Patents by Inventor Takayuki KUMAI

Takayuki KUMAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10096556
    Abstract: A semiconductor device includes a substrate and a conductive layer. The substrate has an upper surface that is a substantially rectangular shape having a pair of two sides extending in a first direction and a pair of two sides extending in a second direction. The conductive layer is provided on the substrate and extending along a periphery of the substrate. The conductive layer extends and zigzags toward the first direction.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: October 9, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventor: Takayuki Kumai
  • SEMICONDUCTOR DEVICE
    Publication number: 20170338187
    Abstract: A semiconductor device includes a substrate and a conductive layer. The substrate has an upper surface that is a substantially rectangular shape having a pair of two sides extending in a first direction and a pair of two sides extending in a second direction. The conductive layer is provided on the substrate and extending along a periphery of the substrate. The conductive layer extends and zigzags toward the first direction.
    Type: Application
    Filed: January 19, 2017
    Publication date: November 23, 2017
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventor: Takayuki KUMAI