Abstract: Provided is a rotating machine capable of obtaining a uniform temperature distribution by improving a cooling air flow to a heat generation portion. The rotating machine has a salient pole rotor (11) and a stator (12). The salient pole rotor (11) has a rotation shaft (15), a disk-shaped spoke (22), a cylindrical rib (23), and a plurality of salient poles (25) arranged in a radial shape on an outer circumferential surface of the rib (23), each of the salient poles (25) being formed along an axial direction of the rotation shaft (15). The disk-shaped spoke (22) is provided to an anti-feeding side end of the cooling air of the salient pole rotor (11). The cylindrical rib (23) is provided with through-holes (231) extending from an inner space of the cylindrical rib (23) through gaps between a plurality of salient poles (25).

Abstract: Provided is a rotating machine capable of obtaining a uniform temperature distribution by improving a cooling air flow to a heat generation portion. The rotating machine has a salient pole rotor (11) and a stator (12). The salient pole rotor (11) has a rotation shaft (15), a disk-shaped spoke (22), a cylindrical rib (23), and a plurality of salient poles (25) arranged in a radial shape on an outer circumferential surface of the rib (23), each of the salient poles (25) being formed along an axial direction of the rotation shaft (15). The disk-shaped spoke (22) is provided to an anti-feeding side end of the cooling air of the salient pole rotor (11). The cylindrical rib (23) is provided with through-holes (231) extending from an inner space of the cylindrical rib (23) through gaps between a plurality of salient poles (25).

Abstract: A mounting structure of a semiconductor device is configured by connecting (i) a first protruding electrode [a bump (A5)] formed on a first electronic component [a substrate (2) or a semiconductor element (A1)] and (ii) a second protruding electrode [a bump (B6)] formed on a second electronic component [a semiconductor element (B11)]. The first protruding electrode and the second protruding electrodes are made of different metal materials. The first protruding electrode is harder than the second protruding electrode, has a pointed end, and is embedded in the second protruding electrode.

Abstract: This semiconductor device comprises a semiconductor chip, a signal lead connected to a signal electrode of the semiconductor chip, an external signal electrode connected with the signal lead, a ground lead extending along the signal lead, and a sealing resin sealing these elements. The external signal electrode is formed as a protruding electrode protruding from an undersurface of the sealing resin. One surface of the signal lead is exposed on the undersurface of the sealing resin.

Abstract: This semiconductor device comprises a semiconductor chip, a signal lead connected to a signal electrode of the semiconductor chip, an external signal electrode connected with the signal lead, a ground lead extending along the signal lead, and a sealing resin sealing these elements. The external signal electrode is formed as a protruding electrode protruding from an undersurface of the sealing resin. One surface of the signal lead is exposed on the undersurface of the sealing resin.