Abstract: A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other.

Abstract: An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer.

Abstract: A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer.

Abstract: A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located.

Abstract: A method of manufacturing a wiring substrate includes forming a pair of core substrates, each including a cavity; applying a film that covers the cavity to each core substrates; adhering an electronic component to the film in the cavity of each of the core substrates; arranging a support between the core substrates and a first insulator between the support and the core substrates; stacking the core substrates, the support, and the first insulators so that the first insulators form first insulation layers on the first surfaces of the core substrates, the cavities are filled with the first insulators, and the first insulators fix the corresponding electronic components to the corresponding core substrates; removing the film from the core substrates; and separating the core substrates from the support to separate the core substrates from each other.

Abstract: A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer.

Abstract: A wiring substrate includes a core, first and second wiring layers formed on opposite sides of the core, an electronic component arranged in a cavity of the core, and a first insulating layer that fills the cavity and covers the one surface of the core. The electronic component is partially buried in the first insulating layer and partially projected from the cavity and exposed from the first insulating layer. A second insulating layer covers the first insulating layer. A third insulating layer covers the core and the projected and exposed portion of the electronic component. The thickness of the third insulating layer where the first wiring layer is located is equal to the total thickness of the first insulating layer and the second insulating layer where the second wiring layer is located.

Abstract: An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer.