Abstract: Problem: The invention provides a polyimide precursor as well as a resin composition thereof that is excellent in coating properties of slit coating as well as productivity and also excellent in optical properties that are required for applications of flexible substrates. Solution: The polyimide precursor comprises a structure unit derived from a fluorene backbone and a silicon-containing structure unit, and a weight-average molecular weight of the polyimide precursor is 90,000 to 250,000.

Abstract: This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

Abstract: Problem: The invention provides a polyimide precursor as well as a resin composition thereof that is excellent in coating properties of slit coating as well as productivity and also excellent in optical properties that are required for applications of flexible substrates. Solution: The polyimide precursor comprises a structure unit derived from a fluorene backbone and a silicon-containing structure unit, and a weight-average molecular weight of the polyimide precursor is 90,000 to 250,000.

Abstract: A solvent for a resin composition that includes a polyimide precursor having a structure unit derived from polyamic acid and a structure unit derived from siloxane having a monovalent aliphatic hydrocarbon group of 1 to 5 carbon atoms or a monovalent aromatic group of 6 to 10 carbon atoms. The solvent is a mixture of an amide-based solvent and a non-amide-based solvent having a boiling point of 160° C. or higher, and the resin composition includes cyclic siloxane.

Abstract: This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

Abstract: Provided is a resin composition including a polyimide precursor that has exceptional adhesiveness to glass substrates and that does not generate particles during laser detachment. A resin composition containing (a) a polyimide precursor, (b) an organic solvent, and (d) an alkoxysilane compound, wherein the resin composition shows polyimide obtained by imidation of the (a) polyimide precursor after application of the resin composition to the surface of a support, the residual stress with the support is from ?5 MPa to 10 MPa, and the 308 nm absorbance of the (d) alkoxysilane compound when made into a 0.001 mass % NMP solution is from 0.1 to 0.5 at a solution thickness of 1 cm.

Abstract: A photosensitive resin composition comprising parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more armatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.

Abstract: A polyamide having a structure represented by the chemical formula (1): wherein m and n represent an integer satisfying m?1, n?1, 2?(m+n)?150, 0.3?m/(m+n)?0.9, R1 and R2 represent at least one monovalent organic group containing a photopolymerizable unsaturated bond, X1 represents at least one tetravalent aromatic group, X2 represents at least one trivalent aromatic group, Y1 and Y2 represent at least one divalent organic group, and Z represents at least one monovalent organic group selected from mono-substituted amino and imido groups.

Abstract: Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group).

Abstract: A polyamide having a structure represented by the chemical formula (1): wherein m and n represent an integer satisfying m?1, n?1, 2?(m+n)?150, 0.3?m/(m+n)?0.9, R1 and R2 represent at least one monovalent organic group containing a photopolymerizable unsaturated bond, X1 represents at least one tetravalent aromatic group, X2 represents at least one trivalent aromatic group, Y1 and Y2 represent at least one divalent organic group, and Z represents at least one monovalent organic group selected from mono-substituted amino and imido groups.

Abstract: Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group.