Patents by Inventor Takayuki SAISU

Takayuki SAISU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11766751
    Abstract: Provided is a laser machine which achieves an enhanced durability against laser beam irradiation. A workpiece transfer device for carrying a workpiece into and out of a workpiece machining chamber, has a turntable device and a partition wall. The partition wall is secured to the top surface of the turntable device, partitioning the top surface of the turntable device into a plurality of workpiece mounting tables on which workpieces can be mounted. The partition wall has: a first plate forming one surface of the partition wall and formed of aluminum alloy; a second plate forming the other surface of the partition wall and formed of aluminum alloy; and a frame for securing the first plate and the second plate in a spaced apart relationship.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: September 26, 2023
    Assignee: KOMATSU INDUSTRIES CORPORATION
    Inventors: Youichirou Shimizu, Takayuki Saisu
  • Publication number: 20210086318
    Abstract: Provided is a laser machine which achieves an enhanced durability against laser beam irradiation. A workpiece transfer device for carrying a workpiece into and out of a workpiece machining chamber, has a turntable device and a partition wall. The partition wall is secured to the top surface of the turntable device, partitioning the top surface of the turntable device into a plurality of workpiece mounting tables on which workpieces can be mounted. The partition wall has: a first plate forming one surface of the partition wall and formed of aluminum alloy; a second plate forming the other surface of the partition wall and formed of aluminum alloy; and a frame for securing the first plate and the second plate in a spaced apart relationship.
    Type: Application
    Filed: April 18, 2018
    Publication date: March 25, 2021
    Applicant: KOMATSU INDUSTRIES CORPORATION
    Inventors: Youichirou SHIMIZU, Takayuki SAISU