Patents by Inventor Takayuki Masunaga

Takayuki Masunaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11493038
    Abstract: According to one embodiment, a crank portion is formed from a crank piece, an element separate from a shaft portion. The crank piece includes a fitting hole in which the shaft portion is fit by predetermined “interference” and a slit-like slot with one end opened in an inner circumferential surface of the fitting hole, and an other end closed inside the crank piece. The fitting hole is deformed so as to expand its diameter when expanding a width of the slot. The shaft portion is fit in the fitting hole of the crank piece by the predetermined “interference” when inserted in the deformed fitting hole and the fitting hole restores an original form while the shaft portion is in the fitting hole.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: November 8, 2022
    Assignee: Kabushiki Kaislia Toshiba
    Inventors: Kosuke Adachi, Kuniaki Yamamoto, Takayuki Masunaga, Shogo Shida
  • Patent number: 11442384
    Abstract: According to one embodiment, a wiring structure includes a substrate, a first conductor, second conductors, a first trace, second traces, heat-generating elements, and a first protruding conductor. The second conductors are spaced apart from the first conductor in a second direction crossing a first direction and are mutually juxtaposed with spacing in the first direction. The heat-generating elements are mutually juxtaposed in the first direction and connected to the respective second conductors and the first conductor. The first protruding conductor protrudes from either of the first conductor and one of the second conductors and is connected to a first one of the heat-generating elements. The first protruding conductor is at least partly located, in the first direction, between a center of the first one of the heat-Generating elements and a center of a second one of the heat-generating elements adjacent to the first one.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: September 13, 2022
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shanying Pan, Takayuki Masunaga
  • Publication number: 20200132071
    Abstract: According to one embodiment, a crank portion is formed from a crank piece, an element separate from a shaft portion. The crank piece includes a fitting hole in which the shaft portion is fit by predetermined “interference” and a slit-like slot with one end opened in an inner circumferential surface of the fitting hole, and an other end closed inside the crank piece. The fitting hole is deformed so as to expand its diameter when expanding a width of the slot. The shaft portion is fit in the fitting hole of the crank piece by the predetermined “interference” when inserted in the deformed fitting hole and the fitting hole restores an original form while the shaft portion is in the fitting hole.
    Type: Application
    Filed: December 30, 2019
    Publication date: April 30, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Kosuke ADACHI, Kuniaki YAMAMOTO, Takayuki MASUNAGA, Shogo SHIDA
  • Patent number: 10627755
    Abstract: A fuser device according to an embodiment includes a substrate, a first conductor, second conductors, a first wire, second wires, heating elements, and a roller. The first conductor extends in a first direction. The second conductors are apart from the first conductor in a second direction that is along a surface of the substrate and intersects the first direction, and are aligned with spacing in the first direction. At least one of the second conductors is provided with an opening. The first wire on the surface connected to the first conductor. The second wires on the surface are apart from the first wire and connected to the second conductors. The heating elements are apart from the second wires, apart from one another, and connected to the second conductors and the first conductor. The heating elements each generate heat by an applied current.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: April 21, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shanying Pan, Takayuki Masunaga
  • Publication number: 20200081380
    Abstract: According to one embodiment, a wiring structure includes a substrate, a first conductor, second conductors, a first trace, second traces, heat-generating elements, and a first protruding conductor. The second conductors are spaced apart from the first conductor in a second direction crossing a first direction and are mutually juxtaposed with spacing in the first direction. The heat-generating elements are mutually juxtaposed in the first direction and connected to the respective second conductors and the first conductor. The first protruding conductor protrudes from either of the first conductor and one of the second conductors and is connected to a first one of the heat-generating elements. The first protruding conductor is at least partly located, in the first direction, between a center of the first one of the heat-Generating elements and a center of a second one of the heat-generating elements adjacent to the first one.
