Patents by Inventor Takayuki SEKIGUCHI
Takayuki SEKIGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240145507Abstract: Provided is an imaging device capable of further suppressing color mixing between pixels. The imaging device includes: a semiconductor substrate provided with a photoelectric conversion unit for each of pixels two-dimensionally arranged; a color filter provided for each of the pixels on the semiconductor substrate; an intermediate layer provided between the semiconductor substrate and the color filter; and a low refraction region provided between the pixels by separating at least the color filter and the intermediate layer for each of the pixels, the low refraction region having a refractive index lower than a refractive index of the color filter.Type: ApplicationFiled: February 4, 2022Publication date: May 2, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Koji SEKIGUCHI, Kaito YOKOCHI, Takayuki OGASAHARA, Shigehiro IKEHARA, Chigusa YAMANE, Hideki KOBAYASHI, Hiroshi SAITO
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Patent number: 11955276Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.Type: GrantFiled: August 2, 2021Date of Patent: April 9, 2024Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino
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Patent number: 11837400Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: GrantFiled: August 31, 2020Date of Patent: December 5, 2023Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
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Publication number: 20220246361Abstract: A multi-terminal capacitor is provided that can be used either as a feedthrough capacitor or as a LW reversal capacitor. A multi-terminal capacitor includes a capacitor body shaped like a rectangular parallelepiped. The capacitor body includes a capacitance forming portion configured to form capacitance between a first conductor film and a second conductor film facing each other with a dielectric film being interposed therebetween. On one of the surfaces of the capacitor body in the third direction, first and second external terminals electrically connected to the first conductor film, and a third external terminal electrically connected to the second conductor film are provided. On the other of the surfaces of the capacitor body in the third direction, fourth and fifth external terminals electrically connected to the first conductor film and a sixth external terminal electrically connected to the second conductor film are provided.Type: ApplicationFiled: February 19, 2020Publication date: August 4, 2022Inventors: Riki SUEMASA, Takayuki SEKIGUCHI
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Patent number: 11309134Abstract: A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion.Type: GrantFiled: July 29, 2019Date of Patent: April 19, 2022Assignee: Taiyo Yuden Co., Ltd.Inventors: Riki Suemasa, Takayuki Sekiguchi
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Publication number: 20210366637Abstract: A coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate quadrangle, wherein the line length of the curved line parts along the inner periphery of the opening part is 20% or more but no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.Type: ApplicationFiled: August 2, 2021Publication date: November 25, 2021Inventors: Takayuki SEKIGUCHI, Tsuyoshi OGINO
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Patent number: 11114229Abstract: In an embodiment, a coil component includes an insulator part and a coil part. The insulator part is constituted by an electrical insulation material, and is no more than 600 ?m long and no more than 600 ?m high. The coil part is wound around one axis and placed inside the insulator part. The coil part has an opening part constituted by straight line parts and curved line parts and whose shape as viewed from the one axis direction is an approximate rectangle, wherein the line length of the curved line parts along the inner periphery of the opening part is no more than 40% of the line length of the inner periphery of the opening part. The coil component can satisfy both a size reduction need and the properties need.Type: GrantFiled: June 27, 2018Date of Patent: September 7, 2021Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino
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Patent number: 11024455Abstract: One object of the present invention is to provide a compact coil component with superior characteristics. An electronic component according one embodiment includes an insulator and a coil portion. The insulator is formed of a non-magnetic material. The insulator includes a width direction in a first axial direction, a length direction in a second axial direction, and a height direction in a third axial direction. The coil portion includes a circumference section. The circumference section is wound around the first axial direction. The coil portion is arranged inside the insulator. The first ratio of a height to a length of the insulator is 1.5 times or less of a second ratio of a height between first inner peripheral portions of the circumference section along the third axial direction with respect to a length between second inner peripheral portions of the circumference section along the second axial direction.Type: GrantFiled: March 22, 2017Date of Patent: June 1, 2021Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino
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Publication number: 20200402691Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: ApplicationFiled: August 31, 2020Publication date: December 24, 2020Inventors: Takayuki SEKIGUCHI, Tsuyoshi OGINO, Takao SHIBUYA
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Patent number: 10867743Abstract: In an embodiment, a coil component includes: an element body part 10; a coil conductor 36 constituted by first conductors 32 extending along the pair of end faces 16 and orthogonally to a bottom face 14, as well as second conductors 34 extending from one side, to the other side, of the pair of end faces and thereby connecting the multiple first conductors 32; lead conductor parts 38 electrically connected to two ends of the coil conductor, respectively; and a pair of external electrodes 50 electrically connected to the lead conductor parts; wherein at least one end of the coil conductor is electrically connected, via the lead conductor, to the external electrode at a top face 12 of the element body part; and the coil conductor extends from the at least the one end, using a second conductor, along and near the top face.Type: GrantFiled: September 22, 2017Date of Patent: December 15, 2020Assignee: TAIYO YUDEN CO., LTD.Inventors: Takayuki Sekiguchi, Ichiro Yokoyama, Masuo Yatabe, Noriyuki Mabuchi, Tomoyuki Oyoshi
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Patent number: 10804016Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: GrantFiled: April 9, 2020Date of Patent: October 13, 2020Assignee: Taiyo Yuden Co., Ltd.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
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Publication number: 20200258679Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.Type: ApplicationFiled: May 1, 2020Publication date: August 13, 2020Inventors: Tsuyoshi OGINO, Takayuki SEKIGUCHI, Koji OTSUKA
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Publication number: 20200234862Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: ApplicationFiled: April 9, 2020Publication date: July 23, 2020Inventors: Takayuki SEKIGUCHI, Tsuyoshi OGINO, Takao SHIBUYA
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Patent number: 10679786Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.Type: GrantFiled: November 28, 2018Date of Patent: June 9, 2020Assignee: TAIYO YUDEN CO., LTD.Inventors: Tsuyoshi Ogino, Takayuki Sekiguchi, Koji Otsuka
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Patent number: 10658098Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: GrantFiled: July 26, 2019Date of Patent: May 19, 2020Assignee: Taiyo Yuden Co., Ltd.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
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Publication number: 20200051749Abstract: A capacitor according to one embodiment of the present invention relates to a thin film capacitor including a base member and a MIM structure provided on the base member. The thin film capacitor includes a first external electrode and a second external electrode that are electrically connected to the MIM structure. The base member has a plurality of through holes penetrating between a first surface and a second surface of the base member. The MIM structure includes a first portion extending along the first surface of the base member, a second portion extending along the second surface of the base member, and a third portion provided in the plurality of through holes of the base member so as to connect the first portion to the second portion.Type: ApplicationFiled: July 29, 2019Publication date: February 13, 2020Inventors: Riki SUEMASA, Takayuki SEKIGUCHI
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Publication number: 20190348204Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: ApplicationFiled: July 26, 2019Publication date: November 14, 2019Inventors: Takayuki SEKIGUCHI, Tsuyoshi OGINO, Takao SHIBUYA
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Patent number: 10418162Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.Type: GrantFiled: August 30, 2018Date of Patent: September 17, 2019Assignee: Taiyo Yuden Co., Ltd.Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
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Patent number: 10312015Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.Type: GrantFiled: January 23, 2017Date of Patent: June 4, 2019Assignee: TAIYO YUDEN CO., LTD.Inventors: Tsuyoshi Ogino, Takayuki Sekiguchi, Koji Otsuka
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Publication number: 20190148056Abstract: An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator may be formed of a material that contains resin. The internal conductor is provided inside the insulator and includes a conductive main body and an outer coating film that is provided on at least a part of a peripheral surface of the conductive main body and has a resistivity higher than the conductive main body. The external electrode is disposed on the insulator and electrically coupled to the internal conductor.Type: ApplicationFiled: November 28, 2018Publication date: May 16, 2019Inventors: Tsuyoshi OGINO, Takayuki SEKIGUCHI, Koji OTSUKA