Patents by Inventor Takayuki Ono

Takayuki Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9440479
    Abstract: A sheet processing apparatus includes a processing table to which a printed sheet is transported, a positioning member that positions the sheet, a cutter that cuts the positioned sheet into a binding margin portion and an image portion, and a taping unit that joins the binding margin portion and the image portion together with a tape in a state in which a gap is formed therebetween.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: September 13, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masashi Ishikawa, Takayuki Ono
  • Patent number: 9361048
    Abstract: A device management system includes a determining unit that acquires from a storage unit information relating to a setting of a first device and information relating to a setting of a second device, compares the acquired information, and determines whether the setting of the second device satisfies the setting of the first device; a selecting unit that is used when the determining unit determines that the setting of the second device does not satisfy the setting of the first device and is configured to select at least one device that is capable of satisfying the setting of the first device based on information relating to a setting of the at least one device stored in the storage unit; and an applying unit that applies to the at least one device selected by the selecting unit a setting value set up for the setting of the first device.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: June 7, 2016
    Assignee: Ricoh Company, Ltd.
    Inventor: Takayuki Ono
  • Patent number: 9352562
    Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: May 31, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Takahashi, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Masashi Ishikawa
  • Patent number: 9320154
    Abstract: An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: April 19, 2016
    Assignee: HITACHI, LTD.
    Inventors: Akira Soeda, Chiko Yorita, Shinichirou Tooya, Takayuki Ono, Mitsuru Takahira, Yuuichi Sekino, Akira Goto, Yoshimasa Tashiro, Hiroyuki Doi, Tsutomu Sakamoto
  • Publication number: 20160092351
    Abstract: A memory module having different types of memory mounted together on a double-sided substrate has a first edge and opposite second edge and includes a plurality of memory controllers, a plurality of flash memories, and a plurality of second memories having a higher signal transmission rate than the flash memories. A socket terminal for connecting the double-sided substrate to a motherboard is formed on the front surface and the back surface of the double-sided substrate on the first edge side; the memory controllers are disposed on the second edge side; the second memories are disposed on the second edge side at positions opposite the positions at which the memory controllers are disposed; and the flash memories are disposed on at least the back surface thereof at positions that are closer to the first edge than are the positions at which the memory controllers and the second memories are disposed.
    Type: Application
    Filed: June 20, 2013
    Publication date: March 31, 2016
    Inventors: Yutaka UEMATSU, Satoshi MURAOKA, Hiroshi KAKITA, Akio IDEI, Yusuke FUKUMURA, Satoru WATANABE, Takayuki ONO, Taishi SUMIKURA, Yuichi FUKUDA, Takashi MIYAGAWA, Michinori NAITO, Hideki OSAKA, Masabumi SHIBATA, Hitoshi UENO, Kazunori NAKAJIMA, Yoshihiro KONDO
  • Patent number: 9250677
    Abstract: An information processing apparatus may include an acquiring unit to periodically acquire, from an apparatus, information indicating an amount of power consumption stored for each of power supply states of the apparatus, a computation unit to compute a ratio of the amount of power consumption for each of the power supply states included in the information, for each information acquired by the acquiring unit, and an output unit to output information indicating a change in the ratio, based on an order of the information acquired.
    Type: Grant
    Filed: February 20, 2013
    Date of Patent: February 2, 2016
    Assignee: RICOH COMPANY, LTD.
    Inventor: Takayuki Ono
  • Publication number: 20150355846
    Abstract: When DRAMs that are high-speed memories and flash memories that are lower in speed but can be larger in capacity than the DRAM are to be mounted on a DIMM, what matters in maximizing CPU memory bus throughput is the arrangement of the mounted components. The present disclosure provides a memory module (DIMM) that includes memory controllers arranged on the module surface closer to a socket terminal and DRAMs serving as high-speed memories arranged on the back surface. Nonvolatile memories as large-capacity memories are arranged on the side farther from the socket terminal.
    Type: Application
    Filed: March 27, 2013
    Publication date: December 10, 2015
    Inventors: Yutaka UEMATSU, Satoshi MURAOKA, Hideki OSAKA, Masabumi SHIBATA, Yuusuke FUKUMURA, Satoru WATANABE, Hiroshi KAKITA, Akio IDEI, Hitoshi UENO, Takayuki ONO, Takashi MIYAGAWA, Michinori NAITO, Taishi SUMIKURA, Yuichi FUKUDA
  • Publication number: 20150347032
    Abstract: In methods connecting a memory module configured from DRAM, which is high-speed memory, and a memory module configured from flash memory which is slower than DRAM but is high-capacity memory, to a CPU memory bus, in the case of sequential reading, the busy rate of the CPU memory bus increases, and performance degradation occurs easily. In the present invention, an information processing device has a CPU, a CPU memory bus, and a primary storage device. The primary storage device has a first memory module and a second memory module. The first memory module has high-speed memory. The second memory module has memory having the same memory interface as that of the high-speed memory, high-capacity memory having a different memory interface from that of the high-speed memory, and a controller that controls same. The first memory module and second memory module are caused to be accessed by the memory interface of the high-speed memory.
