is guided into the main air inlet section. The top plate 8 prevents outflow of air that has flowed into the main air inlet section to outside the heat sink 5.

Abstract: In a disc array apparatus having a plurality of disc units, and a plurality of first connectors, each of which disc units includes a disc casing surrounding at least one recording disc rotatable therein on a rotatable axis, a casing holder on which the disk casing is mounted, and a second connector (detachably) connectable to corresponding one of the first connectors so that at least an electric connection between the disc casing and the corresponding one of the first connectors is capable of being formed through the second connector, the disk casing is connected to the casing holder in such a manner that a heat energy generated for at least one of recording an information onto the recording disc and reading out the information from the recording disk is capable of transferring from the disk casing to the casing holder.

Abstract: [Object]To offer an alternator for motor vehicle that can effectively cool down the rectifier, taking into account the cooling air flow, and accordingly produce higher output.

Abstract: A highly reliable electronic apparatus free from condensation in the cabinet of the apparatus. The electronic apparatus has printed circuit boards on which heat emitting semiconductor devices are mounted and a fan. The electronic apparatus further comprises a hygrometer for measuring the relative humidity and dew-point temperature of the cooling air that is introduced into the cabinet through an opening, a surface temperature sensor for sensing the temperature of the surface of the semiconductor devices, an internal temperature sensor for sensing the internal temperature of the semiconductor device, dehumidifier and heater means made up of a heat pump and an outdoor unit, and a controller for controlling the dehumidifier means and the heater means so that the relative humidity is less than 100% and the dew-point temperature is less than the surface temperature of the semiconductor devices.

Abstract: A cooling apparatus for electronic devices which is capable of reducing the flow resistance in an exhaust air flow passage to lessen noises and to improve the cooling performance of heat sinks when heat-generating semiconductor parts are very tightly mounted in a plane or when the calorific value of the heat-generating semiconductor parts is extremely large. In addition, the cooling apparatus realizes uniform air quantity distribution and uniform temperature distribution to the heat-generating semiconductor parts. Heat sinks 13 are respectively attached onto a plurality of heat-generating semiconductor parts 12a, 12b and 12c on a board 11. Further, nozzles 14 are respectively provided on the opposite side surfaces of heat-generating semiconductor part fitted surfaces of the heat sinks 13.

Abstract: An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.