Abstract: The present invention relates to a laser-welding apparatus and a laser-welding method. The laser-welding apparatus of the present invention includes: a laser output section that emits a laser beam toward a weld part of a welding target member; an optical interferometer that measures a weld penetration depth of the weld part based on interference which occurs due to an optical path difference between a measurement beam and a reference beam, the measurement beam having a frequency length different from that of the laser beam and having been emitted to the weld part while being coaxially overlapped with the laser beam, and reflected by the weld part; and a protection optical member disposed on an optical path between the welding target member and the laser output section while being inclined with respect to a plane perpendicular to an optical axis of the measurement beam.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: Unidirectional light is radiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is radiated onto the bump-formation surface in inclined directions to acquire a second overall image. First bump inspection images are respectively acquired from the first overall image, and second bump inspection images are respectively acquired from the second overall image. Then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Hereby, bump inspection with high precision and efficiency is achieved.

Abstract: In a printing apparatus, individual positional data for positions of four object marks provided on a plurality of FPCs held on a conveyance tray are acquired by a mark position acquisition section based on an image acquired by an image acquisition unit. In a displaced mark specifying section, relative positional relations of four object marks are determined, and compared with a reference positional relation, by which a displaced object mark is specified. Then, in a reference position determining section, a reference position for a plurality of FPCs on a conveyance tray is determined based on a plurality of object marks resulting from excluding the displaced object mark out of the four object marks. Thus, a reference position in execution of printing in a printing unit can be determined with high precision.

Abstract: Unidirectional light is irradiated onto a bump-formation surface of an IC component to acquire a first overall image of the IC component, light is irradiated onto the bump-formation surface in respective inclined directions to acquire a second overall image, first bump inspection images are respectively acquired from the first overall image, second bump inspection images are respectively acquired from the second overall image, then bump-formation positions are inspected based on the second bump inspection images, and degrees of crush of bump vertex portions are inspected based on the respective first bump inspection images. Herewith, bump inspection with high precision and efficiency is achieved.