Abstract: Provided is a peeling apparatus including a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The peeling inducing unit includes a sharp member, and a moving mechanism that moves the sharp member toward a side surface portion of the second substrate adjacent to a bonding portion of the first substrate and the second substrate in the side surface of the superimposed substrate.

Abstract: Provided is a peeling apparatus includes a first holding unit, a second holding unit, and a peeling inducing unit. The first holding unit holds a first substrate of a superimposed substrate in which the first substrate and a second substrate are bonded. The second holding unit holds the second substrate of the superimposed substrate and moves the second substrate in a direction of separating the second substrate from a surface of the first substrate. The peeling inducing unit forms an area where the second substrate starts to be peeled off from the first substrate on a side surface of the superimposed substrate. The second holding unit includes a first suction and moving unit and a second suction and moving unit. The first suction moving unit sucks and moves a circumferential edge portion of the second corresponding to the area formed by the peeling inducing unit, in a direction of separating the circumferential edge portion from the surface of the first substrate.