Abstract: A vehicle seat provided with a seat cushion and a seat back, wherein the seat back is provided with: a urethane pad in which the surface is covered by a trim cover; and a pressure means in which a laterally extending shaft and a pair of pressing parts in the vertical direction relative to the shaft are formed on the reverse side of the urethane pad toward the side covered by the trim cover, and a configuration is adopted such that the shaft extending in the lateral direction of the pressure means rotates or swings, thereby causing the upper-side pressing part among the upper and lower pair of pressing parts to press the upper side of the urethane pad forward and the lower-side pressing part to press the lower side of the urethane pad forward.

Abstract: A seat cushion pad and a seat which enable reduction of a cost and improvement of use feeling are provided. The cushion pad (20) fixed in a seat frame (21) of the seat (1) includes a cushion pad body (31), and an air cell (30) which can be expanded and contracted by supplied/exhausted air. The air cell (30) is provided integrally with the cushion pad body (31) and is held by the cushion pad body (31).

Abstract: A vehicle seat provided with a seat cushion and a seat back, wherein the seat back is provided with: a urethane pad in which the surface is covered by a trim cover; and a pressure means in which a laterally extending shaft and a pair of pressing parts in the vertical direction relative to the shaft are formed on the reverse side of the urethane pad toward the side covered by the trim cover, and a configuration is adopted such that the shaft extending in the lateral direction of the pressure means rotates or swings, thereby causing the upper-side pressing part among the upper and lower pair of pressing parts to press the upper side of the urethane pad forward and the lower-side pressing part to press the lower side of the urethane pad forward.

Abstract: A seat cushion pad and a seat which enable reduction of a cost and improvement of use feeling are provided. The cushion pad (20) fixed in a seat frame (21) of the seat (1) includes a cushion pad body (31), and an air cell (30) which can be expanded and contracted by supplied/exhausted air. The air cell (30) is provided integrally with the cushion pad body (31) and is held by the cushion pad body (31).

Abstract: Printed active origami combines printed electronics with nanomaterial coated polymer based actuators to create active printed structures. The fabrication processes include the step of applying carbon nanomaterial coatings to polymeric films. Products produced by the processes include actuating materials, such as solid state actuators that can be used as active element(s) in a printable active origami robot.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Provided is a semiconductor device that suppresses the occurrence of defects due to photocorrosion. A method for manufacturing the semiconductor device includes the steps of: forming an insulating layer with a concave portion over a substrate; forming a conductive film over the insulating film and the inside of the concave portion; polishing and removing the conductive film positioned over the insulating layer; and cleaning the insulating layer in a light-shielded state. Between the step of polishing and the step of cleaning, or after the step of cleaning, the substrate SUB is moved by detecting the presence or absence of the substrate SUB in the light-shielded state using an infrared sensor.

Abstract: Printed active origami combines printed electronics with nanomaterial coated polymer based actuators to create active printed structures. The fabrication processes include the step of applying carbon nanomaterial coatings to polymeric films. Products produced by the processes include actuating materials, such as solid state actuators that can be used as active element(s) in a printable active origami robot.