Abstract: A method of manufacturing a package includes providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead. The method further includes disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed, and applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion. The method also includes removing the molded resin from the mold, the molded resin being applied with the ink.

Abstract: A method for manufacturing a restored substrate includes: removing a nitride semiconductor layer from a stacked-layer in which the nitride semiconductor layer has been laminated on a substrate; oxidizing material adhering to the substrate to produce an oxide deposit after the removing of the nitride semiconductor layer from the stacked-layer; and removing the oxide deposit from the substrate. A method for manufacturing a light emitting element includes stacking nitride semiconductor layers including an active layer on the restored substrate obtained by the above method.

Abstract: A method of manufacturing a package includes providing a lead frame including a lead and a molded resin having an upper surface on which a depressed portion is formed to house a light-emitting element, the molded resin being formed integrally with the lead. The method further includes disposing the molded resin in a cavity of a mold in a state where the depressed portion of the molded resin is closed, and applying an ink to the upper surface of the molded resin and at least a portion of lateral surfaces of the molded resin by supplying the ink into the cavity, the ink having a darker color than an inner surface of the depressed portion. The method also includes removing the molded resin from the mold, the molded resin being applied with the ink.

Abstract: A method for manufacturing a restored substrate includes: removing a nitride semiconductor layer from a stacked-layer in which the nitride semiconductor layer has been laminated on a substrate; oxidizing material adhering to the substrate to produce an oxide deposit after the removing of the nitride semiconductor layer from the stacked-layer; and removing the oxide deposit from the substrate. A method for manufacturing a light emitting element includes stacking nitride semiconductor layers including an active layer on the restored substrate obtained by the above method.

Abstract: A feeding method and apparatus for breeding natural enemy insects necessary for establishing a farming system that uses less or no pesticides and a rearing method for breeding natural enemy insects are provided. A feeding apparatus including a food supplying section, a feeding section, and a food introducing section via which the food supplying section and the feeding section are in communication with each other, and an attracting section made of a material having a specific color tone is designed, and is used to breed natural enemy insects.