Abstract: A control device for controlling an engine includes main-chamber injecting means (1,3) that supplies a main chamber (8) with fuel; sub-chamber injecting means (2) that supplies a sub chamber (5) with fuel after the main chamber injecting means (1,3) supplies the fuel; estimating means (21) that estimates a degree of knocking serving as indices of an intensity of the knocking and an occurrence frequency of the knocking; and fuel controlling means (22) that carries out, when the degree (N) of the knocking is a first predetermined value (N1) or more, fuel control that reduces a sub-chamber fuel amount representing an amount of fuel supplied by the sub-chamber injecting means (2). By reducing the sub-chamber fuel amount in this manner, the occurrence of knocking can be suppressed, so that the combustion state of a divided-combustion-chamber engine can be enhanced.

Abstract: A memory die includes dielectric isolation rails embedded within a substrate semiconductor layer, laterally spaced apart along a first horizontal direction, and each laterally extending along a second horizontal direction that is perpendicular to the first horizontal direction, and alternating stacks of insulating layers and electrically conductive layers located over the substrate semiconductor layer. The alternating stacks are laterally spaced apart along the second horizontal direction by line trenches that laterally extend along the first horizontal direction. Arrays of memory stack structures are provided such that each array of memory stack structures among the arrays of memory stack structures vertically extends through a respective alternating stack. Each of the memory stack structures includes a respective vertical stack of memory elements and a respective vertical semiconductor channel.

Abstract: A transportation apparatus includes an external detection device configured to detect an object. The external detection device includes: an irradiation surface; and an adjustment portion for adjusting an angle of the irradiation surface, the adjustment portion is adjustable from a hole portion provided in the transportation apparatus, and the hole portion is offset with respect to the adjustment portion and the irradiation surface.

Abstract: A transportation apparatus includes an external detection device configured to detect an object. The external detection device is disposed further on an inner side than an outer surface of the transportation apparatus, on the outer surface, a lid member is attached to be removable and cover an irradiation surface when viewed from a perpendicular direction perpendicular to the irradiation surface of the external detection device, the lid member is formed so as to be removable from an abutment portion provided on the outer surface by being pressed from an inside, the outer surface is provided with an opening portion disposed close to the abutment portion, and the lid member is disposed so as to be pressable from the inside through the opening portion.

Abstract: A transportation apparatus includes an external detection device configured to detect an object. The external detection device includes: an irradiation surface; and an adjustment portion for adjusting an angle of the irradiation surface, the adjustment portion is adjustable from a hole portion provided in the transportation apparatus, and the hole portion is offset with respect to the adjustment portion and the irradiation surface.

Abstract: A transportation apparatus includes an external detection device configured to detect an object. The external detection device is disposed further on an inner side than an outer surface of the transportation apparatus, on the outer surface, a lid member is attached to be removable and cover an irradiation surface when viewed from a perpendicular direction perpendicular to the irradiation surface of the external detection device, the lid member is formed so as to be removable from an abutment portion provided on the outer surface by being pressed from an inside, the outer surface is provided with an opening portion disposed close to the abutment portion, and the lid member is disposed so as to be pressable from the inside through the opening portion.

Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: setting a bi-directionally Y-shape branched line pattern within a rectangular to-be-bonded area, which is formed of two Y-shaped intersections of a center line and angle bisector lines of the corners, of the to-be-bonded area; and applying adhesive resin onto the protector sheet or onto the display panel by forming circular or ellipsoidal dot patterns of applied adhesive resin so that: the dot patterns are arranged on the center-line segment and on the branch lines or their vicinities; and the dot patterns are arranged in symmetry with respect to the center line and to its perpendicular bisector.

Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: applying of adhesive resin onto the transparent protector sheet or the display panel to form dot patterns of applied adhesive resin; seizing the protector sheet and the display panel on upper and lower chucking parts; colliding of undermost tip of the applied resin onto the panel or the protector sheet at an approaching rate no more than a predetermined rate, preferably in a range of 0.01-0.5 mm/sec; and squeezing of the layer by moving the upper or lower chucking part at a rate no less than three times of the approaching rate at a time of the colliding, preferably in a range of 1-10 mm/sec.

Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: applying of adhesive resin onto the transparent protector sheet or the display panel to form dot patterns of applied adhesive resin; seizing the protector sheet and the display panel on upper and lower chucking parts; colliding of undermost tip of the applied resin onto the panel or the protector sheet at an approaching rate no more than a predetermined rate, preferably in a range of 0.01-0.5 mm/sec; and squeezing of the layer by moving the upper or lower chucking part at a rate no less than three times of the approaching rate at a time of the colliding, preferably in a range of 1-10 mm/sec.

