Abstract: An actuator driving device includes a driving coil that generates a driving force with first and second voltages; and a control unit, which sets one of the first and second voltages to a first pulse, sets the other one to a second pulse, and performs at least one of: a first control for modulating one pulse width of the first and second pulses with a change amount larger than that of the other pulse width so that a pulse width of ON time of the second pulse is within a pulse width of ON time of the first pulse; and a second control for modulating one pulse width of the first and second pulses with a change amount larger than that of the other pulse width so that the pulse width of the first pulse in ON time is within the pulse width of the second pulse in ON time.

Abstract: A drive apparatus includes a first unit including a coil, a second unit including a magnet, and a third unit having an electronic device. The third unit is fixed to the first unit. The first unit and the third unit move relative to the second unit by a magnetic force between the coil and the magnet. The first unit includes a first opening and a second opening in a direction along a principal surface of the electronic device in an area overlapping the principal surface. The first unit is such that an induced current due to a magnetic field generated from the coil does not flow to a first portion located between the first opening and the second opening in the first unit.

Abstract: Leadframe systems and related methods. Specific implementations of leadframe systems may include a die pad, a semiconductor die coupled to the die pad, where the semiconductor die has a perimeter. A leadframe may be coupled over the die pad and the semiconductor die where the leadframe has a solder dam coupled around the semiconductor die and, the solder dam has a perimeter that corresponds with the semiconductor die The die pad may have no groove adjacent to the semiconductor die.

Abstract: According to one aspect of the present invention, there is provided an imaging lens including: an image shake correcting action unit provided movably in a direction perpendicular to an optical axis of the lens; a stationary unit for supporting the image shake correcting action unit; a permanent magnet provided on one of the image shake correcting action unit and the stationary unit and a coil provided on an other; a drive circuit for moving the image shake correcting action unit relative to the stationary unit; a mount section for being connected to an imaging unit; and a conductive member which is nonmagnetically conductive and disposed between the coil and the mount section so as to include a facing surface facing a surface formed by a winding wire of the coil and having a larger area than a surface formed by an inner periphery of the coil.

Abstract: Leadframe systems and related methods. Specific implementations of leadframe systems may include a die pad, a semiconductor die coupled to the die pad, where the semiconductor die has a perimeter. A leadframe may be coupled over the die pad and the semiconductor die where the leadframe has a solder dam coupled around the semiconductor die and, the solder dam has a perimeter that corresponds with the semiconductor die The die pad may have no groove adjacent to the semiconductor die.

Abstract: A porous composite film includes: a porous substrate which is a polyolefin; and a porous layer laminated on at least one surface of the porous substrate. The porous layer satisfies the following requirements a) and b): a) a value of D50 of the cross-sectional void area distribution of the porous layer is less than 0.060 ?m2, and a value of D90 thereof is less than 0.200 ?m2; and b) a resin constituting the porous layer is a fluorine-containing resin.

Abstract: A test apparatus and method for measuring a concentration of a target by correcting for an impact of hemoglobin are provided. The target measurement method includes measuring an absorbance of hemoglobin in a sample, measuring an absorbance of a target in the sample, determining variation of the absorbance of the target according to the measured absorbance of the hemoglobin, and correcting the absorbance of the target by subtracting the determined variation of the absorbance of the target from the measured absorbance of the target.

Abstract: A porous composite film includes a porous substrate and a porous layer laminated on at least one surface of the porous substrate. The porous layer contains a fluorine-containing resin and satisfies the following requirements: (i) a value of D150 of a cross-sectional void area distribution of the porous layer is 0.06?2 or more and 0.38 ?m2 or less, and a value of D190 thereof is 0.20 ?m2 or more and 1.15 ?m2 or less; (ii) a value of D250 of a surface pore area distribution of the porous layer is 0.0060 ?m2 or more and 0.0072 ?m2 or less, and a value of D290 thereof is 0.0195 ?m2 or more and 0.0220 ?m2 or less; and (iii) porosity of the porous layer is 50% or more and 70% or less.

Abstract: According to one aspect of the present invention, there is provided an imaging lens including: an image shake correcting action unit provided movably in a direction perpendicular to an optical axis of the lens; a stationary unit for supporting the image shake correcting action unit; a permanent magnet provided on one of the image shake correcting action unit and the stationary unit and a coil provided on an other; a drive circuit for moving the image shake correcting action unit relative to the stationary unit; a mount section for being connected to an imaging unit; and a conductive member which is nonmagnetically conductive and disposed between the coil and the mount section so as to include a facing surface facing a surface formed by a winding wire of the coil and having a larger area than a surface formed by an inner periphery of the coil.