    Type: Application
    Filed: July 10, 2019
    Publication date: March 12, 2020
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shanying PAN, Takayuki Masunaga
  • Patent number: 10573475
    Abstract: According to an embodiment, a gas-blast circuit breaker comprises a heat removal unit in a flow path of arc extinguishing gas. The heat removal unit each includes: plate-shaped heat removal members contacting the arc extinguishing gas flowing in the flow path; and a holding portion holding the plate-shaped heat removal members to stack the heat removal members at intervals in a thickness direction. Each of the heat removal members includes: an upstream side end portion; a downstream side end portion; and a thickest portion with a largest thickness which is provided between the upstream side end portion and the downstream side end portion. Thickness of the heat removal member continuously changes between the upstream side end portion and the downstream side end portion via the thickest portion.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: February 25, 2020
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Misuzu Sakai, Hiroki Tashiro, Takayuki Masunaga, Katsumi Hisano, Takahiro Terada, Toshiyuki Uchii, Takanori Iijima, Tomoyuki Yoshino
  • Patent number: 10498191
    Abstract: According to an embodiment, a bush includes a first member, a second member, and a third member. The first member is provided with a first hole having a first axis, and has a first outer surface having a second axis different from the first axis. The second member is provided with a second hole in which the first member is housed, and has a second inner surface that is in contact with the first outer surface and a second outer surface having a third axis different from the second axis. The third member is provided with a third hole in which the second member is housed and has a third inner surface that is in contact with the second outer surface.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: December 3, 2019
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Masunaga, Shanying Pan, Misuzu Sakai, Toshihiko Kida, Kaori Deura, Kosuke Adachi, Makoto Ootaki
  • Publication number: 20190294088
    Abstract: A fuser device according to an embodiment includes a substrate, a first conductor, second conductors, a first wire, second wires, heating elements, and a roller. The first conductor extends in a first direction. The second conductors are apart from the first conductor in a second direction that is along a surface of the substrate and intersects the first direction, and are aligned with spacing in the first direction. At least one of the second conductors is provided with an opening. The first wire on the surface connected to the first conductor. The second wires on the surface are apart from the first wire and connected to the second conductors. The heating elements are apart from the second wires, apart from one another, and connected to the second conductors and the first conductor. The heating elements each generate heat by an applied current.
    Type: Application
    Filed: March 6, 2019
    Publication date: September 26, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shanying PAN, Takayuki MASUNAGA
  • Publication number: 20190295791
    Abstract: According to an embodiment, a gas-blast circuit breaker comprises a heat removal unit in a flow path of arc extinguishing gas. The heat removal unit each includes: plate-shaped heat removal members contacting the arc extinguishing gas flowing in the flow path; and a holding portion holding the plate-shaped heat removal members to stack the heat removal members at intervals in a thickness direction. Each of the heat removal members includes: an upstream side end portion; a downstream side end portion; and a thickest portion with a largest thickness which is provided between the upstream side end portion and the downstream side end portion. Thickness of the heat removal member continuously changes between the upstream side end portion and the downstream side end portion via the thickest portion.
    Type: Application
    Filed: March 7, 2019
    Publication date: September 26, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Misuzu SAKAI, Hiroki TASHIRO, Takayuki MASUNAGA, Katsumi HISANO, Takahiro TERADA, Toshiyuki UCHII, Takanori IIJIMA, Tomoyuki YOSHINO
  • Publication number: 20190085857
    Abstract: According to one embodiment, a mounting structure includes a first member, a second member and a support. The first member includes a first outer surface extending along and around a first axis. The second member has a first surface to which a first hole opens, the first hole extending along the first axis to house the first member. The support is rotatable integrally with the first member around the first axis and has a second surface facing the first surface. One of the first surface and the second surface is provided with first dents. The other of the first surface and the second surface is provided with at least one first bump that fits into at least one of the first dents to limit a relative rotation between the second member and the support around the first axis.
    Type: Application
    Filed: August 17, 2018
    Publication date: March 21, 2019
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Shanying Pan, Takayuki Masunaga, Misuzu Sakai
  • Publication number: 20190085860
    Abstract: According to one embodiment, a mounting structure includes: a first member including a first outer surface provided with first dents arranged around a second axis at an interval of a first angular distance; a second member including a second inner surface provided with second dents arranged around the second axis at an interval of a second angular distance, and a second outer surface provided with third dents arranged around a third axis at an interval of a third angular distance; a third member includes a third inner surface provided with fourth dents arranged around the third axis at an interval of a fourth angular distance; a first limiting member housed in one of the first dents and one of the second dents opposing each other; and a second limiting member housed in one of the third dents and one of the fourth dents opposing each other.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 21, 2019
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Misuzu SAKAI, Takayuki MASUNAGA, Shanying PAN
  • Publication number: 20180274801
    Abstract: According to an embodiment, a high-rigidity plate includes: a first protrusion including a first top wall configured to support a vibration member and a first circumferential wall connected with an outer circumferential edge of the first top wall, the first protrusion being configured to protrude inside a housing or outside the housing; an intermediate part disposed at a position surrounding the first top wail when viewed along a first direction and connected with the first circumferential wall via a first bend; and an annular second protrusion including a second top wall disposed at a position surrounding the first top wall when viewed along the first direction and a second circumferential wall connected with the intermediate part via a second bend and connected with an inner circumferential edge of the second top wall, the second protrusion being configured to protrude inside the housing or outside the housing.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 27, 2018
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Misuzu Sakai, Shanying Pan, Takayuki Masunaga, Kaori Deura, Toshihiko Kida, Kosuke Adachi, Makoto Ootaki
  • Publication number: 20180258532
    Abstract: According to an embodiment, a shower plate includes a first member and a second member. The first member includes a first wall provided with a plurality of first openings and internally including a room with which the first openings communicate. The second member includes a second wall provided with a second opening and arranged in the room. The second member is arranged at a position spaced apart from the first member, and allows one of the first openings facing the second opening to be replaced with another of the first openings by changing a position of the second member with respect to the first member.
