Patents by Inventor Takayuki Minagawa

Takayuki Minagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8552513
    Abstract: A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same width as the width of the cavity at a desired section in the one silicon substrate and reducing the width of the cavity from the boundary portion toward the diaphragm center.
    Type: Grant
    Filed: March 11, 2010
    Date of Patent: October 8, 2013
    Assignee: ALPS Electric Co., Ltd.
    Inventors: Takuya Adachi, Katsuya Kikuiri, Tetsuya Fukuda, Hisanobu Okawa, Takayuki Minagawa
  • Publication number: 20120112368
    Abstract: An MEMS sensor package includes an MEMS sensor and a driving IC that controls driving of the MEMS sensor, which are fixed onto the same mounting surface made of a given package material, wherein an MEMS sensor mounting area and a driving IC mounting area are set on the mounting surface, a die attach metalized layer is formed on a package material of the driving IC mounting area, the driving IC is mounted on the die attach metalized layer, and the MEMS sensor is mounted on a package material of the MEMS sensor mounting area.
    Type: Application
    Filed: January 11, 2012
    Publication date: May 10, 2012
    Applicant: ALPS ELECTRIC CO., LTD.
    Inventors: Yukihiro GORAI, Koji NISHIMURA, Takayuki MINAGAWA, Masaru SAKURAI
  • Publication number: 20100164028
    Abstract: A semiconductor pressure sensor includes a cavity disposed in one silicon substrate of a SOI substrate having two silicon substrates bonded to each other with an oxide film therebetween and a diaphragm formed from the other silicon substrate and the oxide film, wherein the oxide film, bordering the cavity, of the diaphragm includes an arc-shaped section at the boundary portion to the one silicon substrate defining the inner wall side surface of the cavity, the arc-shaped section having the same diameter as the diameter of the cavity in the one silicon substrate and reducing the cavity diameter from the boundary portion toward the diaphragm center.
    Type: Application
    Filed: March 11, 2010
    Publication date: July 1, 2010
    Inventors: Takuya Adachi, Katsuya Kikuiri, Tetsuya Fukuda, Hisanobu Okawa, Takayuki Minagawa
  • Patent number: 6710476
    Abstract: The invention provides an electromagnetic reciprocal drive mechanism having a movable part that is simple to manufacture, dimensionally stable and inexpensive. The device has; a permanent magnet cluster 3, and a spider 4 and retainer 5 that concentrically support the permanent magnet cluster 3, an outer laminated core 6 provided adjacent to the permanent magnet cluster 3, and an electromagnetic coil 8 wound around the outer laminated core 6. An adhesive paper sheet 13 having an adhesive layer 11 on an inner surface and which can be impregnated with an adhesive 12 is wrapped around an outer periphery of the permanent magnet cluster 3, the spider 4 and the retainer 5. The adhesive 12 is then impregnated into the adhesive paper sheet 13 and solidified. In the adhesive paper sheet 13 and the adhesive layer 11 is formed of a plurality of small holes.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: March 23, 2004
    Assignee: Twinbird Corporation
    Inventors: Masaaki Tanozaki, Takayuki Minagawa, Takeshi Suzuki, Hideto Urasawa
  • Patent number: 6668862
    Abstract: A fluid bearing mechanism using a one-way valve with such a simple structure that high processing accuracy is not required. A one-way valve 6 includes a valve base 7; an abutting portion 11 protruding inwardly, formed with a small communication hole 12 in a center thereof; a moveable element 8 which is moveable inside the valve base 7 in an axial direction; and a retaining body 9 for retaining the moveable element 8 between the abutting portion 11 and itself inside the valve base 7. The retaining body 9 includes ventilation grooves 8b, 9c for communicating an inside with an outside of the valve base 7. When the piston 2 is moved toward the compressing direction, the moveable element 8 is shifted toward the inside of the piston 2 due to the inner pressure of the cylinder 1 and its inertial force, thus opening the small communication hole 12.
    Type: Grant
    Filed: April 23, 2002
    Date of Patent: December 30, 2003
    Assignee: Twinbird Corporation
    Inventors: Kazuo Maezawa, Takayuki Minagawa, Hideto Urasawa
  • Publication number: 20020153048
    Abstract: A fluid bearing mechanism using a one-way valve with such a simple structure that high processing accuracy is not required. A one-way valve 6 includes a valve base 7; an abutting portion 11 protruding inwardly, formed with a small communication hole 12 in a center thereof; a moveable element 8 which is moveable inside the valve base 7 in an axial direction; and a retaining body 9 for retaining the moveable element 8 between the abutting portion 11 and itself inside the valve base 7. The retaining body 9 includes ventilation grooves 8b, 9c for communicating an inside with an outside of the valve base 7. When the piston 2 is moved toward the compressing direction, the moveable element 8 is shifted toward the inside of the piston 2 due to the inner pressure of the cylinder 1 and its inertial force, thus opening the small communication hole 12.
    Type: Application
    Filed: April 23, 2002
    Publication date: October 24, 2002
    Inventors: Kazuo Maezawa, Takayuki Minagawa, Hideto Urasawa
  • Publication number: 20020014937
    Abstract: The invention provides an electromagnetic reciprocal drive mechanism having a movable part that is simple to manufacture, dimensionally stable and inexpensive. The device has; a permanent magnet cluster 3, and a spider 4 and retainer 5 that concentrically support the permanent magnet cluster 3, an outer laminated core 6 provided adjacent to the permanent magnet cluster 3, and an electromagnetic coil 8 wound around the outer laminated core 6. An adhesive paper sheet 13 having an adhesive layer 11 on an inner surface and which can be impregnated with an adhesive 12 is wrapped around an outer periphery of the permanent magnet cluster 3, the spider 4 and the retainer 5. The adhesive 12 is then impregnated into the adhesive paper sheet 13 and solidified. In the adhesive paper sheet 13 and the adhesive layer 11 is formed of a plurality of small holes.
    Type: Application
    Filed: July 11, 2001
    Publication date: February 7, 2002
    Inventors: Masaaki Tanozaki, Takayuki Minagawa, Takeshi Suzuki, Hideto Urasawa
  • Patent number: D611855
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: March 16, 2010
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takayuki Minagawa, Koji Nishimura, Yukihiro Gorai
  • Patent number: D611856
    Type: Grant
    Filed: October 20, 2008
    Date of Patent: March 16, 2010
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takayuki Minagawa, Koji Nishimura, Yukihiro Gorai