Patents by Inventor Takayuki Katsuto

Takayuki Katsuto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4341837
    Abstract: A laminar thermoplastic resin structure comprising a plurality of thermoplastic resin layers is obtained by bonding thermoplastic resin layers with a layer, or layers, of a maleic acid-modified block copolymer of a conjugated diene and an aromatic vinyl monomer interposed therebetween.The laminar structure thus obtained possesses a high bonding strength at elevated temperatures, and also excellent processability since the bonding layer per se is of thermoplastic nature. Thus, this laminar structure is particularly suitable as a material for use at elevated temperatures, for example, a packaging material for retort sterilization or a pipe for conducting hot fluids.
    Type: Grant
    Filed: August 7, 1979
    Date of Patent: July 27, 1982
    Assignee: Kureha Kagaku Kogyo Kabushiki Kaisha
    Inventors: Takayuki Katsuto, Shunzo Endo, Hideaki Doi, Naohiro Murayama