Patents by Inventor Takeharu Ishii

Takeharu Ishii has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11143964
    Abstract: A substrate treating method for performing a heat treatment of a substrate that has a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: October 12, 2021
    Inventors: Yasuhiro Fukumoto, Yuji Tanaka, Takeharu Ishii, Tomohiro Matsuo
  • Patent number: 11107698
    Abstract: An oxygen concentration is lowered in accordance with a set lowering process, and thereafter a heat treatment is performed. Accordingly, the heat treatment is performed to a substrate W while the oxygen concentration in a heat treating space HS is lowered. Consequently, a treatment atmosphere within the heat treating space is able to be made suitable for a heat treatment process, leading to appropriate film deposition. In addition, the oxygen concentration is lowered in accordance with a concentration level in recipes. This avoids an excessively lowered oxygen concentration, leading to prevention of reduced throughput.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: August 31, 2021
    Inventors: Chisayo Nakayama, Yuji Tanaka, Masahiko Harumoto, Masaya Asai, Yasuhiro Fukumoto, Tomohiro Matsuo, Takeharu Ishii
  • Publication number: 20210134605
    Abstract: An oxygen concentration is lowered in accordance with a set lowering process, and thereafter a heat treatment is performed. Accordingly, the heat treatment is performed to a substrate W while the oxygen concentration in a heat treating space HS is lowered. Consequently, a treatment atmosphere within the heat treating space is able to be made suitable for a heat treatment process, leading to appropriate film deposition. In addition, the oxygen concentration is lowered in accordance with a concentration level in recipes. This avoids an excessively lowered oxygen concentration, leading to prevention of reduced throughput.
    Type: Application
    Filed: October 24, 2017
    Publication date: May 6, 2021
    Inventors: Chisayo NAKAYAMA, Yuji TANAKA, Masahiko HARUMOTO, Masaya ASAI, Yasuhiro FUKUMOTO, Tomohiro MATSUO, Takeharu ISHII
  • Patent number: 10941492
    Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of performing exhaust of gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, and a heat treating step of performing the heat treatment of the substrate in the heat treating space.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: March 9, 2021
    Inventors: Yuji Tanaka, Chisayo Nakayama, Masahiko Harumoto, Masaya Asai, Yasuhiro Fukumoto, Tomohiro Matsuo, Takeharu Ishii
  • Patent number: 10915025
    Abstract: Disclosed is a substrate treating method for treating a substrate with a directed self-assembly material applied thereto. The substrate treating method includes a heating step and a cooling step. The heating step includes heating the substrate to perform phase separation of the directed self-assembly material by maintaining an interior of a treatment container in a non-oxidizing gas atmosphere and placing the substrate at a heating position. The cooling step includes cooling the substrate by maintaining the interior of the treatment container in the non-oxidizing gas atmosphere, placing the substrate at a cooling position further away from the heating unit than the heating position, supplying non-oxidizing gas into the treatment container, and exhausting gas within the treatment container.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: February 9, 2021
    Inventors: Yasuhiro Fukumoto, Yuji Tanaka, Tomohiro Matsuo, Takeharu Ishii
  • Patent number: 10900126
    Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate in a heat treating space. The method includes a loading step of loading the substrate on support pins, an exhaust step of exhausting gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, an under-substrate space gas discharging step of discharging gas within an under-substrate space between the substrate and the top face of the heat treating plate, and a heat treating step of retracting the support pins into the heat treating plate, and performing the heat treatment of the substrate placed on the top face of the heat treating plate in the heat treating space.
    Type: Grant
    Filed: December 26, 2017
    Date of Patent: January 26, 2021
    Inventors: Yuji Tanaka, Chisayo Nakayama, Masahiko Harumoto, Masaya Asai, Yasuhiro Fukumoto, Tomohiro Matsuo, Takeharu Ishii
  • Publication number: 20200272055
    Abstract: A substrate treating method for performing a heat treatment of a substrate that has a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.
