Patents by Inventor Takayuki Nakayama

Takayuki Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11161648
    Abstract: Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: November 2, 2021
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventor: Takayuki Nakayama
  • Patent number: 11092615
    Abstract: An acceleration-determination device (D) includes a gripping jig (1) that retains a gripping tool (1g) gripping a test piece (Y) in a state where the gripping tool is tilted from a horizontal state, detects a tilt angle of the gripping tool, and makes it possible to change a gripping force of the gripping tool, a mass adjuster (B) that adjusts a mass of the test piece such that a component force of gravity in a tilt direction which varies according to the tilt angle equals gravity acting on the test piece before tilting thereof, and an acceleration calculator (3b) that calculates an acceleration of the test piece when the test piece is detached from the gripping tool based on the tilt angle and a gravitational acceleration acting on the test piece when the test piece is detached from the gripping tool.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: August 17, 2021
    Assignee: IHI CORPORATION
    Inventors: Takayuki Nakayama, Yuji Kurata, Takuya Sunakawa
  • Publication number: 20210247416
    Abstract: An acceleration-determination device (D) includes a gripping jig (1) that retains a gripping tool (1g) gripping a test piece (Y) in a state where the gripping tool is tilted from a horizontal state, detects a tilt angle of the gripping tool, and makes it possible to change a gripping force of the gripping tool, a mass adjuster (B) that adjusts a mass of the test piece such that a component force of gravity in a tilt direction which varies according to the tilt angle equals gravity acting on the test piece before tilting thereof, and an acceleration calculator (3b) that calculates an acceleration of the test piece when the test piece is detached from the gripping tool based on the tilt angle and a gravitational acceleration acting on the test piece when the test piece is detached from the gripping tool.
    Type: Application
    Filed: August 2, 2019
    Publication date: August 12, 2021
    Applicant: IHI CORPORATION
    Inventors: Takayuki NAKAYAMA, Yuji KURATA, Takuya SUNAKAWA
  • Publication number: 20210061517
    Abstract: Provided is a panel storage container that can suppress flexure of the middle portions of the panels. A panel storage container has: a container body for storing panels; and a panel support means for supporting the panels. The panel support means has: a panel support portion for supporting right and left edges of the panels; a central support portion for supporting each middle portion of the panels; and elastic bodies for contacting the panels, the elastic bodies being provided along a front and rear direction of the central support portion at a predetermined interval.
    Type: Application
    Filed: January 8, 2019
    Publication date: March 4, 2021
    Applicant: Shin-Etsu Polymer Co., Ltd.
    Inventor: Takayuki NAKAYAMA
  • Publication number: 20190382202
    Abstract: The present disclosure provides a buffer device for temporarily storing an article container for containing an article to be picked up, including: a placing unit on which the article container is placed and which is configured to transport the placed article container in a direction away from a pick-up area; a supply unit which supplies the article container from the pick-up area to an end area on a side of the placing unit close to the pick-up area; a movable carriage unit which is configured to travel in a transport direction of the article container in the placing unit and which allows the article container to be placed; and a transfer device which transfers the article container at least between the placing unit and the movable carriage unit.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Applicant: IHI Corporation
    Inventor: Takayuki NAKAYAMA
  • Patent number: 10293454
    Abstract: In one embodiment, a polishing head includes an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface with a fluid pressure of the pressure fluid. The head further includes a first magnetic generator provided above a partition wall that separates the pressure rooms. The head further includes a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall.
    Type: Grant
    Filed: September 1, 2015
    Date of Patent: May 21, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takayuki Nakayama, Takashi Watanabe
  • Publication number: 20180141156
    Abstract: A laser welding system is provided. The laser welding system includes a laser source configured to produce a laser beam, a beam modifier configured to split the laser beam into at least two heat source points positioned at a predetermined angle relative to one another along a diagonal intersecting and radially equidistant from a center of a circular weld line, the circular weld line being concentric with an object to be welded, a rotation unit configured to cause rotation of the at least one group of two heat source points or the object to be welded, and a controller configured to control the rotation unit to cause the at least one group of two heat source points to scan substantially all of the circular weld line.
