Patents by Inventor Takayuki IKEYA

Takayuki IKEYA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220318983
    Abstract: According to one embodiment, a grain size estimation device includes an acquisition unit that acquires a captured image of a surface segment of an object inducing metal; and an estimation unit that estimates a grain size of the surface segment of the object indicated in the acquired image, based on a predictive model generated by machine learning using images of metal surfaces and grain sizes in the metal surfaces as training data.
    Type: Application
    Filed: September 18, 2020
    Publication date: October 6, 2022
    Applicants: Kabushiki Kaisha Toshiba, Toshiba Digital Solutions Corporation
    Inventors: Kota FUKUYAMA, Hisanori HATA, Takayuki IKEYA
  • Publication number: 20220009134
    Abstract: A method of producing a hard coating layer-laminated mold resin comprising a transfer material preparation step, a resin preparation step, a disposition step, and a transfer step. In the transfer material preparation step, a transfer material including a substrate sheet and a protective layer is prepared. The protective layer includes a cured and/or half-cured product of an active energy ray-curable resin and has a thermally reactive group and a polysiloxane chain. In the resin preparation step, mold resin in a thermally uncured and/or half-cured state is prepared. In the disposition step, the transfer material is disposed so that the protective layer is exposed. In the transfer step, the mold resin and the protective layer are brought into contact and heated to chemically bond them, and the mold layer is cured, and the protective layer is cured to form the hard coating layer.
    Type: Application
    Filed: November 26, 2019
    Publication date: January 13, 2022
    Applicants: Harima Chemicals, Incorporated, Hamamatsu Photonics K.K.
    Inventors: Ryouichi NAKAI, Yutaka KITAJIMA, Hisaya SUGIURA, Takayuki IKEYA