Abstract: A semiconductor device assembled as a compact tape carrier package (TCP) for tape-automated bonding(TAB). An IC chip 3 has a connection surface provided with bump electrodes 15. A flexible base film 7, carrying leads 8 and having a device hole 21 smaller than the semiconductor chip's connection surface, faces the IC chip's connection surface across a small prescribed gap 22. Inner leads 8a, 8a' extending from base film 7 through device hole 21 are bonded to bump electrodes 15 on IC chip 3. To maintain gap 22 during inner lead bonding and resin sealing the chip's connection face or the base film 7 is provided with spacer projections 35 or 55 of the same length as gap 22. During inner lead bonding the spacer projections prevent base film 7 from deforming so as to dislocate inner leads 8a, 8a' from their corresponding bump electrodes. During sealing the spacer projections enable sealing resin 13 to easily flow through gap 22 to evenly coat the chip's face and sides.