Patents by Inventor Takayuki Furukoshi
Takayuki Furukoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20040200888Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.Type: ApplicationFiled: December 5, 2003Publication date: October 14, 2004Applicant: Komatsu, Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi
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Patent number: 6789723Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.Type: GrantFiled: September 25, 1998Date of Patent: September 14, 2004Assignee: Komatsu, Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi, Youichi Yasue
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Patent number: 6732909Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.Type: GrantFiled: June 11, 2002Date of Patent: May 11, 2004Assignee: Komatsu, Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi
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Publication number: 20030100831Abstract: Si material, which has been considered to be very brittle, and hard to bend, is heated to at least its brittle-ductile transition temperature. A bending moment is applied to a heated portion of the Si material so that a slip deformation is generated. Whereby it is possible to perform bending, and to greatly improve a degree of freedom for machining the Si material. The Si material has a brittle-ductile transition temperature which transfers from a brittle to a ductile state at its brittle-ductile transition temperature. At the transition temperature or more, the Si material is in a state that a slip can to be generated between its crystals in response to a bending torque applied thereto. Thus, when a bending moment is applied to the heated portion of the Si material which is heated to the transition temperature or more, a slip is generated between lattices or between crystal grains in the heated portion, so that the Si material is deformed.Type: ApplicationFiled: January 10, 2003Publication date: May 29, 2003Applicant: Komatsu, Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi
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Patent number: 6548008Abstract: Si material, which has been considered to be very brittle, and hard to bend, is heated to at least its brittle-ductile transition temperature. A bending moment is applied to a heated portion of the Si material so that a slip deformation is generated. Whereby it is possible to perform bending, and to greatly improve a degree of freedom for machining the Si material. The Si material has a brittle-ductile transition temperature which transfers from a brittle to a ductile state at its brittle-ductile transition temperature. At the transition temperature or more, the Si material is in a state that a slip can to be generated between its crystals in response to a bending torque applied thereto. Thus, when a bending moment is applied to the heated portion of the Si material which is heated to the transition temperature or more, a slip is generated between lattices or between crystal grains in the heated portion, so that the Si material is deformed.Type: GrantFiled: June 1, 1999Date of Patent: April 15, 2003Assignee: Komatsu Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi
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Publication number: 20020185521Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.Type: ApplicationFiled: June 11, 2002Publication date: December 12, 2002Applicant: Komatsu Ltd.Inventors: Kazuya Kuriyama, Takayuki Furukoshi
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Publication number: 20010048020Abstract: A welding process for welding a Cu material to a Ti material includes interposing a tertiary component between the Ti material and the Cu material. The tertiary component is of a type of metal that, with Cu, forms a compound which is liquified at a temperature below the eutectic temperature of Ti and Cu. The above materials are heated and welded at temperature of (700 through 887° C.). The temperature selected is below the eutectic temperature of the Ti and Cu. The finished material forms a sputtering backing plate for a sputtering. A target member, bonded to the Cu material side of the backing plate, completes the sputtering target. In one embodiment, the proportion of the tertiary metal is achieved by controlling a thickness of the tertiary metal deposited on the Cu material. In another embodiment, the proportion of the tertiary metal is achieved by controlling the thickness of a layer of powder of the tertiary material deposited between the Cu and Ti materials.Type: ApplicationFiled: September 25, 1998Publication date: December 6, 2001Inventors: KAZUYA KURIYAMA, TAKAYUKI FURUKOSHI, YOUICHI YASUE
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Patent number: 5825655Abstract: A normal operating condition restoration device which comprises: (a) taught point memory device for storing successive taught points that constitute a work line on which a tool travels in relation to a workpiece and storing taught points for retraction which are among the taught points constituting the work line and to which the tool can be retracted from the workpiece; (b) tool abnormality detecting device for detecting abnormal conditions which have occurred in the tool traveling on the work line relative to the workpiece; and (c) controlling device for performing control.Type: GrantFiled: January 22, 1997Date of Patent: October 20, 1998Assignee: Komatsu Ltd.Inventors: Hitoshi Nakagawa, Toshiaki Kondo, Tetsuya Ogawa, Takayuki Furukoshi