Patents by Inventor Takayuki Maeda

Takayuki Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7955675
    Abstract: A weld joint has a weld portion for being welded and bonded to a rim portion around an opening of a resin fuel tank. The weld portion is made of a resin alloy material that is obtained by alloying EVOH or PA with a modified HDPE. A highly-weldable layer is provided in an extremity portion of the weld portion throughout an entire circumference of the weld portion. The highly-weldable layer is made of HDPE and/or a modified HDPE having good weldability to the resin fuel tank. An extremity end surface of the highly-weldable layer serves as a weld surface for welding the weld portion to the resin fuel tank.
    Type: Grant
    Filed: December 6, 2007
    Date of Patent: June 7, 2011
    Assignee: Tokai Rubber Industries, Ltd.
    Inventors: Takayuki Maeda, Atsuo Miyajima, Kazushige Sakazaki, Kentaro Sugita
  • Publication number: 20110049434
    Abstract: It is an object of the present invention to provide a polyvinyl acetal resin composition capable of giving a ceramic green sheet which has sufficient flexibility and is hardly damaged even when being formed into a thin film, when the polyvinyl acetal resin composition is used as a binder for a ceramic green sheet. It is another object of the present invention to provide a ceramic slurry, a ceramic paste, a ceramic green sheet, a conductive paste and an interlayer film for laminated glass for automobiles, each produced by using the polyvinyl acetal resin composition.
    Type: Application
    Filed: September 16, 2009
    Publication date: March 3, 2011
    Inventors: Kenichi Ootsuki, Motokuni Ichitani, Takayuki Maeda, Yuki Hirose
  • Publication number: 20100141587
    Abstract: An electronic device having a plurality of operation keys, a position sensor, a keyboard layout controller and a keyboard illumination controller is provided. The operation keys are configured to form a reconfigurable keyboard layout. The keyboard layout controller is configured to reconfigure the keyboard layout in accordance with the position of the electronic device sensed by the position sensor. The keyboard illumination controller is configured to illuminate one of the operation keys being usable in the keyboard layout after the reconfiguration.
    Type: Application
    Filed: August 14, 2009
    Publication date: June 10, 2010
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yukio Takahashi, Takayuki Maeda
  • Publication number: 20100112480
    Abstract: An object of the present invention is to provide a method for producing a cross-linked polyvinyl acetal resin, which can provide a cross-linked polyvinyl acetal resin having high mechanical strength and excellent solvent resistance by a simple method without a cross-linking agent, and can solve such problems as sheet attack, insufficient strength, and instability of viscosity for a long-time storage, and another object of the present invention is to provide a cross-linked polyvinyl acetal resin produced by the above method for producing a cross-linked polyvinyl acetal resin.
    Type: Application
    Filed: April 11, 2008
    Publication date: May 6, 2010
    Inventors: Yuki Hirose, Hiroaki Takehara, Motokuni Ichitani, Takayuki Maeda
  • Publication number: 20080138554
    Abstract: A weld joint has a weld portion for being welded and bonded to a rim portion around an opening of a resin fuel tank. The weld portion is made of a resin alloy material that is obtained by alloying EVOH or PA with a modified HDPE. A highly-weldable layer is provided in an extremity portion of the weld portion throughout an entire circumference of the weld portion. The highly-weldable layer is made of HDPE and/or a modified HDPE having good weldability to the resin fuel tank. An extremity end surface of the highly-weldable layer serves as a weld surface for welding the weld portion to the resin fuel tank.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 12, 2008
    Applicant: Tokai Rubber Industries, Ltd.
