Abstract: A resist layer containing a photoresponsive material in a photoresist is layer-transferred from a film on which the resist layer is formed to a bank substrate, and exposure and development are performed so as to remove an unexposed resist layer.

Abstract: A method for producing a photoresponsive nanoparticle. The method includes a first step of continuously transporting a first raw material liquid containing a lead halide and a second raw material liquid containing a fatty acid cesium to a heated mixer through a transport path, and a second step of mixing the first raw material liquid and the second raw material liquid.

Abstract: Provided is a liquid storage bottle that can ensure sufficient sealing performance when a liquid tank is replenished with a liquid. A liquid storage bottle stores a liquid with which a liquid tank is replenished, has a bottle body and a discharge port that discharges a liquid stored in the bottle body, and has a discharge nozzle in which a liquid injection tube of the liquid tank can be inserted via the discharge port and an annular fixed seal member that is provided to the discharge port and seals a part between the discharge port and the liquid injection tube inserted in the discharge port. The fixed seal member has a plurality of annular seal portions that are arranged apart from each other in the axis direction of a discharge nozzle and are individually in contact with the liquid injection tube inserted in the discharge port.

Abstract: A liquid ejection head includes a substrate; an energy generating member provided on the substrate to generate energy for liquid ejection; a terminal part provided on the substrate to be electrically connected with an outside, the terminal part including at least an electrode for supplying electric power to the energy generating member; a wiring layer provided on the substrate to electrically couple the energy generating member and the electrode; a nozzle member provided on the substrate, the nozzle member including a liquid ejection port and a liquid flow path, the liquid ejection port being arranged to correspond to the energy generating member, and the liquid flow path communicating with the liquid ejection port; and a metal structure provided to cover the wiring layer in a region where neither the nozzle member nor the electrode is provided, and the metal structure is electrically independent of the terminal part.

Abstract: A liquid ejection head includes a substrate; an energy generator that is provided on the substrate; an electrode portion that is provided on the substrate; a liquid ejection face that is provided near a surface of the substrate having the electrode portion; and flexible printed circuits including a conductive pattern and a base material having a first surface and a second surface, the first surface having the conductive pattern, the second surface being provided on the opposite side from the first surface. The base material of the flexible printed circuits has a leading region from the terminal end of a region having the conductive pattern to an end of the base material near the energy generator, without formation of the conductive pattern in the leading region, and at least a part of the second surface of the leading region inclines toward the substrate.

Abstract: In a substrate of a liquid ejection head, there are formed a first through-hole which constitutes a liquid supply path, and a second through-hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through-hole has a first hole having a first opening and a second hole having a second opening, and the second through-hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

Abstract: Provided is a liquid storage bottle that can ensure sufficient sealing performance when a liquid tank is replenished with a liquid. A liquid storage bottle stores a liquid with which a liquid tank is replenished, has a bottle body and a discharge port that discharges a liquid stored in the bottle body, and has a discharge nozzle in which a liquid injection tube of the liquid tank can be inserted via the discharge port and an annular fixed seal member that is provided to the discharge port and seals a part between the discharge port and the liquid injection tube inserted in the discharge port. The fixed seal member has a plurality of annular seal portions that are arranged apart from each other in the axis direction of a discharge nozzle and are individually in contact with the liquid injection tube inserted in the discharge port.

Abstract: A liquid ejection head includes a substrate, an energy generating member provided on the substrate to generate energy for liquid ejection, a terminal part provided on the substrate to be electrically connected with an outside, the terminal part including at least an electrode for supplying electric power to the energy generating member, a wiring layer provided on the substrate to electrically couple the energy generating member and the electrode, a nozzle member provided on the substrate, the nozzle member including a liquid ejection port and a liquid flow path, the liquid ejection port being arranged to correspond to the energy generating member, the liquid flow path communicating with the liquid ejection port, and a metal structure provided to cover the wiring layer in a region where neither the nozzle member nor the electrode is provided, and the metal structure is electrically independent of the terminal part.

Abstract: A liquid ejection head includes: a substrate; an energy generator that is provided on the substrate; an electrode portion that is provided on the substrate; a liquid ejection face that is provided near a surface of the substrate having the electrode portion, and flexible printed circuits including a conductive pattern and a base material having a first surface and a second surface, the first surface having the conductive pattern, the second surface being provided on the opposite side from the first surface. The base material of the flexible printed circuits has a leading region from the terminal end of a region having the conductive pattern to an end of the base material near the energy generator, without formation of the conductive pattern in the leading region, and at least a part of the second surface of the leading region inclines toward the substrate.

