Abstract: Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.

Abstract: Provided are: an apparatus and a method for producing a (metal plate)-(ceramic board) laminated assembly, a bonding material and a metal plate during the bonding of the metal plate to the ceramic board through the bonding-material layer and an apparatus and a method for producing a power-module substrate. An apparatus for producing a (metal plate)-(ceramic board) laminated assembly by laminating a metal plate having a temporary bonding material formed thereon on a ceramic board having a bonding-material layer formed thereon, the apparatus being equipped with: a conveying device which conveys the metal plate onto the ceramic board to laminate the ceramic board and the metal plate on each other; and a heating device which is arranged in the middle of a passage of the conveyance of the metal plate by the conveying device and melts the temporary-bonding material on the metal plate.

Abstract: A solid-state image capturing apparatus includes: an insulation substrate including an external lead terminal; a solid-state image capturing element fixed on the insulation substrate and including a microlens; and a transparent glass member positioned above the insulation substrate for sealing the solid-state image capturing element fixed on the insulation substrate, and an electrode of the solid-state image capturing element and the external lead terminal of the insulation substrate being connected by a wire, wherein the transparent glass member is positioned in such a manner that a hollow space is formed between a microlens of the solid-state image capturing element and the transparent glass member, and wherein portions of the insulation film, the solid-state image capturing element and the wire, which are exposed in the hollow space, are all covered with a protective film.

Abstract: In a microlens formation step, the portions of a lens material film (32) supported on elevations (BG) are melted by heat so that part of the lens material film (32) flows into trenches (DH); thus, the shape of the portions of the lens material film (32) supported on the elevations (BG) is so changed as to be formed into microlenses (MS).

Abstract: A solid-state image capturing device includes a plurality of electrode pads for inputting and outputting a signal or voltage from and to the outside, a plurality of photoelectric conversion elements, a planarization film for planarizing the difference in the level on the surface above the plurality of photoelectric conversion elements, a microlens for focusing incident light on each of the plurality of photoelectric conversion elements, and a protection film provided above the microlens and the planarization film, the planarization film and the protection film above the plurality of electrode pads being removed as an opening, where the protection film has a protection film removing area that at least includes an area removed across all or a corner portion of the opening and the image capturing area.

Abstract: In a microlens unit (MSU), at least part of the edges of microlenses (MS) (convex lenses MS[BG]) supported on elevations (BG) overlap with trenches (DH) in a direction (VV) perpendicular to the surface of a flattening film (31).

Abstract: A solid-state image capturing apparatus includes: an insulation substrate including an external lead terminal; a solid-state image capturing element fixed on the insulation substrate and including a microlens; and a transparent glass member positioned above the insulation substrate for sealing the solid-state image capturing element fixed on the insulation substrate, and an electrode of the solid-state image capturing element and the external lead terminal of the insulation substrate being connected by a wire, wherein the transparent glass member is positioned in such a manner that a hollow space is formed between a microlens of the solid-state image capturing element and the transparent glass member, and wherein portions of the insulation film, the solid-state image capturing element and the wire, which are exposed in the hollow space, are all covered with a protective film.

Abstract: A solid-state image capturing device includes a plurality of electrode pads for inputting and outputting a signal or voltage from and to the outside, a plurality of photoelectric conversion elements, a planarization film for planarizing the difference in the level on the surface above the plurality of photoelectric conversion elements, a microlens for focusing incident light on each of the plurality of photoelectric conversion elements, and a protection film provided above the microlens and the planarization film, the planarization film and the protection film above the plurality of electrode pads being removed as an opening, where the protection film has a protection film removing area that at least includes an area removed across all or a corner portion of the opening and the image capturing area.

Abstract: A press machine in which the service life of a ball thread mechanism is extended. The press machine includes a die 2, a punch 4, a press drive mechanism 6, a height position changing mechanism 21, and a die height position control device 32. The press drive mechanism 6 is configured to move the punch up and down. The press drive mechanism includes at least one ball thread mechanism 10 in which a nut 13 is threaded via balls 12 onto a threaded shaft 11. A rotational drive source 14 is provided to rotate one of the threaded shaft 11 and the nut 13. The position changing mechanism 32 is configured to change the height of the die 2. The die position control device 32 controls the height of the die 2 via the position changing mechanism 21 so that the position varies where the balls 12 come into contact with the inner face of the thread grooves 11a of the threaded shaft 11 during pressing.

Abstract: In a microlens formation step, the portions of a lens material film (32) supported on elevations (BG) are melted by heat so that part of the lens material film (32) flows into trenches (DH); thus, the shape of the portions of the lens material film (32) supported on the elevations (BG) is so changed as to be formed into microlenses (MS).

Abstract: A method for manufacturing a solid-state image capturing device, in which at least one electric charge detection section detects each respective one of a plurality of electric charges photoelectrically converted and accumulated at photoelectric conversion sections provided on a semiconductor substrate, each electric charge detection section being shared by a plurality of the photoelectric conversion sections, the method including: an impurity region forming step of forming an impurity region on a surface of each photoelectric conversion section of the plurality of photoelectric conversion sections by performing an ion implantation from at least one direction crossing an arrangement direction of the plurality of photoelectric conversion sections, the at least one direction having a predetermined inclination angle with respect to a normal line perpendicular to the surface.

Abstract: A image pickup element has a semiconductor substrate which includes a light receiving part, an electric charge readout part, and an electric charge transfer part. The element has a non-doping region which is away from a boundary on a side of the electric charge readout part within the light receiving surface and which does not include a first impurity for identifying threshold value of the electric charge readout part, and has a layer made of the first impurity, which is provided in a doping region outside the non-doping region, within the light receiving surface, in the electric charge readout part, and in the electric charge transfer part.

Abstract: A image pickup element has a semiconductor substrate which includes a light receiving part, an electric charge readout part, and an electric charge transfer part. The element has a non-doping region which is away from a boundary on a side of the electric charge readout part within the light receiving surface and which does not include a first impurity for identifying threshold value of the electric charge readout part, and has a layer made of the first impurity, which is provided in a doping region outside the non-doping region, within the light receiving surface, in the electric charge readout part, and in the electric charge transfer part.

Abstract: A gel layer retained in a retaining member 15, such as non-woven fabric, is placed on one side of an electrode element 1. The electrode element 1 is held by a flexible and extendable tape 11, and the tape 11 adheres to a biological surface tissue. When being plastered onto the biological surface tissue, the tape 11 is covered with cover films 12 and 13, thereby preventing occurrence of a kink in the tape 11. After the tape 11 has been attached to the biological surface tissue, a butt-joined portion between two sub-divisions constituting a cover film 12 is exfoliated to the outside, thus preventing removal of the tape 11.