Abstract: A memory system includes a nonvolatile memory and a controller that includes an encoder configured to encode a first group of data including a plurality of first data, each first data having a plurality of bits. The encoder is configured to perform a first encoding process of generating a second group of data including a plurality of second data from the plurality of first data in the first group, and a second encoding process of generating a third group of data including a plurality of third data from the plurality of second data in the second group. A logical value of “1” is less likely to be the value in an n-th bit position of the plurality of third data in the third group than the value in any of the bit positions of the plurality of second data in the second group.

Abstract: According to one embodiment, a memory system includes a plurality of nonvolatile memory chips and a controller configured to control the nonvolatile memory chips through a channel. The controller detects a program command sequence and sets a second chip enable signal corresponding to a second nonvolatile memory chip of the nonvolatile memory chips to the enable state during a period of at least data input cycle in the detected program command sequence. The controller transmits, when it is indicated that a ready/busy signal input to the controller while the second chip enable signal is in the enable state, a command sequence to the second nonvolatile memory chip.

Abstract: A memory system includes a memory chip, a queue block and a memory controller. The queue block is configured to store a command to be transmitted to the memory chip. The queue block includes a first queue and a plurality of second queues each corresponding to a plane of the memory chip. The memory controller is configured to determine whether or not a first command enqueued in the first queue is a first read command. The first read command is a command for executing read operation in the planes asynchronously. When the first command is the first read command, the memory controller transfers the first command to one of the second queues corresponding to a plane in which the first command is to be executed. The memory controller selects the first queue or the second queues as a source of a command to be transferred to the memory chip.

Abstract: A semiconductor module includes: a base substrate that includes a first dielectric film and an electrode layer, the first dielectric film having a mounting surface, the mounting surface including a first mounting area and a second mounting area; a first semiconductor part mounted on the first mounting area; and a second semiconductor part mounted on the second mounting area, the second semiconductor part including a vertical power semiconductor device, a conductive block to be connected to the electrode layer, and a wiring substrate, the vertical power semiconductor device having a first surface and a second surface, the first surface including a first terminal to be connected to the electrode layer, the second surface including a second terminal, the wiring substrate electrically connecting the conductive block and the second terminal.

Abstract: The present disclosure includes: a flexible resin substrate made of a polyimide resin; an adhesion layer provided on the resin substrate; a semiconductor element mounted face down to the resin substrate and fixed to the resin substrate through the adhesion layer; a via hole provided in the resin substrate to correspond to an element electrode of the semiconductor element; a module electrode provided to the resin substrate to be in contact with the element electrode of the semiconductor element through the via hole; a protruding portion provided, around the element electrode or in a peripheral edge portion of the semiconductor element, on a surface of the semiconductor element; and an escape portion for the adhesion layer covering a head portion of the protruding portion to escape, the escape portion being provided in a region, of the resin substrate, corresponding to the protruding portion.

Abstract: A semiconductor module includes: a base substrate that includes a first dielectric film and an electrode layer, the first dielectric film having a mounting surface, the mounting surface including a first mounting area and a second mounting area; a first semiconductor part mounted on the first mounting area; and a second semiconductor part mounted on the second mounting area, the second semiconductor part including a vertical power semiconductor device, a conductive block to be connected to the electrode layer, and a wiring substrate, the vertical power semiconductor device having a first surface and a second surface, the first surface including a first terminal to be connected to the electrode layer, the second surface including a second terminal, the wiring substrate electrically connecting the conductive block and the second terminal.

Abstract: A memory system includes a memory chip, a queue block and a memory controller. The queue block is configured to store a command to be transmitted to the memory chip. The queue block includes a first queue and a plurality of second queues each corresponding to a plane of the memory chip. The memory controller is configured to determine whether or not a first command enqueued in the first queue is a first read command. The first read command is a command for executing read operation in the planes asynchronously. When the first command is the first read command, the memory controller transfers the first command to one of the second queues corresponding to a plane in which the first command is to be executed. The memory controller selects the first queue or the second queues as a source of a command to be transferred to the memory chip.

Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface; a plurality of circuit parts mounted on the first surface; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts, at least a part of the plurality of electrode portions including a base that is long in one axis direction; a rigid member that is disposed on the first surface, includes, at least one shaft portion, and faces the base with the dielectric layer sandwiched therebetween, the at least one shaft axis extending along the one axis direction; and a sealing layer that is provided on the first surface and covers the plurality of circuit parts and the rigid member.

Abstract: A semiconductor module includes: a dielectric film that has a first surface and a second surface opposed to the first surface, the first surface including a first mounting area and a second mounting area; a plurality of circuit parts that includes a first circuit part and a second circuit part, the first circuit part being mounted on the first mounting area, the second circuit part being mounted on the second mounting area; an electrode layer that is disposed on the second surface and includes a plurality of electrode portions to be electrically connected to the plurality of circuit parts; and a sealing layer that includes a first sealing resin portion and a second sealing resin portion and seals the plurality of circuit parts, the first sealing resin portion covering the first mounting area, the second sealing resin portion being formed of a resin material softer than the first sealing resin portion and covering the second mounting area.

Abstract: The present disclosure includes: a flexible resin substrate made of a polyimide resin; an adhesion layer provided on the resin substrate; a semiconductor element mounted face down to the resin substrate and fixed to the resin substrate through the adhesion layer; a via hole provided in the resin substrate to correspond to an element electrode of the semiconductor element; a module electrode provided to the resin substrate to be in contact with the element electrode of the semiconductor element through the via hole; a protruding portion provided, around the element electrode or in a peripheral edge portion of the semiconductor element, on a surface of the semiconductor element; and an escape portion for the adhesion layer covering a head portion of the protruding portion to escape, the escape portion being provided in a region, of the resin substrate, corresponding to the protruding portion.

