Abstract: A vehicle antenna device includes: an antenna base; an antenna case which is overlaid on the antenna base; and an antenna element and an amplifier board which are disposed inside the antenna case. The antenna base has: a resin-made base which has an opening; and a metal-made base which is smaller in area than the resin-made base, the metal-made base being disposed on the resin-made base so as to close the opening, and having a cylindrical portion for attachment to a vehicle body. A conductor plate is attached to a surface of the resin-made base, the surface being opposite to a placement surface of the metal-made base.

Abstract: A method for producing a nickel thin film on a Si substrate by a chemical vapor deposition method, in which the nickel thin film is formed by use of a hydrocarbon-type nickel complex represented by a following formula as a raw material compound, which is a nickel complex in which a cyclopentadienyl group (Cp) or a derivative thereof and a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof are coordinated to nickel and an element other than carbon and hydrogen is not contained in the structure, use of hydrogen as a reaction gas, and use of a film formation pressure of 1 to 150 torr and a film formation temperature of 80 to 250° C. as film formation conditions (In the formula, X represents a chain or cyclic alkenyl group having 3 to 9 carbon atoms or a derivative thereof. R1 to R5 which are substituent groups of the cyclopentadienyl group represent CnH2n+1 and n represents an integer of 0 to 6).

Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

Abstract: The invention provides a plating solution capable of forming a palladium plating film which can further improve solder characteristics in surface treatment of a composition made of a nickel plating film, a palladium plating film and a gold plating film on a surface of a conductor formed from a metal such as copper. In a palladium plating solution of the invention containing a soluble palladium salt and an electrically conductive salt having a liquid composition containing germanium, the amount of the soluble palladium salt is 0.1 g/l to 50 g/l in terms of a reduced value of palladium metal, the amount of the electrically conductive salt is 10 g/l to 400 g/l and the amount of the germanium is 0.1 mg/l to 1000 mg/l.

Abstract: A plating method by means of an electroless gold solution under air supply in the form of air bubbles from air dispersing bodies placed on the bottom of a plating tan, whereby more uniform plating can be achieved and the life of the plating solution can be prolonged. Air bubbles are uniformly supplied over the entire region in the plating tank which corresponds to a plating region of a substance to be plated and placed in the plating tank, and the air supply is adjusted depending on the liquid temperature of the plating solution.