Abstract: A light emitting element includes: a substrate; a mesa portion formed on the substrate and including an active layer, a first semiconductor layer, and a second semiconductor layer; a metal layer including a first metal part disposed on a top surface of the mesa portion and connected to the second semiconductor layer and a second metal part formed integrally with the first metal part and extending along a side surface of the mesa portion; an insulating layer formed on the side surface; and a resin layer formed on the insulating layer. The first metal part includes an opening region formed with a light passage opening and a connection region for external connection. The second metal part is formed on the side surface via the insulating layer and the resin layer and overlaps the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.

Abstract: A light emitting element includes: a substrate; a mesa portion formed on the substrate and including an active layer, a first semiconductor layer, and a second semiconductor layer; a metal layer including a first metal part disposed on a top surface of the mesa portion and connected to the second semiconductor layer and a second metal part formed integrally with the first metal part and extending along a side surface of the mesa portion; an insulating layer formed on the side surface; and a resin layer formed on the insulating layer. The first metal part includes an opening region formed with a light passage opening and a connection region for external connection. The second metal part is formed on the side surface via the insulating layer and the resin layer and overlaps the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.

Abstract: A light emitting element includes: a substrate; a mesa portion formed on the substrate and including an active layer, a first semiconductor layer, and a second semiconductor layer; a metal layer including a first metal part disposed on a top surface of the mesa portion and connected to the second semiconductor layer and a second metal part formed integrally with the first metal part and extending along a side surface of the mesa portion; an insulating layer formed on the side surface; and a resin layer formed on the insulating layer. The first metal part includes an opening region formed with a light passage opening and a connection region for external connection. The second metal part is formed on the side surface via the insulating layer and the resin layer and overlaps the active layer when viewed in a direction perpendicular to a thickness direction of the substrate.

Abstract: The present invention provides a vehicle component conveyance apparatus and a vehicle component conveyance method with which it is possible to easily convey an assembly component while maintaining a posture thereof. A conveyance apparatus 10 conveys an assembly component temporarily assembled by bonding, with an uncured adhesive, contact portions of base parts 101 and 102, side parts 103 and 104, a rear part 105, and an upper part 106. The conveyance apparatus 10 includes a temporary assembly jig 20 and a conveyance means 40. The temporary assembly jig 20 has a base 21, base-part support portions 23 and 25, side-part support portions 27, and a rear-part support portion 29. The side-part support portions 27 each have a pressing portion 31 that presses the pair of side parts 103 and 104 from outside toward inside in a vehicle width direction.

Abstract: Provided are a cleaning method and a device for a coating nozzle with which it is possible to cleanly remove a coating agent that has become attached to the coating nozzle. The cleaning device for a coating nozzle cleans the tip of a translatable coating nozzle. The cleaning device for the coating nozzle is provided with a cleaning pad having grooves configured to sandwich the coating nozzle. The grooves comprise first grooves extending in a first direction, and second grooves extending in a second direction facing a direction substantially at right angle to the first direction.

Abstract: The objective of the present invention is to simultaneously achieve image observations at a high resolution using an electron microscope, and X-ray analysis at a high energy-resolution using a microcalorimeter. An X-ray detector is disposed at a position where the intensity of the magnetic field from an objective lens is weaker than the critical magnetic field of a material used in a thermal insulation shield for a superconducting transition-edge sensor or a microcalorimeter. In addition, an optical system for transmitting X-rays to the detector is inserted between a sample and the detector. Alternatively, a magnetic field shield for shielding the X-ray detector is used.

Abstract: The objective of the present invention is to simultaneously achieve image observations at a high resolution using an electron microscope, and X-ray analysis at a high energy-resolution using a microcalorimeter. An X-ray detector is disposed at a position where the intensity of the magnetic field from an objective lens is weaker than the critical magnetic field of a material used in a thermal insulation shield for a superconducting transition-edge sensor or a microcalorimeter. In addition, an optical system for transmitting X-rays to the detector is inserted between a sample and the detector. Alternatively, a magnetic field shield for shielding the X-ray detector is used.

Abstract: There is provided a manufacturing method for a composite structure that makes it possible to join a thermoplastic resin molding, which serves as a second member for reinforcement, while at the same time preventing the deformation of a first member to be reinforced. The second member contains magnetic substances in a portion thereof that is to be abutted on the first member. The second member is introduced into an induction heating unit and subjected to induction heating, thereby heating the abutting portion of the second member to join the second member to the first member.

Abstract: An image capturing apparatus having a camera shake correction function, includes an optical system, a movable member that is movable on a plane perpendicular to an optical axis of the optical system to achieve the camera shake correction function, an angular velocity detector configured to detect an angular velocity of shake of the image capturing apparatus and generate a detection signal, and a controller configured to drive the movable member based on the output from the angular velocity detector. The controller includes a time change rate limiter configured to limit a time rate of change of angular velocity indicated by the detection signal output from the angular velocity detector to be no greater than a predetermined limiting value, and drive the movable member based on the detection signal output through the time change rate limiter.

Abstract: There is provided a manufacturing method for a composite structure that makes it possible to join a thermoplastic resin molding, which serves as a second member for reinforcement, while at the same time preventing the deformation of a first member to be reinforced. The second member contains magnetic substances in a portion thereof that is to be abutted on the first member. The second member is introduced into an induction heating unit and subjected to induction heating, thereby heating the abutting portion of the second member to join the second member to the first member.

