Abstract: A fixing device (1) according to a present invention includes a pressing tool (10) that abuts a part of a peripheral portion of a panel that is arranged on an upper surface portion of a hollow rod-like rack member (200) that has on the upper surface portion a slit-like opening portion extending along a longitudinal direction, a fixing tool (20) that abuts a back surface of the upper surface portion, the fixing tool configured insertable to the opening portion, and having in one direction a width wider than a width in a direction orthogonal to a longitudinal direction of the opening portion, and a fastening member (30) that integrally fixes the pressing tool (10) and the fixing tool (20) that abut a part of the peripheral portion of the panel and the back surface of the upper surface portion of the rack member (200), respectively.

Abstract: A fixing device (1) according to a present invention includes a pressing tool (10) that abuts a part of a peripheral portion of a panel that is arranged on an upper surface portion of a hollow rod-like rack member (200) that has on the upper surface portion a slit-like opening portion extending along a longitudinal direction, a fixing tool (20) that abuts a back surface of the upper surface portion, the fixing tool configured insertable to the opening portion, and having in one direction a width wider than a width in a direction orthogonal to a longitudinal direction of the opening portion, and a fastening member (30) that integrally fixes the pressing tool (10) and the fixing tool (20) that abut a part of the peripheral portion of the panel and the back surface of the upper surface portion of the rack member (200), respectively,

Abstract: Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.

Abstract: Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.

Abstract: Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.

Abstract: Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.

Abstract: Method and apparatus for bonding a polarizing plate high in operating efficiency and yield. The apparatus includes a cutting unit for cutting at least a polarizing plate of a strip-shaped film, composed of the polarizing plate and a release film bonded to the polarizing plate, leaving the release film uncut, when a forward end side pre-severed end face of the strip-shaped film perpendicular to the longitudinal direction of the strip-shaped film has traveled up to a length corresponding to a length of a substrate, to form a film piece, a release film separating unit for separating the release film from the film piece thus severed, and a bonding unit for bonding the tacky surface of the film piece freed of the release film to a mating position of the substrate so that the forward end side end face of the transported substrate is parallel to the pre-severed end face of the film piece.