    Type: Application
    Filed: March 27, 2013
    Publication date: December 3, 2015
    Inventors: Satoshi MURAOKA, Yutaka UEMATSU, Hideki OSAKA, Yuusuke FUKUMURA, Satoru WATANABE, Masabumi SHIBATA, Hiroshi KAKITA, Yuichi FUKUDA, Takashi MIYAGAWA, Michinori NAITO, Hitoshi UENO, Akio IDEI, Takayuki ONO, Taishi SUMIKURA
  • Publication number: 20150333981
    Abstract: An information processing apparatus includes: a software information acquiring unit that acquires, from a terminal device, software information on software running on the terminal device; a specifying unit that specifies region information on a region to which a user using the terminal device belongs, on the basis of the software information; a device management information acquiring unit that acquires device management information on usage of a device; a generating unit that generates a report on the basis of the region information and the device management information; and an output unit that outputs the report to the terminal device.
    Type: Application
    Filed: April 22, 2015
    Publication date: November 19, 2015
    Inventor: Takayuki ONO
  • Publication number: 20150331645
    Abstract: A device management system includes a determining unit that acquires from a storage unit information relating to a setting of a first device and information relating to a setting of a second device, compares the acquired information, and determines whether the setting of the second device satisfies the setting of the first device; a selecting unit that is used when the determining unit determines that the setting of the second device does not satisfy the setting of the first device and is configured to select at least one device that is capable of satisfying the setting of the first device based on information relating to a setting of the at least one device stored in the storage unit; and an applying unit that applies to the at least one device selected by the selecting unit a setting value set up for the setting of the first device.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Applicant: RICOH COMPANY, LTD.
    Inventor: Takayuki ONO
  • Patent number: 9150016
    Abstract: A support substrate and a liquid ejecting element substrate are bonded to each other with an adhesive agent to manufacture a liquid ejection head. The support substrate is provided with a liquid supply port and a recess or through-hole in its main surface. The adhesive agent is applied onto the main surface of the support substrate by means of a roller holding the adhesive agent on its peripheral surface by moving the support substrate and the roller relative to each other such that the recess or through-hole faces the roller before the liquid supply port faces the roller.
    Type: Grant
    Filed: December 6, 2012
    Date of Patent: October 6, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Otaka, Takayuki Ono
  • Patent number: 9122427
    Abstract: A device management system includes a determining unit that acquires from a storage unit information relating to a setting of a first device and information relating to a setting of a second device, compares the acquired information, and determines whether the setting of the second device satisfies the setting of the first device; a selecting unit that is used when the determining unit determines that the setting of the second device does not satisfy the setting of the first device and is configured to select at least one device that is capable of satisfying the setting of the first device based on information relating to a setting of the at least one device stored in the storage unit; and an applying unit that applies to the at least one device selected by the selecting unit a setting value set up for the setting of the first device.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: September 1, 2015
    Assignee: RICOH COMPANY, LTD.
    Inventor: Takayuki Ono
  • Patent number: 9085142
    Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: July 21, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
  • Patent number: 8955223
    Abstract: A liquid adhesive is applied onto a surface of a base plate having flow channels formed as recesses or through-grooves, by transferring the liquid adhesive from a rotating cylinder coated with it to the surface of the base plate. The base plate is then bonded to a cover plate having ejection energy generating elements via the applied adhesive to be made into a liquid ejection head. For evenly applying the liquid adhesive onto the surface having the recesses or through-grooves as flow channels, the surface is additionally provided with dummy recesses for compensating for variance of contact length orthogonal to the transfer direction due to uneven or asymmetrical arrangement of the recesses or through-grooves.