    Type: Application
    Filed: May 11, 2020
    Publication date: August 27, 2020
    Inventors: Yasuhiro FUKUMOTO, Yuji TANAKA, Takeharu ISHII, Tomohiro MATSUO
  • Patent number: 10651062
    Abstract: Disclosed is a substrate treating apparatus including a treatment container, a pin, a seal housing, a seal member, and an exhaust port. The treatment container includes an opening. The pin is disposed between an interior of the treatment container and an exterior of the treatment container through the opening, and is configured to reciprocate along an axis thereof. The seal housing is disposed in the exterior of the treatment container. The seal housing is in close contact with the treatment container around the opening, and accommodates a part of the pin. The seal member is in close contact with an inner peripheral surface of the seal housing, and in close contact with an outer peripheral surface of the pin so as to be slidable relative to the pin. The exhaust port is in connection with the seal housing in a communicated manner.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: May 12, 2020
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Yasuhiro Fukumoto, Yuji Tanaka, Tomohiro Matsuo, Takeharu Ishii
  • Publication number: 20180269084
    Abstract: Disclosed is a substrate treating apparatus including a treatment container, a pin, a seal housing, a seal member, and an exhaust port. The treatment container includes an opening. The pin is disposed between an interior of the treatment container and an exterior of the treatment container through the opening, and is configured to reciprocate along an axis thereof. The seal housing is disposed in the exterior of the treatment container. The seal housing is in close contact with the treatment container around the opening, and accommodates a part of the pin. The seal member is in close contact with an inner peripheral surface of the seal housing, and in close contact with an outer peripheral surface of the pin so as to be slidable relative to the pin. The exhaust port is in connection with the seal housing in a communicated manner.
    Type: Application
    Filed: February 26, 2018
    Publication date: September 20, 2018
    Inventors: Yasuhiro FUKUMOTO, Yuji TANAKA, Tomohiro MATSUO, Takeharu ISHII
  • Publication number: 20180231894
    Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of exhausting gas within the heat treating space formed by a cover enclosing surroundings of a heat treating plate; an inert gas supply step of supplying inert gas from an upper portion of the heat treating space into the heat treating space and supplying inert gas into a gap between an outer peripheral surface of the heat treating plate and an inner wall of the cover; and a heat treating step of performing the heat treatment of the substrate in the heat treating space. The heat treating step is performed after the exhaust step and the inert gas supply step.
    Type: Application
    Filed: December 28, 2017
    Publication date: August 16, 2018
    Inventors: Yasuhiro FUKUMOTO, Yuji TANAKA, Takeharu ISHII, Tomohiro MATSUO
  • Publication number: 20180231895
    Abstract: Disclosed is a substrate treating method for treating a substrate with a directed self-assembly material applied thereto. The substrate treating method includes a heating step and a cooling step. The heating step includes heating the substrate to perform phase separation of the directed self-assembly material by maintaining an interior of a treatment container in a non-oxidizing gas atmosphere and placing the substrate at a heating position. The cooling step includes cooling the substrate by maintaining the interior of the treatment container in the non-oxidizing gas atmosphere, placing the substrate at a cooling position further away from the heating unit than the heating position, supplying non-oxidizing gas into the treatment container, and exhausting gas within the treatment container.
    Type: Application
    Filed: December 28, 2017
    Publication date: August 16, 2018
    Inventors: Yasuhiro FUKUMOTO, Yuji TANAKA, Tomohiro MATSUO, Takeharu ISHII
  • Publication number: 20180230599
    Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate having a treated film formed thereon in a heat treating space of a heat treating chamber. The method includes an exhaust step of performing exhaust of gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, and a heat treating step of performing the heat treatment of the substrate in the heat treating space.
    Type: Application
    Filed: December 26, 2017
    Publication date: August 16, 2018
    Inventors: Yuji TANAKA, Chisayo NAKAYAMA, Masahiko HARUMOTO, Masaya ASAI, Yasuhiro FUKUMOTO, Tomohiro MATSUO, Takeharu ISHII
  • Publication number: 20180230598
    Abstract: Disclosed is a substrate treating method for performing a heat treatment of a substrate in a heat treating space. The method includes a loading step of loading the substrate on support pins, an exhaust step of exhausting gas within the heat treating space, an inert gas supply step of supplying inert gas into the heat treating space, an under-substrate space gas discharging step of discharging gas within an under-substrate space between the substrate and the top face of the heat treating plate, and a heat treating step of retracting the support pins into the heat treating plate, and performing the heat treatment of the substrate placed on the top face of the heat treating plate in the heat treating space.
    Type: Application
    Filed: December 26, 2017
    Publication date: August 16, 2018
    Inventors: Yuji TANAKA, Chisayo NAKAYAMA, Masahiko HARUMOTO, Masaya ASAI, Yasuhiro FUKUMOTO, Tomohiro MATSUO, Takeharu ISHII
  • Publication number: 20150013712
    Abstract: The present invention provides a powdery solid hair cosmetic that enables easy hairdressing, enables hairdressing into an intended hairstyle without sticky feeling, can impart a natural texture, and has an unprecedented, novel form. The powdery solid composition for hair of the present invention is in a powdery solid form, is used for hair, and contains a powder and an oil.
    Type: Application
    Filed: March 27, 2013
    Publication date: January 15, 2015
    Applicant: MANDOM CORPORATION
    Inventors: Takeharu Ishii, Takuji Asada