Abstract: A measuring apparatus includes a first substrate, an oscillator circuit, and an arithmetic circuit. The first substrate is made of a dielectric and has a first signal line and a ground conductor. A living body is to be pressed against the first signal line. The oscillator circuit produces a first signal of alternating current. The arithmetic circuit acquires biological information based on a comparison between a second signal and a third signal. The second signal corresponds to the first signal that passes through the first signal line. The third signal corresponds to the first signal that does not pass through the first signal line.

Abstract: A method for manufacturing an electronic component comprises a step of forming an intermediate body including an insulator containing a resin and a conductive main body provided inside the insulator. The method further includes a step of forming an external electrode provided on the intermediate body and electrically coupled to the conductive main body. The method further includes a step of oxidizing the conductive main body, after forming the intermediate body including the insulator and the main body provided inside the insulator, to form an outer coating film on at least a part of a peripheral surface of the conductive main body.

Abstract: A measuring device includes a first light emitting section that emits first light; a light collecting section that has a first surface, a second surface that faces the first surface and that has a larger area than the first surface, and a wall surface that connects the first surface and the second surface and that allows the first light to pass therethrough; a light receiving section that is disposed on the first surface to receive the first light irradiated onto a living body from the second surface and returned from the living body; and a calculation section that receives an output from the light receiving section to calculate numerical information regarding the living body.

Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.

Abstract: A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion.

Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: In an embodiment, a coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate rectangle, wherein the line length of the curved line parts along the inner periphery of the opening part is no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.

Abstract: One object of the present invention is to provide a compact coil component with superior characteristics. An electronic component according one embodiment includes an insulator and a coil portion. The insulator is formed of a non-magnetic material. The insulator includes a width direction in a first axial direction, a length direction in a second axial direction, and a height direction in a third axial direction. The coil portion includes a circumference section. The circumference section is wound around the first axial direction. The coil portion is arranged inside the insulator. The first ratio of a height to a length of the insulator is 1.5 times or less of a second ratio of a height between first inner peripheral portions of the circumference section along the third axial direction with respect to a length between second inner peripheral portions of the circumference section along the second axial direction.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: In an embodiment, a coil component includes: an element body part 10; a coil conductor 36 constituted by first conductors 32 extending along the pair of end faces 16 and orthogonally to a bottom face 14, as well as second conductors 34 extending from one side, to the other side, of the pair of end faces and thereby connecting the multiple first conductors 32; lead conductor parts 38 electrically connected to two ends of the coil conductor, respectively; and a pair of external electrodes 50 electrically connected to the lead conductor parts; wherein at least one end of the coil conductor is electrically connected, via the lead conductor, to the external electrode at a top face 12 of the element body part; and the coil conductor extends from the at least the one end, using a second conductor, along and near the top face.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.

Abstract: A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion.

Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.