    Type: Grant
    Filed: November 20, 2012
    Date of Patent: February 17, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takayuki Ono, Shimpei Otaka
  • Patent number: 8919927
    Abstract: A liquid ejection head includes two or more substrates disposed side by side, each having energy generating elements and primary terminals electrically connected to the respective energy generating elements, and an electrical wiring member having primary flying leads electrically connected to the respective primary terminals by means of gang bonding. Each of the substrates has an auxiliary terminal located adjacent to the primary terminals and the auxiliary terminals of the two or more substrates are disposed adjacent to each other. The electrical wiring member has an auxiliary flying lead connected to the auxiliary terminals of the substrates by means of a gang bonding system.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: December 30, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Takayuki Ono
  • Publication number: 20140353018
    Abstract: An electrode connected to a TH pad requiring electric conduction is formed on a bonded surface of a first multilayer substrate having piercing TH to form a solder bump on the electrode. An electrode connected to the TH pad is formed on a bonded surface of a second multilayer substrate to be bonded having a piercing TH at a position opposite the electrode formed on the first multilayer substrate to form a solder bump on the electrode. A three-layered sheet is formed by applying an adhesive as a resin material that is not completely cured to both surfaces of a core material as the cured resin, and has holes at positions corresponding to the TH and the solder bump, respectively. The first and the second multilayer substrates are then laminated having the bonded surfaces facing each other while having the three-layered sheet positioned and interposed therebetween, and batch thermocompression bonded.
    Type: Application
    Filed: May 27, 2014
    Publication date: December 4, 2014
    Applicant: HITACHI, LTD.
    Inventors: Akira SOEDA, Chiko YORITA, Shinichirou TOOYA, Takayuki ONO, Mitsuru TAKAHIRA, Yuuichi SEKINO, Akira GOTO, Yoshimasa TASHIRO, Hiroyuki DOI, Tsutomu SAKAMOTO
  • Patent number: 8878439
    Abstract: According to one embodiment, a lighting control system includes a plurality of luminaire, a sensor device, a luminance sensor, and a lighting control unit. The luminaires are set in a lighting space. The sensor device detects presence of a person in the lighting space. The luminance sensor detects indirect luminance in a predetermined position in the lighting space by the luminaire. The lighting control unit subjects the luminaire to lighting control such that the indirect luminance detected by the luminance sensor does not fall below a predetermined value in a position where the sensor device detects presence of the person.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: November 4, 2014
    Assignee: Toshiba Lighting & Technology Corporation
    Inventors: Yoko Noguchi, Tomoko Ishiwata, Makoto Kawagoe, Takayuki Ono, Kenji Takahashi, Hidenori Nishigaki, Junko Takahashi, Shigehisa Kawatsuru, Hitoshi Kawano, Fumie Iwata
  • Publication number: 20140313543
    Abstract: A device management system includes a determining unit that acquires from a storage unit information relating to a setting of a first device and information relating to a setting of a second device, compares the acquired information, and determines whether the setting of the second device satisfies the setting of the first device; a selecting unit that is used when the determining unit determines that the setting of the second device does not satisfy the setting of the first device and is configured to select at least one device that is capable of satisfying the setting of the first device based on information relating to a setting of the at least one device stored in the storage unit; and an applying unit that applies to the at least one device selected by the selecting unit a setting value set up for the setting of the first device.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 23, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventor: Takayuki ONO
  • Publication number: 20140308093
    Abstract: A sheet processing apparatus includes a processing table to which a printed sheet is transported, a positioning member that positions the sheet, a cutter that cuts the positioned sheet into a binding margin portion and an image portion, and a taping unit that joins the binding margin portion and the image portion together with a tape in a state in which a gap is formed therebetween.
    Type: Application
    Filed: February 27, 2014
    Publication date: October 16, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Masashi Ishikawa, Takayuki Ono
  • Publication number: 20140300277
    Abstract: Plural luminaires are installed in a lighting space surrounded by a wall part. A sensor equipment detects existence or nonexistence of a person in the lighting space. If existence of a person in the lighting space is detected, the sensor equipment detects a direction of the person. The sensor equipment detects a distance between the wall part positioned in front of the direction of the person and the person. A lighting control unit selectively switches between a first control for performing lighting control of the luminaires to illuminate the wall part positioned in front of the direction of the person if the detected distance is a specified distance or less, and a second control for performing lighting control of the luminaires to reduce brightness at a place as the place becomes farther from a position of the person if the detected distance is larger than the specified distance.
    Type: Application
    Filed: April 1, 2014
    Publication date: October 9, 2014
    Applicant: TOSHIBA LIGHTING AND TECHNOLOGY CORPORATION
    Inventors: Takayuki ONO, Tomoko ISHIWATA, Yoko NOGUCHI, Makoto KAWAGOE, Kenji TAKAHASHI, Hidenori NISHIGAKI, Junko TAKAHASHI, Shigehisa KAWATSURU, Hitoshi KAWANO, Fumie IWATA, Katsusuke UCHINO