Abstract: Provided is a driving device having an electromechanical transducer, a driving member, a moving member and a driving circuit. The driving circuit outputs a driving voltage at a frequency lower than that where the driving speed of the moving member is at maximum, and changes the drive frequency of the driving voltage so that the drive frequency has a negative correlative relationship with the ambient temperature. The change rate of the drive frequency to a change of the ambient temperature in the negative correlative relationship is larger than a change rate of a frequency where the driving speed of the moving member is at maximum to an increase of the ambient temperature, and the change rate permits the driving speed of the moving member to increase when the ambient temperature increases.

Abstract: An imaging apparatus includes a composite low frequency cutoff filter. The composite low frequency cutoff filter includes a first low frequency cutoff filter, a second low frequency cutoff filter, and an adder-subtractor. The second low frequency cutoff filter receives an output of the first low frequency cutoff filter. The adder-subtractor subtracts an output of the second low frequency cutoff filter from an input to the composite low frequency cutoff filter, and outputs a result of the subtraction to the first low frequency cutoff filter. An output of the first low frequency cutoff filter is outputted as an output of the composite low frequency cutoff filter.

Abstract: A composite structural member made of a plate and a thermoplastic resin reinforcing member is manufactured by: continuously supplying the reinforcing member; cutting the reinforcing member; heating the reinforcing member; and pressing the heated reinforcing member to the plate.

Abstract: A position detector (3) capable of obtaining an output having a linearity in a wide range includes: a magnetic field generating member (11) attached to a movable member (10) movable in a predetermined movable direction (x); and magnetic field detection means (12) for detecting a magnetic field change caused by movement of the magnetic field generating member (11). The magnetic field generating member (11) includes an N-pole portion (13) magnetized into N-pole, an S-pole portion (14) magnetized into S-pole arranged in the movable direction with the N-pole portion (13), and a non-magnetized portion (15) not magnetized between the N-pole portion (13) and the S-pole portion (14).

Abstract: A position detector (3) capable of obtaining an output having a linearity in a wide range includes: a magnetic field generating member (11) attached to a movable member (10) movable in a predetermined movable direction (x); and magnetic field detection means (12) for detecting a magnetic field change caused by movement of the magnetic field generating member (11). The magnetic field generating member (11) includes an N-pole portion (13) magnetized into N-pole, an S-pole portion (14) magnetized into S-pole arranged in the movable direction with the N-pole portion (13), and a non-magnetized portion (15) not magnetized between the N-pole portion (13) and the S-pole portion (14).

Abstract: An optical pickup device such that the driving force of the drive unit provided on the same optical base as that of the objective lens exerts no adverse influence on controlling of the objective lens is provided. The optical pickup device 1 has an objective lens 11 that condenses laser light onto an optical disk 3, a first drive mechanism 15 that moves the objective lens 11 on the optical base 6, a second drive mechanism 8 that moves a movable member 9 different from the objective lens 11 on the optical base 6, first control means 27 that outputs a first driving signal TDS to operate the first drive mechanism 15, and second control means 25 that outputs a second driving signal EDS to operate the second drive mechanism 8. A derivative value of the second driving signal EDS is added to the first driving signal TDS and inputted to the first drive mechanism 15.

Abstract: Provided is a driving device having an electromechanical transducer, a driving member, a moving member and a driving circuit. The driving circuit outputs a driving voltage at a frequency lower than that where the driving speed of the moving member is at maximum, and changes the drive frequency of the driving voltage so that the drive frequency has a negative correlative relationship with the ambient ten aperature. The change rate of the drive frequency to a change of the ambient temperature in the negative correlative relationship is larger than a change rate of a frequency where the driving speed of the moving member is at maximum to an increase of the ambient temperature, and the change rate permits the driving speed of the moving member to increase when the ambient temperature increases.

Abstract: An imaging apparatus includes a composite low frequency cutoff filter. The composite low frequency cutoff filter includes a first low frequency cutoff filter, a second low frequency cutoff filter, and an adder-subtractor. The second low frequency cutoff filter receives an output of the first low frequency cutoff filter. The adder-subtractor subtracts an output of the second low frequency cutoff filter from an input to the composite low frequency cutoff filter, and outputs a result of the subtraction to the first low frequency cutoff filter. An output of the first low frequency cutoff filter is outputted as an output of the composite low frequency cutoff filter.

Abstract: The present invention may provide a accurate drive unit 1 which comprises an electromechanical transducer 10, a drive element 12 fixed on the one end of the electromechanical transducer 10, a movable element 11 engaging with the drive element 12 frictionally and a drive circuit 3 applying a cyclic drive voltage to the electromechanical transducer 10, in which the oscillation of the drive element 12 as the result of the expansion and contraction of the electromechanical transducer 10 due to the drive voltage causes relative displacement of the movable element 11 to the drive element 12. The waveform of drive voltage is varied according to the relative position of the movable element 11 to the drive element 12.

Abstract: A semiconductor device having a first semiconductor chip with an SDRAM and a second semiconductor chip with a an MPU controlling the SDRAM. The contour size of the semiconductor device is reduced to a smaller size without impairing the testability of the first semiconductor chip. The two semiconductor chips are stacked over the top surface of an interconnect substrate and sealed in a molding resin, thus forming an SiP (System-in-Package). First terminals electrically connected with the second chip are arranged as external terminals of the SiP on the outer periphery of the bottom surface of the interconnect substrate. Plural second electrodes electrically connected with interconnects, which electrically connect the two chips, are mounted as terminals for testing of the SDRAM. The second electrodes are located more inwardly than the innermost row of the first external electrodes on the bottom surface of the interconnect substrate.