Patents by Inventor Takayuki Nakayama
Takayuki Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240120627Abstract: A power storage device comprises: an electrode stack comprising a plurality of bipolar electrodes and a pair of outermost current collectors; an inner voltage detection terminal; a housing; and a pair of outer voltage detection terminals. Each of the plurality of bipolar electrodes has a current collector, a positive electrode active material layer, and a negative electrode active material layer. The inner voltage detection terminal is electrically connected to the current collector. Each of the pair of outer voltage detection terminals is thicker than the inner voltage detection terminal. The housing is located between the pair of outer voltage detection terminals in the stacking direction. A dimension of the housing in the stacking direction is equal to or less than a distance between the pair of outer voltage detection terminals in the stacking direction.Type: ApplicationFiled: August 28, 2023Publication date: April 11, 2024Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hiroyuki NAKAYAMA, Yuki OKAMOTO, Fumihiko ISHIGURO, Takayuki HIROSE
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Publication number: 20230294234Abstract: A polishing apparatus is configured to polish a peripheral edge of an object. The apparatus includes: a stage having a mounting surface to mount the object; a polishing head configured to press a polishing surface against the peripheral edge and polish the peripheral edge; a first inlet configured to supply liquid to the polishing surface; and a protector having a first surface extending along a first direction intersecting with the mounting surface, the first surface having an opening between the stage and the polishing head in a second direction intersecting with the first direction.Type: ApplicationFiled: September 1, 2022Publication date: September 21, 2023Applicant: Kioxia CorporationInventors: Takeshi KIKUCHI, Takayuki NAKAYAMA, Masayoshi ADACHI, Daisuke SUGIYAMA
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Publication number: 20220291010Abstract: A concentration sensor 36 is disposed behind a wheel 22, and for sensing salinity concentration of water bounced up by the wheel 22. A front nozzle 34 is disposed ahead the wheel 22, and for sprinkling water toward an area of the road surface on which the wheel 22 is to pass. A rear nozzle 35 is disposed between the wheel 22 and the front nozzle 34, and for sprinkling water toward the wheel.Type: ApplicationFiled: February 23, 2022Publication date: September 15, 2022Inventors: Naoto MIKAMI, Hideo SASAKI, Yukihiro NAKANO, Yutaka SUYA, Takeo YAMADA, Takayuki NAKAYAMA, Toru TOKUNAGA
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Patent number: 11225378Abstract: The present disclosure provides a buffer device for temporarily storing an article container for containing an article to be picked up, including: a placing unit on which the article container is placed and which is configured to transport the placed article container in a direction away from a pick-up area; a supply unit which supplies the article container from the pick-up area to an end area on a side of the placing unit close to the pick-up area; a movable carriage unit which is configured to travel in a transport direction of the article container in the placing unit and which allows the article container to be placed; and a transfer device which transfers the article container at least between the placing unit and the movable carriage unit.Type: GrantFiled: August 30, 2019Date of Patent: January 18, 2022Assignee: IHI CORPORATIONInventor: Takayuki Nakayama
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Patent number: 11161648Abstract: Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.Type: GrantFiled: January 8, 2019Date of Patent: November 2, 2021Assignee: Shin-Etsu Polymer Co., Ltd.Inventor: Takayuki Nakayama
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Patent number: 11092615Abstract: An acceleration-determination device (D) includes a gripping jig (1) that retains a gripping tool (1g) gripping a test piece (Y) in a state where the gripping tool is tilted from a horizontal state, detects a tilt angle of the gripping tool, and makes it possible to change a gripping force of the gripping tool, a mass adjuster (B) that adjusts a mass of the test piece such that a component force of gravity in a tilt direction which varies according to the tilt angle equals gravity acting on the test piece before tilting thereof, and an acceleration calculator (3b) that calculates an acceleration of the test piece when the test piece is detached from the gripping tool based on the tilt angle and a gravitational acceleration acting on the test piece when the test piece is detached from the gripping tool.Type: GrantFiled: August 2, 2019Date of Patent: August 17, 2021Assignee: IHI CORPORATIONInventors: Takayuki Nakayama, Yuji Kurata, Takuya Sunakawa
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Publication number: 20210247416Abstract: An acceleration-determination device (D) includes a gripping jig (1) that retains a gripping tool (1g) gripping a test piece (Y) in a state where the gripping tool is tilted from a horizontal state, detects a tilt angle of the gripping tool, and makes it possible to change a gripping force of the gripping tool, a mass adjuster (B) that adjusts a mass of the test piece such that a component force of gravity in a tilt direction which varies according to the tilt angle equals gravity acting on the test piece before tilting thereof, and an acceleration calculator (3b) that calculates an acceleration of the test piece when the test piece is detached from the gripping tool based on the tilt angle and a gravitational acceleration acting on the test piece when the test piece is detached from the gripping tool.Type: ApplicationFiled: August 2, 2019Publication date: August 12, 2021Applicant: IHI CORPORATIONInventors: Takayuki NAKAYAMA, Yuji KURATA, Takuya SUNAKAWA
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Publication number: 20210061517Abstract: Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.Type: ApplicationFiled: January 8, 2019Publication date: March 4, 2021Applicant: Shin-Etsu Polymer Co., Ltd.Inventor: Takayuki NAKAYAMA
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Publication number: 20190382202Abstract: The present disclosure provides a buffer device for temporarily storing an article container for containing an article to be picked up, including: a placing unit on which the article container is placed and which is configured to transport the placed article container in a direction away from a pick-up area; a supply unit which supplies the article container from the pick-up area to an end area on a side of the placing unit close to the pick-up area; a movable carriage unit which is configured to travel in a transport direction of the article container in the placing unit and which allows the article container to be placed; and a transfer device which transfers the article container at least between the placing unit and the movable carriage unit.Type: ApplicationFiled: August 30, 2019Publication date: December 19, 2019Applicant: IHI CorporationInventor: Takayuki NAKAYAMA
