Abstract: Behind an electronic circuit, a thermally anisotropic main backing is provided. The main backing has two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. In a first gap located adjacent to one of the outer surfaces, an FPC and a first group of electric components are arranged. In a second gap located adjacent to the other one of the outer surfaces, the FPC and a second group of electric components are arranged.

Abstract: Behind an electronic circuit, an auxiliary backing having a first thermal anisotropic property is provided. A main backing having a second thermal anisotropic property different from the first thermal anisotropic property is provided behind the auxiliary backing. In the main backing, each of two outer surfaces perpendicular to a Y direction functions as a heat output surface. Heat is transferred from these two outer surfaces to a shell, which is a heat absorbing member.

Abstract: Behind an electronic circuit, a backing member is provided. The backing member is composed of an auxiliary backing having a first thermal anisotropic property, and a main backing having a second thermal anisotropic property different from the first thermal anisotropic property. The auxiliary backing exhibits a heat diffusion effect in an X direction. The main backing exhibits a heat transfer effect in a Y direction.

Abstract: Behind an electronic circuit, a main backing is provided. The main backing has two outer surfaces (high thermal conductivity surfaces) perpendicular to a Y direction, and two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. The two outer surfaces perpendicular to the Y direction are joined to a shell head, which is a heat absorbing member. A temperature sensor is provided on a specific one of the outer surfaces perpendicular to the Y direction. The shell head has a recess in which the temperature sensor is received.

Abstract: A first beam scanning plane and a second beam scanning plane are formed alternately. For formation of the first beam scanning plane, transmission/reception control is performed so that the beam deflection angle increases continuously toward the negative side from a first end to a second end in the electronic scanning direction. For formation of the second beam scanning plane, transmission/reception control is performed so that the beam deflection angle increases continuously toward the positive side from the second end to the first end in the electronic scanning direction.

Abstract: An image having high resolution in the short axis direction is obtained with a simple configuration. A first transmit aperture, and a second transmit aperture whose aperture size in the short axis direction is larger than the first transmit aperture, are sequentially set in a probe where transducers are arranged in each of the long axis direction and the short axis direction, and the first transmission beam and the second transmission beam are transmitted therefrom respectively. These transmissions generate the first received beam signal and the second received beam signal which are weighted in the depth direction and synthesized. In the first region with a shallow depth, the weight of the first received beam signal is increased, whereas in the second region deeper than the first region, the weight of the second received beam signal is increased.

Abstract: Provided is a probe which transmits an ultrasonic wave to a diagnostic site and receives a reception signal which is a reflected wave.

Abstract: Provided is a probe which transmits an ultrasonic wave to a diagnostic site and receives a reception signal which is a reflected wave.

Abstract: Provided is a probe which transmits an ultrasonic wave to a diagnostic site and receives a reception signal which is a reflected wave.

Abstract: A backing 20 includes a lead array 24a that electrically connects each vibration element 12 and a plurality of ICs 32. Each bump 42 provided at a lower end portion of each lead 24 is connected to a conductor pad on an upper side surface of a relay substrate 26, and a ball-shaped terminal 44 of each IC 32 is connected to a lower surface of the relay substrate 26. The lower end portions of the leads 24 are grouped into a plurality of dense groups 46 corresponding to each IC 32 in a longitudinal direction (X-axis direction) by wiring patterns of the leads.

Abstract: A second stacked product is configured with a flexible wiring sheet, and a stacked-element array supported by the flexible wiring sheet. To a biological-body side of the stacked-element array, a ground film is bonded, whereby a structurally reinforced third stacked product is produced. Then, the third stacked product is bent, whereby a curved stacked product is produced. In the bending procedure, in the ground film, a plurality of extension parts arranged along the ? direction are automatically formed.

Abstract: Provided is a probe which transmits an ultrasonic wave to a diagnostic site and receives a reception signal which is a reflected wave.

Abstract: Provided is a probe which transmits an ultrasonic wave to a diagnostic site and receives a reception signal which is a reflected wave.