Abstract: A head-up display includes a light source, a liquid crystal panel configured to transmit light from the light source and project an image, and a prism sheet configured to refract the light transmitted through the liquid crystal panel. The prism sheet includes a sheet surface parallel to a plate surface of the liquid crystal panel, and a plurality of prisms facing the plate surface of the liquid crystal panel on a side opposite to the sheet surface and arranged in parallel, the prisms are each formed in an angular shape in cross-section by a first prism surface and a second prism surface, the first prism surface being inclined with respect to the sheet surface, the second prism surface being inclined with respect to the sheet surface and making a larger angle with the sheet surface than the first prism surface, and an angle between the first prism surface and the sheet surface is 35° or larger.

Abstract: A semiconductor device with a large storage capacity per unit area is provided. A semiconductor device includes a memory cell. The memory cell includes a first conductor; a first insulator over the first conductor; a first oxide over the first insulator and including a first region, a second region, and a third region positioned between the first region and the second region; a second insulator over the first oxide; a second conductor over the second insulator; a third insulator positioned in contact with a side surface of the first region; and a second oxide positioned on the side surface of the first region, with the third insulator therebetween. The first region includes a region overlapping the first conductor. The third region includes a region overlapped by the second conductor. The first region and the second region have a lower resistance than the third region.

Abstract: According to an aspect, a head-up display includes: a light source; a liquid crystal panel that is configured to transmit light emitted from the light source and projects an image; and a prism sheet that is tilted with respect to a plate surface of the liquid crystal panel and configured to refract light transmitted through the liquid crystal panel.

Abstract: A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 ?m or more and 150 ?m or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

Abstract: A friction stir welding tool member according to the present embodiment has a shoulder portion and a probe portion concentrically projecting from an upper surface of the shoulder portion. The shoulder portion includes a curved surface processed portion that is curved to have a curved shape on an outer peripheral edge of the shoulder portion. A space occupancy occupied by the two-dimensional space in which neither the shoulder portion nor the probe portion exists is in a range of 30% to 70%, the space occupancy being determined based on a projection drawing of a side surface region surrounded from a tip of the probe portion to the curved surface processed portion of the shoulder portion.

Abstract: According to an aspect, a pressure bonding device is configured to bond, to a plate-like first workpiece having a curved surface part, a plurality of plate-like second workpieces smaller than the first workpiece. The pressure bonding device includes: a vacuum chamber; a stage disposed in the vacuum chamber and having a shape extending along a first surface of the curved surface part of the first workpiece so as to fix the first surface on the stage; and a bonding unit configured to deform an elastic diaphragm by internal pressure and pressure-bond one of the second workpieces to a second surface of the first workpiece. A plurality of the bonding units are disposed facing the stage.

Abstract: A packaged solid-state battery that includes a solid-state battery having a top surface, a bottom surface, and side surfaces connecting the top surface to the bottom surface; a supporting substrate supporting the bottom surface of the solid-state battery; an insulating cover layer covering at least the top surface and the side surfaces of the solid-state battery; and an inorganic cover film on the insulating cover layer.

Abstract: A semiconductor storage device includes: a first conductive layer extending in a first direction; a second conductive layer that is disposed apart from the first conductive layer in a second direction intersecting the first direction, and extends in the first direction; a plurality of semiconductor layers provided between the first conductive layer and the second conductive layer and arranged in the first direction, each of which includes a first portion facing the first conductive layer, and a second portion facing the second conductive layer; a plurality of first memory cells provided between the first conductive layer and the semiconductor layers, respectively; and a plurality of second memory cells provided between the second conductive layer and the semiconductor layers, respectively. A gap is provided between the two semiconductor layers adjacent in the first direction.

Abstract: The present invention provides a graphene grid that can suppress or prevent uneven distribution, uneven orientation, and the like of a structural analysis target substance, and can capture the structural analysis target substance with high efficiency and analyze the structural analysis target substance with high resolution, in a structural analysis by cryo-electron microscopy. A graphene grid of the present invention has a graphene surface into which a functional group is introduced.