Abstract: A liquid ejection head includes, a multilayer wiring layer having a plurality of wiring layers laid one on the other and an insulating layer enveloping the plurality of wiring layers, an ejection orifice forming member arranged on one of the oppositely disposed surfaces of the multilayer wiring layer and having an ejection orifice formed therethrough to eject liquid and a through-hole electrode arranged in a through hole running through the multilayer wiring layer between the one and the other surfaces of the multilayer wiring layer. The plurality of wiring layers includes a first wiring layer having a surface located closest to the ejection orifice forming member and the through-hole electrode is held in contact with at least one surface of the plurality of wiring layers different from the surface of the first wiring layer and is electrically connected to the plurality of wiring layers.

Abstract: In a substrate of a liquid ejection head, there are formed a first through hole which constitutes a liquid supply path, and a second through hole in which a through-hole electrode electrically connected to a wiring layer is formed on the inner surface. The first through hole has a first hole having a first opening and a second hole having a second opening, and the second through hole has a third hole having a third opening and a fourth hole having a fourth opening. When the minimum width of the first opening is represented by D1, the minimum width of the second opening is represented by D2, the minimum width of the third opening is represented by D3, and the minimum width of the fourth opening is represented by D4, the first to fourth openings satisfy a relation of D1>D3>D4>D2.

Abstract: A liquid ejection head includes, a multilayer wiring layer having a plurality of wiring layers laid one on the other and an insulating layer enveloping the plurality of wiring layers, an ejection orifice forming member arranged on one of the oppositely disposed surfaces of the multilayer wiring layer and having an ejection orifice formed therethrough to eject liquid and a through-hole electrode arranged in a through hole running through the multilayer wiring layer between the one and the other surfaces of the multilayer wiring layer. The plurality of wiring layers includes a first wiring layer having a surface located closest to the ejection orifice forming member and the through-hole electrode is held in contact with at least one surface of the plurality of wiring layers different from the surface of the first wiring layer and is electrically connected to the plurality of wiring layers.

Abstract: An X-ray shield grating includes a substrate on which a plurality of recessed portions are arranged, and metal that is arranged in each of the recessed portions. The substrate includes a bent region that is bent in an arrangement direction in which the plurality of recessed portions are arranged. A radius of curvature of the bent region is 200 millimeters or less. In the bent region, a maximum value of a width of a region sandwiched between two adjacent recessed portions of the plurality of recessed portions and a width of the substrate in an end portion of the bent region are less than or equal to three times a minimum value of the width of the region sandwiched between the two adjacent recessed portions.

Abstract: A structure includes a silicon substrate having a plurality of recessed portions, each recessed portion having a bottom and a side wall, silicide layers, each silicide layer in contact with the bottoms of the plurality of recessed portions, and a metal structure including metal portions, each metal portion disposed in the plurality of recessed portions and in contact with the silicide layers. The silicide layers are electrically connected to each other through the silicon substrate.

Abstract: A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating.

Abstract: The present invention relates to a method for manufacturing a structure, including the steps of forming a recessed section in a first surface of a substrate; filling the recessed section with metal to form a metal structure; exposing the metal structure from the substrate; and applying resin onto the exposed metal structure and solidifying the resin to form a resin layer.

Abstract: A structural body, comprising: a resin layer with a curved surface; a first bonding layer containing a water-soluble polymer; a second bonding layer having a hydrogen-bonding surface; and a gold layer in this order, the first bonding layer being between, and in contact with, the curved surface of the resin layer and the hydrogen-bonding surface of the second bonding layer.

Abstract: A microstructure manufacturing method includes forming a first insulating film on an Si substrate, exposing an Si surface by removing a part of the first insulating film, forming a recessed portion by etching the Si substrate from the exposed Si surface, forming a second insulating film on a sidewall and a bottom of the recessed portion, forming an Si exposed surface by removing at least a part of the second insulating film formed on the bottom of the recessed portion, and filling the recessed portion with a metal from the Si exposed surface by electrolytic plating.

Abstract: A method is provided for producing a microstructure. The method includes the first step of forming a supporting layer on a base substrate including a silicon substrate provided with recessed sections at a first surface thereof and a metal structure filling the recessed sections so as to come in contact with the metal structure at the first surface, the second step of forming a structure including the metal structure and the supporting layer by selectively etching the silicon substrate to expose at least the surface of the metal structure opposite the surface in contact with the supporting layer from the silicon substrate, and the third step of selectively etching the supporting layer of the metal structure.

Abstract: A structure includes a silicon substrate having a plurality of recessed portions, each having a bottom and a side wall, silicide layers, one each in contact with the bottoms of the recessed portions, and a metal structure including metal portions, one each disposed in the recessed portions and in contact with the silicide layers. The silicide layers are electrically connected to each other through the silicon substrate.