Patents by Inventor Takayuki Shirasaki
Takayuki Shirasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11815749Abstract: A functional element housing package includes a pin terminal disposed in an outer region of a housing for housing a functional element. A wiring substrate is connected with the pin terminal. The wiring substrate includes a through hole for receiving the pin terminal, a first metallic layer disposed around an opening of the through hole on a side of the wiring substrate which side is located close to the housing, a second metallic layer disposed around an opening of the through hole on a side of the wiring substrate which is opposed to the side located close to the housing, the second metallic layer being greater in area than the first metallic layer, a connection wiring line connected to the first metallic layer or the second metallic layer, and a solder which connects the pin terminal to each of the first metallic layer and the second metallic layer.Type: GrantFiled: March 27, 2017Date of Patent: November 14, 2023Assignee: Kyocera CorporationInventors: Hiroyuki Nakamichi, Takayuki Shirasaki
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Publication number: 20220406727Abstract: Provided is a lid of an electronic component-housing package. The lid includes a conductor layer and a dielectric layer. The conductor layer includes at least one opening and a first part surrounding the at least one opening. The dielectric layer includes a second part, a first dielectric layer, and a second dielectric layer. The second part is located in the at least one opening. The first dielectric layer lies on the top of the conductor layer. The second part lies on the underside of the conductor layer.Type: ApplicationFiled: October 26, 2020Publication date: December 22, 2022Applicant: KYOCERA CorporationInventor: Takayuki SHIRASAKI
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Publication number: 20210208428Abstract: A functional element housing package includes a pin terminal disposed in an outer region of a housing for housing a functional element. A wiring substrate is connected with the pin terminal. The wiring substrate includes a through hole for receiving the pin terminal, a first metallic layer disposed around an opening of the through hole on a side of the wiring substrate which side is located close to the housing, a second metallic layer disposed around an opening of the through hole on a side of the wiring substrate which is opposed to the side located close to the housing, the second metallic layer being greater in area than the first metallic layer, a connection wiring line connected to the first metallic layer or the second metallic layer, and a solder which connects the pin terminal to each of the first metallic layer and the second metallic layer.Type: ApplicationFiled: March 27, 2017Publication date: July 8, 2021Applicant: KYOCERA CorporationInventors: Hiroyuki NAKAMICHI, Takayuki SHIRASAKI
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Patent number: 10777493Abstract: A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor. The first substrate includes a mount area and a peripheral area. The second substrate is located in the peripheral area to align with an outer edge of the first substrate and surrounds the mount area. The signal line extends on an upper surface of the second substrate from an inner edge to an outer edge of the second substrate. The groove extends on a side surface of the first substrate from a lower surface to an upper surface of the first substrate. The feedthrough conductor is inside the second substrate and connected to the signal line. The side conductor is on an inner surface of the groove and electrically connected to the feedthrough conductor. The groove is inward from the outer edge of the second substrate.Type: GrantFiled: July 24, 2017Date of Patent: September 15, 2020Assignee: KYOCERA CORPORATIONInventors: Taito Kimura, Takayuki Shirasaki
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Patent number: 10629505Abstract: An electronic component mounting package includes a dielectric substrate between first portions of a pair of signal terminals that protrude from one side in a thickness direction from a first face of a base body. This dielectric substrate has a height lower than a height of the first portions. When an electronic component is mounted, a bonding wire is connected to a tip of each of the first portions to electrically connect the first portion to the electronic component.Type: GrantFiled: August 19, 2016Date of Patent: April 21, 2020Assignee: Kyocera CorporationInventors: Takayuki Shirasaki, Masahiko Taniguchi, Takashi Miyauchi
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Patent number: 10462904Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.Type: GrantFiled: November 15, 2018Date of Patent: October 29, 2019Assignee: Kyocera CorporationInventor: Takayuki Shirasaki
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Publication number: 20190269014Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.Type: ApplicationFiled: November 15, 2018Publication date: August 29, 2019Applicant: KYOCERA CorporationInventor: Takayuki SHIRASAKI
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Publication number: 20190221507Abstract: A semiconductor device mounting board includes a first substrate, a second substrate, a single line, a groove, a feedthrough conductor, and a side conductor. The first substrate includes a mount area and a peripheral area. The second substrate is located in the peripheral area to align with an outer edge of the first substrate and surrounds the mount area. The signal line extends on an upper surface of the second substrate from an inner edge to an outer edge of the second substrate. The groove extends on a side surface of the first substrate from a lower surface to an upper surface of the first substrate. The feedthrough conductor is inside the second substrate and connected to the signal line. The side conductor is on an inner surface of the groove and electrically connected to the feedthrough conductor. The groove is inward from the outer edge of the second substrate.Type: ApplicationFiled: July 24, 2017Publication date: July 18, 2019Applicant: KYOCERA CorporationInventors: Taito KIMURA, Takayuki SHIRASAKI
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Patent number: 10136517Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.Type: GrantFiled: November 24, 2016Date of Patent: November 20, 2018Assignee: Kyocera CorporationInventor: Takayuki Shirasaki
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Publication number: 20180255641Abstract: An electronic component mounting package includes a body portion which accommodates an electronic component; a flexible substrate. The body portion comprises a notched portion which is open to a lower surface and a side surface thereof, and is provided with a projecting ridge portion which extends along a side end portion of the notched portion on a side surface side of the notched body portion. The flexible substrate extends from an interior of the notched portion to an exterior of the notched portion, and comprises a fixed end portion joined to a terminal of a coaxial connector disposed on a bottom surface of the notched portion, and a free end portion extending to the exterior of the notched portion. The flexible substrate abuts on the projecting ridge portion to be bent.Type: ApplicationFiled: November 24, 2016Publication date: September 6, 2018Applicant: KYOCERA CorporationInventor: Takayuki SHIRASAKI