Abstract: According to one embodiment, a storage device includes a first nonvolatile memory, a second volatile memory, and a controller. In the second volatile memory, at least one of management information for managing user data written in the first nonvolatile memory and the user data is temporarily written as cache data. The controller is configured to execute processing for writing the cache data written in the second volatile memory to a third memory of the host device, if the storage device is changed from a regular mode to a low power consumption mode in which supplying of power to the second volatile memory is stopped, in response to a request from a host device.

Abstract: A coil component includes: a pillar part, quadrangular planar parts formed at both ends of the pillar part, a coil formed by winding an insulating sheath conductor around the pillar part, electrode terminals that are electrically connected to both ends of the coil, and an outer sheath covering the coil at least partially; wherein the pillar part and quadrangular planar parts are made of ferrite material; the outer sheath contains metal magnetic grains and resin material; and based on a section obtained by cutting through the center of the pillar part vertically to the long-axis direction of the pillar part, the cross-section area of the pillar part is greater than the cross-section area of the outer sheath.

Abstract: A walking toy includes a body on which gravity center position adjusting members and paired legs are supported to be able to swing in a forward/backward direction, and a gearbox which has a crank mechanism for forcibly swinging the paired legs alternately forward and backward in a forcible swinging direction and which is mounted in the body. Each of the paired legs has a bottom which is configured to be in contact with a floor surface and which is formed into a curved face curved in the forcible swinging direction. The gearbox is driven by a torsion coil spring and has a lever which rotates a drive gear of a gear train for transmitting rotation of the torsion coil spring to an output shaft for rotating the crank mechanism.

Abstract: According to one embodiment, a storage device includes a first nonvolatile memory, a second volatile memory, and a controller. In the second volatile memory, at least one of management information for managing user data written in the first nonvolatile memory and the user data is temporarily written as cache data. The controller is configured to execute processing for writing the cache data written in the second volatile memory to a third memory of the host device, if the storage device is changed from a regular mode to a low power consumption mode in which supplying of power to the second volatile memory is stopped, in response to a request from a host device.

Abstract: A coil component includes: a pillar part, quadrangular planar parts formed at both ends of the pillar part, a coil formed by winding an insulating sheath conductor around the pillar part, electrode terminals that are electrically connected to both ends of the coil, and an outer sheath covering the coil at least partially; wherein the pillar part and quadrangular planar parts are made of ferrite material; the outer sheath contains metal magnetic grains and resin material; and based on a section obtained by cutting through the center of the pillar part vertically to the long-axis direction of the pillar part, the cross-section area of the pillar part is greater than the cross-section area of the outer sheath.

Abstract: A walking toy includes a body on which gravity center position adjusting members and paired legs are supported to be able to swing in a forward/backward direction, and a gearbox which has a crank mechanism for forcibly swinging the paired legs alternately forward and backward in a forcible swinging direction and which is mounted in the body. Each of the paired legs has a bottom which is configured to be in contact with a floor surface and which is formed into a curved face curved in the forcible swinging direction. The gearbox is driven by a torsion coil spring and has a lever which rotates a drive gear of a gear train for transmitting rotation of the torsion coil spring to an output shaft for rotating the crank mechanism.

Abstract: There is provided a technique that can increase sensitivity of a resonator. A ratio Rb/Ra between an inner diameter Rb and an outer diameter Ra of the resonator 20 is appropriately selected, and thus there may be a fixed point where an r component (U(Ra) or U(Rb)) of displacement in a radial direction and an r component (V(Ra) or V(Rb)) of displacement in a tangential direction are 0 on an outer diameter portion or an inner diameter portion of the resonator 20. In this case, the resonator 20 is supported by a holding member 22 constituted by a single-span beam set so that a boundary condition on a side of the resonator 20 is pinned and a boundary condition on a side of an anchor that supports the resonator 20 is clamped at the fixed point, and this prevents vibration energy of the resonator 20 from being lost through the holding member 22, avoids a state to disturb a vibration mode, and achieves a sensor having high sensitivity.

Abstract: There is provided a technique that can increase sensitivity of a resonator. A ratio Rb/Ra between an inner diameter Rb and an outer diameter Ra of the resonator 20 is appropriately selected, and thus there may be a fixed point where an r component (U(Ra) or U(Rb)) of displacement in a radial direction and an r component (V(Ra) or V(Rb)) of displacement in a tangential direction are 0 on an outer diameter portion or an inner diameter portion of the resonator 20. In this case, the resonator 20 is supported by a holding member 22 constituted by a single-span beam set so that a boundary condition on a side of the resonator 20 is pinned and a boundary condition on a side of an anchor that supports the resonator 20 is clamped at the fixed point, and this prevents vibration energy of the resonator 20 from being lost through the holding member 22, avoids a state to disturb a vibration mode, and achieves a sensor having high sensitivity.

Abstract: A logic circuit has a first circuit block, a second circuit block, and a test circuit composed of a first multiplexer and a second multiplexer.

Abstract: The present invention relates to a process for producing acrylamide or methacrylamide utilizing microorganisms having a nitrilase activity. This process involves (1) utilizing highly active novel bacteria belonging to the genus Corynebacterium or the genus Nocardia, (2) conducting the reaction utilizing microorganisms having a nitrilase activity at temperatures as low as the freezing point of the medium to 15.degree. C. so as to conduct the reaction for a long period of time while maintaining a high concentration of acrylamide or methacrylamide, and (3) conducting the reaction according to a newly devised continuous column process to obtain a highly concentrated acrylamide or methacrylamide aqueous solution with economic advantages.