Patents by Inventor Takayuki Nagumo

Takayuki Nagumo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8901192
    Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.
    Type: Grant
    Filed: October 20, 2010
    Date of Patent: December 2, 2014
    Assignee: Denki Kagaku Kogyo Kabushiki Kaisha
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
  • Publication number: 20120205043
    Abstract: Provided is an adhesive (meth)acrylic resin composition being high in adhesiveness and capable of affording an adhered body which can be used at high temperatures of 250° C. or higher, and possessing low outgassing property and heat resistance. A (meth)acrylic resin composition including (A) a polyfunctional (meth)acrylate, and (B) a photopolymerization initiator that exhibits a mass loss on heating of 15% by mass or less when increasing temperature from 30° C. to 250° C. at a temperature increase rate of 10° C./min. under nitrogen flow, wherein the glass transition temperature of a cured body obtained from the composition is 250° C. or higher.
    Type: Application
    Filed: October 20, 2010
    Publication date: August 16, 2012
    Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA
    Inventors: Hiroyuki Kurimura, Isamu Ichikawa, Takayuki Nagumo, Takako Hoshino, Jun Watanabe
  • Patent number: 8241072
    Abstract: Provided is a push-type connector having a structure for preventing an operational error of a lever member of the connector by an operator. A first operating part 35a of a first lever member 3a at a first position is positioned anterior to a second operating part 35b of a second lever member 3b at a third position, in relation to the pushing direction of the lever. Further, first operating part 35a of first lever member 3a projects further than second operating part 35b of second lever member 3b in the direction toward the front end of the lever or the operator side. Therefore, second lever member 3b is not likely to be an obstacle to the operation of first lever member 3a, and first lever member 3a is not likely to be an obstacle to the operation of second lever member 3b.
    Type: Grant
    Filed: October 14, 2011
    Date of Patent: August 14, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: Tatsuya Hayashi, Takayuki Nagumo
  • Publication number: 20120178312
    Abstract: Provided is a push-type connector having a structure for preventing an operational error of a lever member of the connector by an operator. A first operating part 35a of a first lever member 3a at a first position is positioned anterior to a second operating part 35b of a second lever member 3b at a third position, in relation to the pushing direction of the lever. Further, first operating part 35a of first lever member 3a projects further than second operating part 35b of second lever member 3b in the direction toward the front end of the lever or the operator side. Therefore, second lever member 3b is not likely to be an obstacle to the operation of first lever member 3a, and first lever member 3a is not likely to be an obstacle to the operation of second lever member 3b.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 12, 2012
    Inventors: Tatsuya Hayashi, Takayuki Nagumo
  • Publication number: 20120034824
    Abstract: Provided is a push-type connector having a structure for preventing an operational error of a lever member of the connector by an operator. A first operating part 35a of a first lever member 3a at a first position is positioned anterior to a second operating part 35b of a second lever member 3b at a third position, in relation to the pushing direction of the lever. Further, first operating part 35a of first lever member 3a projects further than second operating part 35b of second lever member 3b in the direction toward the front end of the lever or the operator side. Therefore, second lever member 3b is not likely to be an obstacle to the operation of first lever member 3a, and first lever member 3a is not likely to be an obstacle to the operation of second lever member 3b.