    Type: Application
    Filed: June 26, 2015
    Publication date: May 24, 2018
    Applicants: TOYOTA MOTOR EUROPE, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Akira TSUKUI, Takayuki NAKAYAMA
  • Patent number: 9960071
    Abstract: A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.
    Type: Grant
    Filed: January 28, 2016
    Date of Patent: May 1, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takayuki Nakayama, Masayoshi Adachi
  • Patent number: 9947555
    Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer. The apparatus further includes a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates. The wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: April 17, 2018
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takashi Watanabe, Takayuki Nakayama, Jun Takayasu
  • Patent number: 9849558
    Abstract: In one embodiment, a polishing pad dresser includes a first base portion, and first convex portions provided in a first region of the first base portion. Furthermore, a width of the first convex portions is 1 to 10 ?m, a height of the first convex portions is 0.5 to 10 ?m, and a density of the first convex portions in the first region is 0.1 to 50%.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: December 26, 2017
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Takayuki Nakayama, Dai Fukushima
  • Patent number: 9588183
    Abstract: A secondary battery is charged at a predetermined charging current density to a first SOC, and discharged at a discharging current density same as the charging current density to a second SOC smaller than the first SOC, the voltage thereof is stabilized by leaving the secondary battery for a predetermined time while maintaining the secondary battery in the range of ±3° C. from the battery temperature of the secondary battery that has been discharged, the secondary battery the voltage of which has been stabilized is self-discharged under room temperature, and the presence or absence of a short-circuit is detected on the basis of a voltage drop amount after a given time.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 7, 2017
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takayuki Nakayama, Akio Minakuchi
  • Publication number: 20170040189
    Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a wafer retaining module configured to retain a wafer by a chuck pin and to rotate the wafer. The apparatus further includes a wafer cleaning module configured to retain a cleaning member for cleaning a surface of the wafer and to rotate the cleaning member around a first rotation axis that is perpendicular to the surface of the wafer, the wafer cleaning module cleaning the surface of the wafer by moving the cleaning member on the surface of the wafer while the cleaning member contacts the wafer and rotates. The wafer cleaning module retains and rotates the cleaning member so that the first rotation axis does not pass through a contact region of the cleaning member with respect to the wafer.
    Type: Application
    Filed: February 2, 2016
    Publication date: February 9, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takashi WATANABE, Takayuki NAKAYAMA, Jun TAKAYASU
  • Publication number: 20170025283
    Abstract: A polishing apparatus according to an embodiment includes a first polishing part, a second polishing part, and an annular part. The second polishing part includes a mounting surface for a semiconductor substrate, and rubs the semiconductor substrate mounted on the mounting surface while pressing the semiconductor substrate against the first polishing part. The annular part includes a support part provided in the second polishing part, and a plurality of convex portions that project from the support part toward the first polishing part, are arranged in a circumferential direction around the mounting surface while being supported by the support part, and are movable in a radial direction of the semiconductor substrate.
    Type: Application
    Filed: January 28, 2016
    Publication date: January 26, 2017
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki NAKAYAMA, Masayoshi ADACHI
  • Publication number: 20160361792
    Abstract: In one embodiment, a polishing head includes an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface with a fluid pressure of the pressure fluid. The head further includes a first magnetic generator provided above a partition wall that separates the pressure rooms. The head further includes a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall.
    Type: Application
    Filed: September 1, 2015
    Publication date: December 15, 2016
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Takayuki NAKAYAMA, Takashi Watanabe
  • Publication number: 20160243672
    Abstract: In one embodiment, a polishing pad dresser includes a first base portion, and first convex portions provided in a first region of the first base portion. Furthermore, a width of the first convex portions is 1 to 10 ?m, a height of the first convex portions is 0.5 to 10 ?m, and a density of the first convex portions in the first region is 0.1 to 50%.
