Abstract: A flexible printed circuit board that includes: a first surface section that has a first electrode electrically connected to a piezoelectric element and extends in contact with a first main surface of the piezoelectric element; a second surface section that is bent from an end of the first surface section closest to a side wall of a case, and extends upward along the side wall; and a third surface section that has a second electrode electrically connected to a first end of a terminal member, and is bent in an S-shape from an upper end of the second surface section so as to face the first surface section with an interval interposed therebetween. The first surface section and at least a portion of the second surface section closer to the first surface section are embedded in a first filling material.

Abstract: A solid electrolyte contains a lithium (Li) element, a phosphorus (P) element, a sulfur (S) element, and an X element, where X represents at least one element selected from the group consisting of a chlorine (Cl) element, a bromine (Br) element, and an iodine (I) element. The solid electrolyte has a peak attributed to a fluorine (F) element in surface analysis based on X-ray photoelectron spectroscopy. It is preferable that the ratio (quantitative value of F1s/quantitative value of P2p) of quantitative value of F1s (atom %) and quantitative value of P2p (atom %), calculated based on X-ray photoelectron spectroscopy with the total amount of Li1s, C1s, O1s, F1s, P2p, S2p, Cl2p, and Br3d being set to 100%, is 0.01 or more and 0.34 or less.

Abstract: A method for producing a sulfide solid electrolyte includes: a step of mixing a lithium (Li) element source, a phosphorus (P) element source, and a sulfur (S) element source, thereby obtaining a raw material composition; a step of firing the raw material composition, thereby obtaining a sulfide; a step of milling a slurry containing a solvent having fluorine atoms and the sulfide; and a step of drying the slurry. The sulfide in the slurry preferably has a concentration of 3 to 40 mass %. The step of milling a slurry is preferably a step of dry milling the sulfide, and mixing the dry milled sulfide and the solvent, thereby preparing the slurry.

Abstract: The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.

Abstract: A polishing composition capable of suppressing surface defects and reducing haze is provided. The polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; a polyalcohol; and an alkali compound. Preferably, the polishing composition further includes a non-ionic surfactant.

Abstract: A polishing composition that can suppress surface defects and reduce haze is provided. A polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; and an alkali compound, where an average particle size of particles in the polishing composition measured by dynamic light scattering is not more than 55 nm. Preferably, the polishing composition further includes a non-ionic surfactant. Preferably, the polishing composition further includes a polyalcohol.

Abstract: A polishing composition capable of suppressing surface defects and reducing haze is provided. The polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; a polyalcohol; and an alkali compound. Preferably, the polishing composition further includes a non-ionic surfactant.

Abstract: A polishing composition that can suppress surface defects and reduce haze is provided. A polishing composition includes: abrasives; at least one water-soluble polymer selected from vinyl alcohol-based resins having a 1,2-diol structural unit; and an alkali compound, where an average particle size of particles in the polishing composition measured by dynamic light scattering is not more than 55 nm. Preferably, the polishing composition further includes a non-ionic surfactant. Preferably, the polishing composition further includes a polyalcohol.

Abstract: The present invention relates to a polishing composition including water and silica, wherein the silica has a BET specific surface area of 30 m2/g or more and an NMR specific surface area of 10 m2/g or more, and a polishing method using the polishing composition. The polishing composition of the present invention adopts silica having the BET specific surface area falling within the above-described range, and additionally having the NMR specific surface area falling within a specific range, and consequently attains a high polishing rate, and can maintain the polishing rate even when used for a long time.

Abstract: A polishing composition of the present invention contains: a polyvinyl alcohol resin having a 1,2-diol structure in its side chain, the polyvinyl alcohol resin being a copolymer of a monomer represented by Formula (1) below and a vinyl ester monomer; an organic acid; and abrasive grains whose surfaces are chemically modified so as to have a minus zeta potential on the surfaces in a solution with a pH of 2.0 or more and to have no isoelectric point: (where R1 to R6 each independently denote a hydrogen atom or an organic group, X denotes a single bond or a linking group, and R7 and R8 each independently denote a hydrogen atom or R9—CO— (where R9 denotes an alkyl group)).