Abstract: An embodiment of manufacturing method of a flat-panel display device having a display panel and a transparent protector sheet; comprises: setting a bi-directionally Y-shape branched line pattern within a rectangular to-be-bonded area, which is formed of two Y-shaped intersections of a center line and angle bisector lines of the corners, of the to-be-bonded area; and applying adhesive resin onto the protector sheet or onto the display panel by forming circular or ellipsoidal dot patterns of applied adhesive resin so that: the dot patterns are arranged on the center-line segment and on the branch lines or their vicinities; and the dot patterns are arranged in symmetry with respect to the center line and to its perpendicular bisector.

Abstract: A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.

Abstract: A method for manufacturing electronic, electric or other products such as flat-panel display devices, for coping with change of product size and for curbing damage on the products and dust generation by smaller cost of packaging, according to one embodiment, comprising; sequentially placing first products as to be sandwiched by a resin-sheet band and as to be arrayed in a row while forming joined areas as to form receptacles respectively for the first products, thus forming a band-shaped package; winding the band-shaped package around a shock-absorbent core and placing them into an inner box as non-displaceable; placing the inner box in an outer box as to be supported from inner face of the outer box through partitions or spacers; and then transporting or storing in such a state while keeping the resin-sheet face as substantially vertical, as to be used for producing second products.

Abstract: A method for manufacturing electronic, electric or other products such as flat-panel display devices, for coping with change of product size and for curbing damage on the products and dust generation by smaller cost of packaging, according to one embodiment, comprising; sequentially placing first products as to be sandwiched by a resin-sheet band and as to be arrayed in a row while forming joined areas as to form receptacles respectively for the first products, thus forming a band-shaped package; winding the band-shaped package around a shock-absorbent core and placing them into an inner box as non-displaceable; placing the inner box in an outer box as to be supported from inner face of the outer box through partitions or spacers; and then transporting or storing in such a state while keeping the resin-sheet face as substantially vertical, as to be used for producing second products.

Abstract: A method for manufacturing electronic or electric products such as flat-panel display devices, for coping with change or variations of dimensions of the products and for curbing damage or fracture on the products and reducing recovery cost for containers, according to one embodiment, comprising; sequentially placing first flat electronic or electric products as to be sandwiched by a resin-sheet band formed of one or pair of band-shaped flat resin sheet and as to be arrayed in a row; forming joined areas by bonding faces of the resin-sheet band as to form receptacles respectively for the first flat electronic or electric products; thus forming a band-shaped package; and then transporting or storing such array of the first flat electronic or electric products in the band-shaped package as to be used for producing second electronic or electric products.

Abstract: Signal charges generated by a plurality of photoelectric conversion elements are transferred to first and second horizontal charge transfer registers via corresponding vertical charge transfer registers. The first and second horizontal charge transfer registers transfer the signal charges to first and second output portions, respectively. The first and second output portions convert the signal charges into voltages. The first and second output portions respectively include first and second signal charge detectors, first and second transistors each having a source, a drain, and a gate, and first and second charge sweeping regions, each having a charge sweeping control gate and a charge sweeping drain.

Abstract: Signal charges generated by a plurality of photoelectric conversion elements are transferred to first and second horizontal charge transfer registers via corresponding vertical charge transfer registers. The first and second horizontal charge transfer registers transfer the signal charges to first and second output portions, respectively. The first and second output portions convert the signal charges into voltages. The first and second output portions respectively include first and second signal charge detectors, first and second transistors each having a source, a drain, and a gate, and first and second charge sweeping regions, each having a charge sweeping control gate and a charge sweeping drain.

Abstract: A method of post-processing a solid-state imaging device including a wafer processing step 1 (S1), an assembly step 2 (S2) in which packaging is performed, an inspection step 3 (S3), and an annealing step (S4) in which a solid-state having gone through the inspection step 3 is annealed at a predetermined temperature. The method makes it possible to reduce the level of an image defect that occurs after assembly.

Abstract: An optical device for varying magnification, having an object plane on which an object is to be located, a light receiving surface, and an imaging lens unit for focusing an image of the object located on the object plane onto the light receiving surface, so that upon varying the magnification, an optical distance between the object plane and the light receiving surface can be changed, wherein the imaging lens unit includes a main lens group and a correcting lens group that are movable relative to each other, the main lens group or the correcting lens group being fixed with respect to the light receiving surface, the correcting lens group or the main lens group being movable to the object plane and the light receiving surface to vary the magification.