Patents by Inventor Takayuki Mibuchi

Takayuki Mibuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive applying apparatus
    Patent number: 6394161
    Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: May 28, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyuki Kakishima, Akihiko Wachi, Hitoshi Nakahira, Takayuki Mibuchi
  • Adhesive applying apparatus
    Patent number: 6050314
    Abstract: An adhesive applying apparatus having an adhesive applying nozzle (1), an elevation drive unit (B) for vertically moving the adhesive applying nozzle, a purging station (6) provided with a purging tape (5), a unit (10) for supporting a circuit board (4) and an X-Y direction drive unit (30) which moves the adhesive applying nozzle so as to position the adhesive applying nozzle in a specified position in a horizontal direction of the circuit board and the purging tape. The elevation drive unit is constructed so as to be able to selectively set the lowermost end position of the adhesive applying nozzle. Also, a control means (D) is provided for controlling the elevation drive unit with a command in order to set the lowermost end position of the adhesive applying nozzle, located in a position above the purging station, to a specified position.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: April 18, 2000
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuyuki Kakishima, Akihiko Wachi, Hitoshi Nakahira, Takayuki Mibuchi