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Publication number: 20180145003Abstract: An electronic component mounting package includes a dielectric substrate between first portions of a pair of signal terminals that protrude from one side in a thickness direction from a first face of a base body. This dielectric substrate has a height lower than a height of the first portions. When an electronic component is mounted, a bonding wire is connected to a tip of each of the first portions to electrically connect the first portion to the electronic component.Type: ApplicationFiled: August 19, 2016Publication date: May 24, 2018Applicant: KYOCERA CorporationInventors: Takayuki SHIRASAKI, Masahiko TANIGUCHI, Takashi MIYAUCHI
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Patent number: 9596779Abstract: An element housing package is provided with: a base plate including, on a top surface, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body including a through-hole; a connector disposed so as to pass through the through-hole T of the frame body and to extend from the inside to the outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding material placed therebetween and connected to the connector.Type: GrantFiled: August 27, 2014Date of Patent: March 14, 2017Assignee: Kyocera CorporationInventor: Takayuki Shirasaki
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Publication number: 20160081216Abstract: An element housing package is provided with: a base plate including, on a top surface, a mounting region for mounting an element; a frame body disposed on the top surface of the base plate so as to surround the mounting region, the frame body including a through-hole; a connector disposed so as to pass through the through-hole T of the frame body and to extend from the inside to the outside of the frame body; a pedestal member disposed on the top surface of the base plate so as to be positioned in the frame body; and a wiring base plate bonded to a top surface of the pedestal member with a first bonding material placed therebetween and connected to the connector.Type: ApplicationFiled: August 27, 2014Publication date: March 17, 2016Applicant: KYOCERA CorporationInventor: Takayuki SHIRASAKI
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Patent number: 8358180Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furthermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.Type: GrantFiled: September 29, 2008Date of Patent: January 22, 2013Assignee: Kyocera CorporationInventors: Yoshimasa Sugimoto, Takayuki Shirasaki
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Publication number: 20100308940Abstract: A high frequency wiring board includes a dielectric substrate, a line conductor for high frequency signal transmission formed on a first surface of the dielectric substrate from a connection end to an end, a ground conductor which is disposed aligned with one side of the line conductor with a distance therebetween, and is disposed so as to cross over a hypothetical extension line extending from the end in parallel with a line direction of the line conductor, and a terminating resistor configured to electrically connect an end portion of the line conductor and the ground conductor.Type: ApplicationFiled: January 30, 2009Publication date: December 9, 2010Applicant: KYOCERA CORPORATIONInventor: Takayuki Shirasaki
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Publication number: 20100231332Abstract: A high-frequency module has a wiring board including a dielectric substrate, a line conductor that is formed on a first surface of the dielectric substrate, and a first grounding conductor layer that is formed on a second surface opposed to the first surface of the dielectric substrate, and that has a first opening and a second opening disposed around the first opening; and a waveguide that is connected to the second surface, has an opening opposed to the first opening, and is electromagnetically coupled to the line conductor. The wiring board has a vertical choke portion that at least partially extends from the second opening in a direction perpendicular to the second surface. Furthermore, a horizontal choke portion is formed between the wiring board and the waveguide, along the second surface between the opening of the waveguide and the second opening.Type: ApplicationFiled: September 29, 2008Publication date: September 16, 2010Applicant: KYOCERA CORPORATIONInventors: Yoshimasa Sugimoto, Takayuki Shirasaki
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Patent number: 6873230Abstract: The problem is that, since a coplanar ground conductor located immediately below a line conductor is absent near a through conductor for providing connection between the one ends of the line conductors each having the coplanar ground conductor, characteristic impedance mismatch occurs and this leads to poor transmission characteristics. The invention provides a high-frequency wiring board in which, given that the interval between the first/second line conductor and part of the first/second coplanar ground conductor located around each side of the line conductor is S, and that the distance between the first/second line conductor and its corresponding second/first coplanar ground conductor facing each other via the dielectric substrate is H, then the following relationship holds: S<H/2.Type: GrantFiled: July 23, 2003Date of Patent: March 29, 2005Assignee: Kyocera CorporationInventor: Takayuki Shirasaki
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Publication number: 20040119565Abstract: The problem is that, since a coplanar ground conductor located immediately below a line conductor is absent near a through conductor for providing connection between the one ends of the line conductors each having the coplanar ground conductor, characteristic impedance mismatch occurs and this leads to poor transmission characteristics. The invention provides a high-frequency wiring board in which, given that the interval between the first/second line conductor and part of the first/second coplanar ground conductor located around each side of the line conductor is S, and that the distance between the first/second line conductor and its corresponding second/first coplanar ground conductor facing each other via the dielectric substrate is H, then the following relationship holds: S<H/2.Type: ApplicationFiled: July 23, 2003Publication date: June 24, 2004Applicant: KYOCERA CORPORATIONInventor: Takayuki Shirasaki
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Patent number: 6726488Abstract: A high-frequency wiring board of the present invention is characterized in that W1>W2 and S1≧S2 are satisfied in which W1 is a line width of a portion having a predetermined characteristic impedance of a line conductor, W2 is a conductor width of the line conductor in proximity to a connection of one end of the line conductor to a through conductor, S1 is an interval between the portion having the line width W1 of the line conductor and a same plane ground conductor, and S2 is an interval between the portion of the one end of the line conductor in proximity to the connection to the through conductor and the same plane ground conductor.Type: GrantFiled: October 22, 2002Date of Patent: April 27, 2004Assignee: Kyocera CorporationInventor: Takayuki Shirasaki
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Patent number: D822629Type: GrantFiled: July 13, 2017Date of Patent: July 10, 2018Assignee: KYOCERA CorporationInventors: Taito Kimura, Takayuki Shirasaki