Patents by Inventor Takayuki Iiyama

Takayuki Iiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire cutting and feeding device for use in wire bonding apparatus
    Patent number: 6089439
    Abstract: In a wire cutting and feeding device used in a wire bonding apparatus, piezo-electric actuators are used as the driving source of a slide block which moves wire clamper toward and away from a workpiece upon which bonding is performed. The piezo-electric actuators include a feeding piezo-electric actuator, which causes expansion and contraction of the slide block, and two clamping piezo-electric actuators, which are alternately operated and clamp the slide block. The slide block is caused to move by means of respective power-"on"/power-"off" combinations of the feeding piezo-electric actuator and the two clamping piezo-electric actuators.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: July 18, 2000
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Nobuto Yamazaki, Minoru Torihata, Takayuki Iiyama
  • Clamping device
    Patent number: 5746422
    Abstract: A clamping device used in, for instance, a bonding machine, using a piezo-electric element for opening and closing a pair of clamping claws for holding, for instance, bonding wires in between. The clamping device includes a pressure adjustment screw which applies a preparatory pressure to the piezo-electric element via a contact plate, and the contact plate is connected, via flexible sections which are capable of expansion and contraction, to a screw attachment with which the pressure adjustment screw is screw-engaged.
    Type: Grant
    Filed: September 12, 1996
    Date of Patent: May 5, 1998
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Koichi Harada, Minoru Torihata, Takayuki Iiyama
  • Wire clampers
    Patent number: 5435477
    Abstract: A wire clamper used in a wire bonding apparatus including a pair of open/close clamping arms and a pair of clamping elements provided at terminal ends of the clamping arms so as to clamp a bonding wire in between, and at least one of the clamper arms is opened and closed by the electric strain or magnetic strain effect of a piezoelectric element. In addition, a clamping load adjustment screw is installed at the root end of the wire clamper so that it can set an initial clamping load of the clamping elements.
    Type: Grant
    Filed: February 2, 1994
    Date of Patent: July 25, 1995
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Minoru Torihata, Takayuki Iiyama
  • Wire clamper
    Patent number: 5323948
    Abstract: A pair of clamping arms of a wire clamper used in a wire bonding apparatus being opened and closed via the electric strain effect or magnetic strain effect of a piezoelectric element. With the use of a piezoelectric element that expands when energized to open the clamping arms so as to release the wire held by the clamping arms, the overall weight of the wire clamper can be small, a quick clamping action is secured and the clamping force which is easily adjustable can be steady at a set value.
    Type: Grant
    Filed: March 12, 1993
    Date of Patent: June 28, 1994
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Nobuto Yamazaki, Koichi Harada, Minoru Torihata, Mitsuaki Sakakura, Takayuki Iiyama