    Inventors: Takayuki Maeda, Atsuo Miyajima, Kazushige Sakazaki, Kentaro Sugita
  • Patent number: 6334977
    Abstract: A powder material for powder plasma build-up welding which exhibits excellent resistance and bending properties comprises C in an amount of 0.06 to 0.15% (% by weight, the same hereinafter), Si in an amount of 0.2 to 1.0%, Mn in an amount of 0.2 to 1.0%, Cr in an amount of 17 to 30%, Nb in an amount of 0.6 to 1.5%, Ni in an amount of not more than 0.5%, and the balance consisting of Fe and unavoidable impurities.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: January 1, 2002
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Masakazu Matsui, Akira Notomi, Toshiaki Nishio, Takayuki Maeda, Iwami Ishihara, Tetsuji Yamaguchi, Yoshimi Onitsuka, Yuichi Kojima, Ryoji Miki, Takashi Inami
  • Patent number: 5840085
    Abstract: This invention relates to a process for removing sodium chloride and potassium salts, which are impurities concentrated and accumulated in pulp digesting chemicals, from ash collected from a soda recovery boiler. This process comprises the steps of (a) mixing ash collected from the combustion exhaust gas of the soda recovery boiler with water to form a slurry, adjusting the pH of the slurry to 10 or less by the addition of sulfuric acid, adjusting the temperature of the slurry to 20.degree. C. or above, and holding the slurry at that temperature for a sufficient time to cause sodium chloride and potassium salts present in the collected ash to be dissolved in the water; (b) cooling the slurry to a temperature below 20.degree. C. by the addition of ice and/or water so as to precipitate solid matter therefrom; and (c) separating the slurry into solid and liquid components and recovering the solid component while discharging the liquid component out of the system.
    Type: Grant
    Filed: October 3, 1995
    Date of Patent: November 24, 1998
    Assignee: Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Kikuo Tokunaga, Masakazu Tateishi, Michimasa Yagi, Takayuki Maeda, Yoshihisa Arakawa
  • Patent number: 5804871
    Abstract: Along the column of bonding pad (1), bidding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with respect to the signal lines, and they are connected to the bonding terminal portion of the bus bars, forming the IC package of the LOC type. Between the various bonding terminal portions and the various bonding pads, there exists no main wiring portion of the bus bar. Consequently, bonding wires (6), (7), (8), (9) do not straddle the bus bar principal wiring portion. As a result, when the bonding wire is not elevated, the bonding wire still does not make contact with the bus bar principal wiring portion to cause short circuit; as a result, the reliability is high and the device becomes thinner.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: September 8, 1998
    Assignee: Texas Instruments Incorporated
    Inventor: Takayuki Maeda
  • Patent number: 5550401
    Abstract: Along the column of bonding pad (1), bonding terminal portions (2c), (3c), (4a), (5a) of bus bars (2), (3), and signal lines (4), (5) are arranged; principal wiring portions (2a), (3a) are made to extend in a 3-dimensional crossing configuration with respect to the signal lines, and they are connected to the bonding terminal portion of the bus bars, forming the IC package of the LOC type. Between the various bonding terminal portions and the various bonding pads, there exists no main wiring portion of the bus bar. Consequently, bonding wires (6), (7), (8), (9) do not straddle the bus bar principal wiring portion. As a result, when the bonding wire is not elevated, the bonding wire still does not make contact with the bus bar principal wiring portion to cause short circuit; as a result, the reliability is high and the device becomes thinner.
    Type: Grant
    Filed: October 17, 1994
    Date of Patent: August 27, 1996
    Assignee: Texas Instruments Incorporated
    Inventor: Takayuki Maeda
  • Patent number: 5101261
    Abstract: An electronic circuit device wherein lines are provided to connect elements, and wherein a plurality of island shaped non-line parts, which do not have the function of the lines, are formed along the length of the lines.
    Type: Grant
    Filed: November 14, 1990
    Date of Patent: March 31, 1992
    Assignee: Texas Instruments Incorporated
    Inventor: Takayuki Maeda
  • Patent number: 4668551
    Abstract: An evacuated insulation unit and a method of manufacturing the same. A zeolite adsorbent is degassed in a vacuum state. The degassed zeolite adsorbent is sealingly packed in a gas impermeable bag in an atmosphere of an adsorption-proof gas. Then, the gas impermeable bag is provided with a communication hole. After the communication hole is provided, the gas impermeable bag is placed into a plastic bag so as to communicate to the plastic bag through the communication hole. A heat insulating material and activated carbon are also placed into the plastic bag. The plastic bag which contains the gas impermeable bag, the heat insulating material and the activated carbon is evacuated immediately after the provision of the communication hole to the gas impermeable bag so that air is prevented from entering the gas impermeable bag. The plastic bag is sealed during evacuation thereof to thereby produce the evacuated insulation unit.
    Type: Grant
    Filed: November 12, 1985
    Date of Patent: May 26, 1987
    Assignee: Nippon Sanso Kabushiki Kaisha
    Inventors: Tamotsu Kawasaki, Tadayoshi Iwasaki, Takayuki Maeda, Minoru Morita