    Type: Application
    Filed: June 10, 2015
    Publication date: August 25, 2016
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Takayuki NAKAYAMA, Dai FUKUSHIMA
  • Publication number: 20150212162
    Abstract: A secondary battery is charged at a predetermined charging current density to a first SOC, and discharged at a discharging current density same as the charging current density to a second SOC smaller than the first SOC, the voltage thereof is stabilized by leaving the secondary battery for a predetermined time while maintaining the secondary battery in the range of ±3° C. from the battery temperature of the secondary battery that has been discharged, the secondary battery the voltage of which has been stabilized is self-discharged under room temperature, and the presence or absence of a short-circuit is detected on the basis of a voltage drop amount after a given time.
    Type: Application
    Filed: July 27, 2012
    Publication date: July 30, 2015
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Takayuki Nakayama, Akio Minakuchi
  • Patent number: 8942271
    Abstract: A blower apparatus includes a blower casing; an elastic member for mounting a mounting portion that projects on an outer circumferential portion of the blower casing, to a blower support member disposed on the inlet side of the mounting portion; and a flange portion provided on the inlet side of the mounting portion. At least three elastic members are disposed in the same plane that is almost orthogonal to a rotation shaft, and adhesion surfaces are provided on both ends, in the rotation shaft direction, of each elastic member. The mounting portion is fixed to one of the adhesion surfaces, and the blower support member is fixed to the other of the adhesion surfaces. The flange portion is provided so as to oppose the blower support member through a gap having a thickness less than a thickness, in the rotation shaft direction, of the elastic member.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: January 27, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kouji Funaoka, Takayuki Nakayama, Tomohiro Kyoto
  • Publication number: 20140086270
    Abstract: A blower apparatus includes a blower casing; an elastic member for mounting a mounting portion that projects on an outer circumferential portion of the blower casing, to a blower support member disposed on the inlet side of the mounting portion; and a flange portion provided on the inlet side of the mounting portion. At least three elastic members are disposed in the same plane that is almost orthogonal to a rotation shaft, and adhesion surfaces are provided on both ends, in the rotation shaft direction, of each elastic member. The mounting portion is fixed to one of the adhesion surfaces, and the blower support member is fixed to the other of the adhesion surfaces. The flange portion is provided so as to oppose the blower support member through a gap having a thickness less than a thickness, in the rotation shaft direction, of the elastic member.
    Type: Application
    Filed: June 9, 2011
    Publication date: March 27, 2014
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kouji Funaoka, Takayuki Nakayama, Tomohiro Kyoto
  • Patent number: 8475395
    Abstract: A method is provided for collecting a small blood sample by painlessly puncturing a finger. When the skin of a human being is punctured by a needle or another device at the depth that does not exceed 0.5 mm, pain accompanying the puncture is diminished or decreased. Regardless of an error in the depth of the puncture, the depth of puncture must not exceed this depth. The puncture site is located on the dorsal surface of a finger, in the area from the finger joint (IP joint of thumb, DIP joint of fingers other than thumb) to the proximal nail wall and the area extending from the proximal nail wall to the lateral nail wall.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: July 2, 2013
    Inventors: Toru Nakayama, Mariko Nakayama, Masafumi Nakayama, Takayuki Nakayama
  • Patent number: 8365919
    Abstract: A substrate storage container includes: a container body of a front open box type for holding a multiple number of semiconductor wafers supported in alignment by supporting ribs; a bottom plate removably attached to the bottom of the container body; and a pair of conveyor contact rails integrally formed along both the left and right sides of this bottom plate. These conveyor contact rails inhibit vibrations and impacts acting on the semiconductor wafers when the sealed container body is conveyed by a conveyor.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: February 5, 2013
    Assignee: Shin-Etsu Polymer Co., Ltd.
    Inventors: Takayuki Nakayama, Atsushi Sumi