    Type: Application
    Filed: March 7, 2018
    Publication date: September 13, 2018
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Shiguma KATO, Takahiro Terada, Takayuki Masunaga, Makoto Ootaki, Hitoshi Hasegawa, Kosuke Adachi, Satoshi Tsuno
  • Publication number: 20180262083
    Abstract: According to an embodiment, a bush includes a first member, a second member, and a third member. The first member is provided with a first hole having a first axis, and has a first outer surface having a second axis different from the first axis. The second member is provided with a second hole in which the first member is housed, and has a second inner surface that is in contact with the first outer surface and a second outer surface having a third axis different from the second axis. The third member is provided with a third hole in which the second member is housed and has a third inner surface that is in contact with the second outer surface.
    Type: Application
    Filed: February 26, 2018
    Publication date: September 13, 2018
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki Masunaga, Shanying Pan, Misuzu Sakai, Toshihiko Kida, Kaori Deura, Kosuke Adachi, Makoto Ootaki
  • Patent number: 9496201
    Abstract: According to one embodiment, a semiconductor device includes a first conductor, a second conductor, and an envelope. The first conductor includes a first radiation surface. The second conductor includes a second radiation surface. The envelope includes a first envelope portion which is composed of a first insulative material and is formed such that the first envelope portion seals a semiconductor, and a second envelope portion which is composed of a second insulative material and is formed in contact with the first radiation surface and the second radiation surface.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: November 15, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki Masunaga, Kazuhiro Ueda, Naotake Watanabe, Koji Maruno, Toshihiko Kida
  • Publication number: 20160276247
    Abstract: According to one embodiment, a semiconductor device includes a first conductor, a second conductor, and an envelope. The first conductor includes a first radiation surface. The second conductor includes a second radiation surface. The envelope includes a first envelope portion which is composed of a first insulative material and is formed such that the first envelope portion seals a semiconductor, and a second envelope portion which is composed of a second insulative material and is formed in contact with the first radiation surface and the second radiation surface.
    Type: Application
    Filed: May 27, 2016
    Publication date: September 22, 2016
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki MASUNAGA, Kazuhiro UEDA, Naotake WATANABE, Koji MARUNO, Toshihiko KIDA
  • Patent number: 9379040
    Abstract: According to one embodiment, a semiconductor device includes a first conductor, a second conductor, and an envelope. The first conductor includes a first radiation surface. The second conductor includes a second radiation surface. The envelope includes a first envelope portion which is composed of a first insulative material and is formed such that the first envelope portion seals a semiconductor, and a second envelope portion which is composed of a second insulative material and is formed in contact with the first radiation surface and the second radiation surface.
    Type: Grant
    Filed: February 20, 2015
    Date of Patent: June 28, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki Masunaga, Kazuhiro Ueda, Naotake Watanabe, Koji Maruno, Toshihiko Kida
  • Publication number: 20150279763
    Abstract: According to one embodiment, a semiconductor device includes a first conductor, a second conductor, and an envelope. The first conductor includes a first radiation surface. The second conductor includes a second radiation surface. The envelope includes a first envelope portion which is composed of a first insulative material and is formed such that the first envelope portion seals a semiconductor, and a second envelope portion which is composed of a second insulative material and is formed in contact with the first radiation surface and the second radiation surface.
    Type: Application
    Filed: February 20, 2015
    Publication date: October 1, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki MASUNAGA, Kazuhiro UEDA, Naotake WATANABE, Koji MARUNO, Toshihiko KIDA
  • Patent number: 9147673
    Abstract: According to one embodiment, a semiconductor power converter includes first and second electrical conductors opposed to each other, first and second semiconductor elements joined to a first joint surface of the first electrical conductor, first and second convex electrical conductors joined to the first and second semiconductor elements, a junction joined to the first and second convex electrical conductors and a second joint surface of the second electrical conductor, power terminals, signal terminals, and an envelope sealing the constituent members. The envelope includes a flat bottom surface which extends perpendicular to the semiconductor elements and in which first and second bottom surfaces of the electrical conductors are exposed.
    Type: Grant
    Filed: September 12, 2013
    Date of Patent: September 29, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hideo Nishiuchi, Kazuhiro Ueda, Takayuki Masunaga, Naotake Watanabe, Yoshiyuki Shimizu, Takashi Togasaki, Koji Maruno
  • Patent number: 9045330
    Abstract: According to one embodiment, a MEMS element comprises a first electrode fixed on a substrate, and a second electrode arranged above the first electrode, facing the first electrode, and vertically movable. The second electrode includes a second opening portion that penetrates from an upper surface to a lower surface of the second electrode. The first electrode includes a first opening portion at a position corresponding to at least a part of the second opening portion, the first opening portion penetrating from an upper surface to a lower surface of the first electrode.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 2, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yuriko Kato, Hiroaki Yamazaki, Etsuji Ogawa, Takayuki Masunaga