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Patent number: 10293454Abstract: In one embodiment, a polishing head includes an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface with a fluid pressure of the pressure fluid. The head further includes a first magnetic generator provided above a partition wall that separates the pressure rooms. The head further includes a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall.Type: GrantFiled: September 1, 2015Date of Patent: May 21, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takayuki Nakayama, Takashi Watanabe
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Publication number: 20180141156Abstract: A laser welding system is provided. The laser welding system includes a laser source configured to produce a laser beam, a beam modifier configured to split the laser beam into at least two heat source points positioned at a predetermined angle relative to one another along a diagonal intersecting and radially equidistant from a center of a circular weld line, the circular weld line being concentric with an object to be welded, a rotation unit configured to cause rotation of the at least one group of two heat source points or the object to be welded, and a controller configured to control the rotation unit to cause the at least one group of two heat source points to scan substantially all of the circular weld line.Type: ApplicationFiled: June 26, 2015Publication date: May 24, 2018Applicants: TOYOTA MOTOR EUROPE, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Akira TSUKUI, Takayuki NAKAYAMA
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Patent number: 9960071Abstract: A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.Type: GrantFiled: January 28, 2016Date of Patent: May 1, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takayuki Nakayama, Masayoshi Adachi
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Patent number: 9947555Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer. The apparatus further includes a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates. The wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer.Type: GrantFiled: February 2, 2016Date of Patent: April 17, 2018Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takashi Watanabe, Takayuki Nakayama, Jun Takayasu
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Patent number: 9849558Abstract: In one embodiment, a polishing pad dresser includes a first base portion, and first convex portions provided in a first region of the first base portion. Furthermore, a width of the first convex portions is 1 to 10 ?m, a height of the first convex portions is 0.5 to 10 ?m, and a density of the first convex portions in the first region is 0.1 to 50%.Type: GrantFiled: June 10, 2015Date of Patent: December 26, 2017Assignee: TOSHIBA MEMORY CORPORATIONInventors: Takayuki Nakayama, Dai Fukushima
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Patent number: 9588183Abstract: A secondary battery is charged at a predetermined charging current density to a first SOC, and discharged at a discharging current density same as the charging current density to a second SOC smaller than the first SOC, the voltage thereof is stabilized by leaving the secondary battery for a predetermined time while maintaining the secondary battery in the range of ±3° C. from the battery temperature of the secondary battery that has been discharged, the secondary battery the voltage of which has been stabilized is self-discharged under room temperature, and the presence or absence of a short-circuit is detected on the basis of a voltage drop amount after a given time.Type: GrantFiled: July 27, 2012Date of Patent: March 7, 2017Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takayuki Nakayama, Akio Minakuchi
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Publication number: 20170040189Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer. The apparatus further includes a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates. The wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer.Type: ApplicationFiled: February 2, 2016Publication date: February 9, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Takashi WATANABE, Takayuki NAKAYAMA, Jun TAKAYASU
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Publication number: 20170025283Abstract: A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.Type: ApplicationFiled: January 28, 2016Publication date: January 26, 2017Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki NAKAYAMA, Masayoshi ADACHI
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Publication number: 20160361792Abstract: In one embodiment, a polishing head includes an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface with a fluid pressure of the pressure fluid. The head further includes a first magnetic generator provided above a partition wall that separates the pressure rooms. The head further includes a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall.Type: ApplicationFiled: September 1, 2015Publication date: December 15, 2016Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Takayuki NAKAYAMA, Takashi Watanabe
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Publication number: 20160243672Abstract: In one embodiment, a polishing pad dresser includes a first base portion, and first convex portions provided in a first region of the first base portion. Furthermore, a width of the first convex portions is 1 to 10 ?m, a height of the first convex portions is 0.5 to 10 ?m, and a density of the first convex portions in the first region is 0.1 to 50%.Type: ApplicationFiled: June 10, 2015Publication date: August 25, 2016Applicant: Kabushiki Kaisha ToshibaInventors: Takayuki NAKAYAMA, Dai FUKUSHIMA
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Publication number: 20150212162Abstract: A secondary battery is charged at a predetermined charging current density to a first SOC, and discharged at a discharging current density same as the charging current density to a second SOC smaller than the first SOC, the voltage thereof is stabilized by leaving the secondary battery for a predetermined time while maintaining the secondary battery in the range of ±3° C. from the battery temperature of the secondary battery that has been discharged, the secondary battery the voltage of which has been stabilized is self-discharged under room temperature, and the presence or absence of a short-circuit is detected on the basis of a voltage drop amount after a given time.Type: ApplicationFiled: July 27, 2012Publication date: July 30, 2015Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Takayuki Nakayama, Akio Minakuchi