Abstract: An electric compressor includes a compression member configured to compress fluid, an electric motor configured to drive the compression member, an inverter configured to drive the electric motor, a housing accommodating the compression member, the electric motor, and the inverter, and a soundproof cover covering the housing. The housing includes a plurality of housing elements. The soundproof cover has a facing portion facing the housing. The facing portion has a groove that surrounds a boundary between two of the housing elements that are adjacent to each other and is distant from the boundary.

Abstract: A wire harness manufacturing system including a plurality of processing zones and configured to manufacture a wire harness by using a subassembly including a plurality of electrical lines to each of which a connection component is attached includes a conveyance device provided along the plurality of processing zones and including: work boards in a number at least corresponding to the number of the plurality of processing zones; a circulation conveyer configured to sequentially convey each work board in a horizontal state from an upstream side to a downstream side on a downstream conveyance path along the plurality of processing zones and then return the work board from the downstream side to the upstream side on an upstream conveyance path; and a raiser configured to set the work board to a stand-up state in which one of edge parts extending in a conveyance direction of the work board is positioned on an upper side of the other edge part in the work board, and to set the work board in the stand-up state to th

Abstract: An electric compressor includes a compression part configured to compress fluid, an electric motor configured to drive the compression part, a housing accommodating the compression part and the electric motor, a soundproof cover covering the housing, and a nameplate attached to the housing and including a predetermined information. The housing includes a protrusion that is a part of the housing and protrudes out of the soundproof cover through a hole formed in the soundproof cover. The nameplate is provided on the protrusion.

Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.

Abstract: According to an aspect, a pressure bonding device is configured to bond, to a plate-like first workpiece having a curved surface part, a plurality of plate-like second workpieces smaller than the first workpiece. The pressure bonding device includes: a vacuum chamber; a stage disposed in the vacuum chamber and having a shape extending along a first surface of the curved surface part of the first workpiece so as to fix the first surface on the stage; and a bonding unit configured to deform an elastic diaphragm by internal pressure and pressure-bond one of the second workpieces to a second surface of the first workpiece. A plurality of the bonding units are disposed facing the stage.

Abstract: A vehicle controller includes: a vehicle control unit configured to control a vehicle by executing a vehicle starting program for starting the vehicle; a storage unit including a rewrite limited area where the vehicle starting program is stored and rewrite is limited and a rewrite possible area where the vehicle starting program is rewritably stored; a communication unit configured to communicate with an external device; and a program update unit configured to execute update processing of storing a vehicle starting update program received by the communication unit and utilized for updating the vehicle starting program in the rewrite possible area, in which the vehicle control unit executes the vehicle starting program stored in the rewrite possible area and executes the vehicle starting program stored in the rewrite limited area when the update processing by the program update unit is not normally completed.

Abstract: A semiconductor device with a large storage capacity per unit area is provided. A semiconductor device includes a memory cell. The memory cell includes a first conductor; a first insulator over the first conductor; a first oxide over the first insulator and including a first region, a second region, and a third region positioned between the first region and the second region; a second insulator over the first oxide; a second conductor over the second insulator; a third insulator positioned in contact with a side surface of the first region; and a second oxide positioned on the side surface of the first region, with the third insulator therebetween. The first region includes a region overlapping the first conductor. The third region includes a region overlapped by the second conductor. The first region and the second region have a lower resistance than the third region.

Abstract: A moving body control device includes a first ECU and a second ECU. The first ECU has a power switch connected thereto and when user authentication using identification information stored in a storage unit has succeeded in a power-off state of a moving body, sets the moving body to a power-on state in response to operation of the power switch. The second ECU has a terminal device connected thereto and communicates with the first ECU. When recognizing a predetermined operation of the power switch in a state where the identification information is not stored in the storage unit in a power-off state of the moving body, the first ECU establishes communication with the second ECU, thereby allowing the terminal device to operate the first ECU via the second ECU.

Abstract: A motor-driven compressor includes a compression unit, an electric motor, a drive circuit, a first housing, a second housing, and a soundproofing material. The second housing covers at least part of an outer surface of the first housing. The soundproofing material is arranged between the outer surface of the first housing and an area that includes an inner surface and a wall surface of the second housing. The soundproofing material has sound insulating properties. The soundproofing material includes a sound absorbing layer and a sound insulating layer. A first region and a second region are formed between the outer surface of the first housing and the area that includes the inner surface and the wall surface of the second housing. An air layer is formed in the second region.

Abstract: As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.

Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.