Abstract: A multilayer film including alternately-laminated fluororesin layers and polyimide resin layers, wherein a total number of the fluororesin layers and the polyimide resin layers is five or more, a ratio of the total thickness of the fluororesin layers to the thickness of the whole multilayer film is 50% or more, and at least one of the outermost layers of the multilayer film is a fluororesin layer.

Abstract: A multilayer film including alternately-laminated fluororesin layers and polyimide resin layers, wherein a total number of the fluororesin layers and the polyimide resin layers is five or more, a ratio of the total thickness of the fluororesin layers to the thickness of the whole multilayer film is 50% or more, and at least one of the outermost layers of the multilayer film is a fluororesin layer.

Abstract: A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide?20° C. to the glass transition temperature Tg+50° C.

Abstract: A method for manufacturing a flexible metal-clad laminated plate includes the steps of: (a) obtaining a laminated body by laminating a polyimide resin film including a non-thermoplastic polyimide layer and an adhesive layer containing thermoplastic polyimide, the adhesive layer being provided on at least one side of the non-thermoplastic polyimide layer, and a metal foil; and (b) subjecting the laminated body obtained in the step (a) to heat treatment under an inert gas atmosphere and a pressure of 0.20 to 0.98 MPa at a temperature of a glass transition temperature Tg of the thermoplastic polyimide?20° C. to the glass transition temperature Tg+50° C.

Abstract: The present invention provides a resin composition comprising a specific styrene polymer, a specific inorganic filler, and a curing agent, wherein the styrene polymer is a specific acid-modified styrene polymer, and the resin composition satisfies specific conditions in the form of a film having a thickness of 25 ?m.