Abstract: A fluid test cartridge, a fluid test apparatus, and a method for controlling the same. The fluid test apparatus includes a housing, and a fluid test cartridge that is accommodated in the housing. The fluid test cartridge includes at least one chamber in which a fluid sample to be tested and a drying reagent can be accommodated. The fluid test apparatus includes a light emitter configured to emit light to the at least one chamber, a light sensor, and a processor configured to detect a concentration of a first material in the fluid sample. The drying reagent includes a non-metallic particle bound to a second material that specifically binds to the first material. Tests can thus be carried out over a wider range of wavelengths, and testing errors can be reduced.

Abstract: According to one aspect of the present invention, there is provided an imaging lens including: an image shake correcting action unit provided movably in a direction perpendicular to an optical axis of the lens; a stationary unit for supporting the image shake correcting action unit; a permanent magnet provided on one of the image shake correcting action unit and the stationary unit and a coil provided on an other; a drive circuit for moving the image shake correcting action unit relative to the stationary unit; a mount section for being connected to an imaging unit; and a conductive member which is nonmagnetically conductive and disposed between the coil and the mount section so as to include a facing surface facing a surface formed by a winding wire of the coil and having a larger area than a surface formed by an inner periphery of the coil.

Abstract: Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

Abstract: According to one aspect of the present invention, there is provided an imaging lens including: an image shake correcting action unit provided movably in a direction perpendicular to an optical axis of the lens; a stationary unit for supporting the image shake correcting action unit; a permanent magnet provided on one of the image shake correcting action unit and the stationary unit and a coil provided on an other; a drive circuit for moving the image shake correcting action unit relative to the stationary unit; a mount section for being connected to an imaging unit; and a conductive member which is nonmagnetically conductive and disposed between the coil and the mount section so as to include a facing surface facing a surface formed by a winding wire of the coil and having a larger area than a surface formed by an inner periphery of the coil.

Abstract: A wiring board of the present disclosure includes a core substrate, insulating layers, signal wiring conductors, ground wiring conductors, power-supply wiring conductors, a first mounting portion on which a first semiconductor device is to be mounted, a second mounting portion on which a second semiconductor device is to be mounted, many first-semiconductor-device connection pads connectable to signal electrodes of the first semiconductor device, many second-semiconductor-device connection pads connectable to signal electrodes of the second semiconductor device, and many signal connection conductors that connect the first-semiconductor-device connection pads to the second-semiconductor-device connection pads.

Abstract: A test apparatus and method for measuring a concentration of a target by correcting for an impact of hemoglobin are provided. The target measurement method includes measuring an absorbance of hemoglobin in a sample, measuring an absorbance of a target in the sample, determining variation of the absorbance of the target according to the measured absorbance of the hemoglobin, and correcting the absorbance of the target by subtracting the determined variation of the absorbance of the target from the measured absorbance of the target.

Abstract: A wiring board of the present disclosure includes a core substrate, insulating layers, signal wiring conductors, ground wiring conductors, power-supply wiring conductors, a first mounting portion on which a first semiconductor device is to be mounted, a second mounting portion on which a second semiconductor device is to be mounted, many first-semiconductor-device connection pads connectable to signal electrodes of the first semiconductor device, many second-semiconductor-device connection pads connectable to signal electrodes of the second semiconductor device, and many signal connection conductors that connect the first-semiconductor-device connection pads to the second-semiconductor-device connection pads.

Abstract: In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure.

Abstract: Various embodiments of the present technology may comprise a method and apparatus for improved bonding and may operate in conjunction with a main platform configured to support a substrate. Movable members may allow the substrate to be positioned on the main platform when rotated to a first position and apply a force to a predetermined area on an upward facing surface of the substrate when rotated to the second position.

Abstract: A wiring board according to the present invention includes an insulating board; a first pad provided inwardly from a surface of the insulating board and electrically connected to an electrode of an electronic component; a second pad provided on the surface of the insulating board and electrically connected to a lead terminal. The first pad and the second pad include a first layer region made of copper and a second layer region arranged on the first layer region and made of nickel, and a thickness of the second layer region of the second pad is larger than a thickness of the second layer region of the first pad.

Abstract: In accordance with an embodiment, a method for manufacturing an electric circuit that includes providing a support having a first region, the first region having a first conductor that has a first sidewall and a second conductor that has a second sidewall, wherein the first conductor is electrically isolated from the second conductor is provided. A distance between the first sidewall and the second sidewall is increased using a technique such as stamping, etching, or trimming. A first circuit element is coupled to the first conductor and encapsulated in a mold compound. In accordance with another embodiment, an electric circuit includes a support having interconnect with sidewalls wherein notches extend from one or more of the sidewalls into the interconnect. A circuit element is coupled to the interconnect by a bonding agent and protected by a protective structure.