Patents by Inventor Takefumi ARAI

Takefumi ARAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux and solder paste
    Patent number: 11806818
    Abstract: A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: November 7, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Takefumi Arai, Masashige Hayakawa
  • Flux and solder paste
    Patent number: 11806817
    Abstract: A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: November 7, 2023
    Assignee: KOKI Company Limited
    Inventors: Kazuhiro Yukikata, Takefumi Arai, Yuri Misumi
  • FLUX AND SOLDER PASTE
    Publication number: 20230090002
    Abstract: A flux according to the present invention is a flux for soldering, the flux including: an unsaturated aliphatic alcohol having one unsaturated bond, a thixotropic agent, and a solvent, in which the unsaturated aliphatic alcohol includes oleyl alcohol, and a content of the oleyl alcohol is 2.0 mass % or more and 12.0 mass % or less based on the entire flux.
    Type: Application
    Filed: September 22, 2021
    Publication date: March 23, 2023
    Inventors: Kazuhiro YUKIKATA, Takefumi ARAI, Yuri MISUMI
  • FLUX AND SOLDER PASTE
    Publication number: 20220266397
    Abstract: A flux according to the present invention is a halogen-free flux used for soldering that includes: a thixotropic agent a polyamide compound in which one endothermic peak or all of endothermic peaks obtained by differential thermal analysis are observed within a range of 130 to 200° C.; and an activator comprising an isocyanuric acid derivative, in which a content of the isocyanuric acid derivative is 5.0 mass % or less based on the entire flux.
    Type: Application
    Filed: June 26, 2020
    Publication date: August 25, 2022
    Inventors: Kazuhiro YUKIKATA, Takefumi ARAI, Masashige HAYAKAWA