Patents by Inventor Takayuku Matsushima

Takayuku Matsushima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7824754
    Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: November 2, 2010
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Masao Saito, Osamu Takamatsu, Takayuku Matsushima
  • Patent number: 7754790
    Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
    Type: Grant
    Filed: January 22, 2008
    Date of Patent: July 13, 2010
    Assignees: Sony Corporation, Sony Chemical & Information Device Corporation
    Inventors: Masao Saito, Osamu Takamatsu, Takayuku Matsushima