    Type: Application
    Filed: October 14, 2011
    Publication date: February 9, 2012
    Inventors: Tatsuya HAYASHI, Takayuki Nagumo
  • Patent number: 8062077
    Abstract: Provided is a push-type connector having a structure for preventing an operational error of a lever member of the connector by an operator. A first operating part 35a of a first lever member 3a at a first position is positioned anterior to a second operating part 35b of a second lever member 3b at a third position, in relation to the pushing direction of the lever. Further, first operating part 35a of first lever member 3a projects further than second operating part 35b of second lever member 3b in the direction toward the front end of the lever or the operator side. Therefore, second lever member 3b is not likely to be an obstacle to the operation of first lever member 3a, and first lever member 3a is not likely to be an obstacle to the operation of second lever member 3b.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: November 22, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Tatsuya Hayashi, Takayuki Nagumo
  • Patent number: 7868642
    Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: January 11, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Masahito Naito, Takayuki Nagumo
  • Publication number: 20100197152
    Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
    Type: Application
    Filed: April 8, 2010
    Publication date: August 5, 2010
    Inventors: Masahito NAITO, Takayuki Nagumo
  • Patent number: 7714602
    Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: May 11, 2010
    Assignee: 3M Innovative Properties Company
    Inventors: Masahito Naito, Takayuki Nagumo
  • Publication number: 20080024151
    Abstract: A simple structure socket 10 for connecting a ball grid array integrated circuit device to a test circuit has a base 14, contacts 26 arranged corresponding to the ball grid array, a nest assembly 16 of two comb structures 70 and a lever assembly 18 for spacing opposed tip portions of each contact away from each other to define a gap for receiving a ball. The lever assembly has two rectangular frames 86 each made of a distal cross piece 94, a proximal cross piece and two side pieces connecting the distal and proximal cross pieces. The two rectangular frames are arranged so that the side pieces are intersected at substantially mid portions thereof. This allows that, by depressing the proximal cross pieces toward the base, the distal cross pieces forces the comb structures toward each other.
    Type: Application
    Filed: April 13, 2005
    Publication date: January 31, 2008
    Applicant: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Masahito Naito, Takayuki Nagumo
  • Patent number: 5368497
    Abstract: The IC socket is capable of obtaining a stable engaging force to meet variations in thickness of the lead of an IC package, when the IC socket comprises a socket body, a plurality of contacts which are arranged on the socket body to be engaged with a plurality of leads while being resiliently depressed from above and a cover which is provided to be vertically movable for the socket body and to depress the contacts to displace them outwardly against their resilience to allow the contacts out of the electrical engagement when the cover is moved down, when the plurality of contacts respectively have a fixing portion which is fixed to the socket body, a contact portion for electrical engagement with the lead (L) of the IC package (P), a cantilever portion which enables the release of the lead (L) and the contact from electrical engagement by rotating or pivoting around the contact portion, and an engaging portion which comes into sliding engagement with the cover, the distance from the contact portion to the bott
    Type: Grant
    Filed: June 9, 1993
    Date of Patent: November 29, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Takayuki Nagumo
  • Patent number: 5352130
    Abstract: An IC socket including contacts capable of facilitating remounting of an IC package and ensuring a reliability of engagement with the IC package.
    Type: Grant
    Filed: June 8, 1993
    Date of Patent: October 4, 1994
    Assignee: Minnesota Mining & Manufacturing Company
    Inventor: Takayuki Nagumo
  • Patent number: 5352131
    Abstract: An IC socket for testing various IC packages is has guide sections to restrict the cover from tilting during operation without providing guide posts at four corners of the socket. The IC socket has a body with a plurality of contacts for electrical contact with leads of an IC package and a cover releasably loading the IC package on the socket body by vertical movement, a plurality of guide sections extending vertically being formed on the respective insides of four side surfaces of the cover, and a plurality of engaging sections for engaging with the guide sections, supporting vertical movement of the cover and preventing the cover from tilting during testing of the IC package, being formed respectively, on four side surfaces of the socket body.
    Type: Grant
    Filed: June 2, 1993
    Date of Patent: October 4, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Takayuki Nagumo
  • Patent number: 5306167
    Abstract: The present invention relates to an IC socket to be used for testing various IC packages, an object of which is to provide the IC socket with means facilitating insertion and removal of IC packages either in testing by employing an automatic loader or in testing with manual operation. It is constructed to have a socket body formed with a plurality of contacts for establishing electric contact with leads of an IC package, a cover 2 for removably fitting the IC package on the socket body, latches 4 having hooks 42 arranged at least at two diagonally opposing corners of said cover 2, and hooking to said socket body 1, and projections extending in the same direction to the hooks 42, releasing blocks 5 arranged in the vicinity of said latches and movable in the vertical direction with respect to said projection 43, and catching portions 11 formed in said socket body 1 and to be hooked the hook 42 of said latch 4.
    Type: Grant
    Filed: June 2, 1993
    Date of Patent: April 26, 1994
    Assignee: Minnesota Mining and Manufacturing Company
    Inventor: Takayuki Nagumo