Patents by Inventor Takayuki SUZUKAWA

Takayuki SUZUKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board
    Patent number: 11553593
    Abstract: The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 ?m or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: January 10, 2023
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takayuki Suzukawa, Ikuo Sugawara, Tetsurou Irino, Yuuki Tezuka, Masaharu Matsuura
  • RESIN FILM FOR INTERLAYER INSULATING LAYER WITH SUPPORT, MULTILAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD
    Publication number: 20210235582
    Abstract: The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 ?m or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.
    Type: Application
    Filed: April 25, 2019
    Publication date: July 29, 2021
    Inventors: Takayuki SUZUKAWA, Ikuo SUGAWARA, Tetsurou IRINO, Yuuki TEZUKA, Masaharu MATSUURA