Patents by Inventor Takeaki Imaizumi

Takeaki Imaizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8395059
    Abstract: The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same.
    Type: Grant
    Filed: September 8, 2010
    Date of Patent: March 12, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Yuichi Miyazaki, Yuusuke Satou, Shinya Kiura, Yukihiro Kyouden, Yusuke Hagiwara, Takeshi Nisizono, Takeaki Imaizumi
  • Publication number: 20110122596
    Abstract: The present invention is to provide an electromagnetic wave shielding material including a transparent substrate and a convex pattern layer composed of a conductive composition formed in a prescribed pattern on the transparent substrate, wherein the conductive composition contains conductive particles and a binder resin; and in observation of a transverse cross section of the convex pattern layer by electron microscopic photography, at least a part of the conductive particles has a fused continuation and a method for manufacturing the same.
    Type: Application
    Filed: September 8, 2010
    Publication date: May 26, 2011
    Inventors: Yuichi Miyazaki, Yuusuke Satou, Shinya Kiura, Yukihiro Kyouden, Yusuke Hagiwara, Takeshi Nisizono, Takeaki Imaizumi