Abstract: An indexable thread forming tap including: a body in a shaft shape; and a tip concentrically and detachably attached to a leading end portion of the body by screw-fastening and rotationally driven around an axial center along with the body for rolling of a female thread, the body being disposed with a screw hole concentrically to the axial center such that a screw shaft disposed on the tip concentrically to the axial center is screwed into the screw hole for the screw-fastening, a leading end surface of the screw shaft being pressed against a bottom surface of the screw hole into close contact with each other by the screw-fastening to integrally fix the tip to the body without the leading end of the body abutting on the tip, the body being disposed with a restraining hole concentrically to the axial center.

Abstract: A removable tip type rotary tool is provided in which a rotation stop key and a key groove each having a triangular shape are disposed on opposing surfaces of a body and a tip concentrically attached to a leading end portion of the body in a removable manner. A pair of side surfaces of the rotation stop key and a pair of side walls of the key groove are brought into surface contact by mounting screw. An angle for each of the pair of the side surfaces and the pair of side walls is between 60 to 100 degrees, a groove bottom of the key groove is rounded with a radius from 1.5 to 2.8 mm, corners of opening edges on both sides of the key groove and corners of both base-end side portions of the rotation stop key are rounded with radiuses, respectively, from 1.5 to 2.8 mm.

Abstract: A polishing composition of the present invention contains: a polyvinyl alcohol resin having a 1,2-diol structure in its side chain, the polyvinyl alcohol resin being a copolymer of a monomer represented by Formula (1) below and a vinyl ester monomer; an organic acid; and abrasive grains whose surfaces are chemically modified so as to have a minus zeta potential on the surfaces in a solution with a pH of 2.0 or more and to have no isoelectric point: (where R1 to R6 each independently denote a hydrogen atom or an organic group, X denotes a single bond or a linking group, and R7 and R8 each independently denote a hydrogen atom or R9—CO— (where R9 denotes an alkyl group)).

Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

Abstract: An indexable thread forming tap including: a body in a shaft shape; and a tip concentrically and detachably attached to a leading end portion of the body by screw-fastening and rotationally driven around an axial center along with the body for rolling of a female thread, the body being disposed with a screw hole concentrically to the axial center such that a screw shaft disposed on the tip concentrically to the axial center is screwed into the screw hole for the screw-fastening, a leading end surface of the screw shaft being pressed against a bottom surface of the screw hole into close contact with each other by the screw-fastening to integrally fix the tip to the body without the leading end of the body abutting on the tip, the body being disposed with a restraining hole concentrically to the axial center.

Abstract: A thread forming tap has a full thread portion and a leading portion contiguous with the full thread portion and reducing in diameter toward its tip. The full thread and leading portions are provided with external thread on which lobes and recesses are alternately formed. When ? represents an angle around a tool center line toward a thread forming side, the shape of the lobe varies along a quadratic curve relative to angle ? so that relief amount increases toward inflection point angle ?. However, in a rough plastic deformation section where angle ? is greater than inflection point angle ? and exceeds the working region, the shape varies along an Archimedean curve with clearance angle ?1 so that the relief amount increases linearly relative to angle ?, and a margin section is substantially zero or within a range where angle ? is less than or equal to 1°.

Abstract: A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.

Abstract: A polishing composition that allows polishing speed to be increased and surface roughness to be reduced is provided. The polishing composition according to the present invention includes a compound including at least an oxyethylene group or an oxypropylene group in a block polyether represented by the following general formula (1), a basic compound, and abrasives: >N—R—N< (1) where R represents an alkylene group expressed as CnH2n and “n” is an integer not less than 1.

Abstract: A removable tip type rotary tool is provided in which a rotation stop key and a key groove each having a triangular shape are disposed on opposing surfaces of a body and a tip concentrically attached to a leading end portion of the body in a removable manner. A pair of side surfaces of the rotation stop key and a pair of side walls of the key groove are brought into surface contact by mounting screw. An angle for each of the pair of the side surfaces and the pair of side walls is between 60 to 100 degrees, a groove bottom of the key groove is rounded with a radius from 1.5 to 2.8 mm, corners of opening edges on both sides of the key groove and corners of both base-end side portions of the rotation stop key are rounded with radiuses, respectively, from 1.5 to 2.8 mm.

Abstract: A polishing composition that can improve polishing property without foaming is provided. A polishing composition includes a pH regulator, a water-soluble polymer compound, and a compound containing an alkylene diamine structure having two nitrogens represented by the following general formula (1), and having at least one block type polyether bonded to the two nitrogens of the alkylene structure, the block type polyether having a bond of an oxyethylene group and an oxypropylene group: where R represents an alkylene group represented by CnH2n, in which n is an integer of 1 or more.