Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: There is provided an acceleration sensor including: a weight portion; plural fixed portions formed above a bottom plate around a periphery of the weight portion; a beam portion coupling the fixed portions and the weight portion, and holding the weight portion at a position separated from the bottom plate; a detection portion provided at the beam portion and detecting deformation of the beam portion; a frame portion provided so as to project out from the bottom plate and surround the fixed portions at a position separated from the fixed portions; and a lid portion of plate shape that seals an opening of the frame portion.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: An inertial sensor includes a stopper having a first locking member extending from a flame onto a proof-mass, a first recess formed at the proof-mass, including a bottom surface, a second locking member extending from the proof-mass onto the edge of the flame, a second recess formed at the edge of the side member of the flame and a projection member projecting from the flame toward the proof-mass, wherein each of the first locking member and the projection member is disposed on the both sides of the second recess.

Abstract: There is provided a semiconductor device whose cost is low and whose case is restrained from breaking. In the semiconductor device having a semiconductor sensor chip, a signal processing circuit for processing signals output from the semiconductor sensor chip and a hollow case for mounting the semiconductor sensor chip and the signal processing circuit therein, the case is constructed by bonding a concave bottom member whose one end is opened with a plate-like lid member that covers the opening of the bottom member. Then, the bottom and lid members are both made of a semiconductor material and are bonded by means of anode bonding or metal bonding for example.

Abstract: An inertial sensor includes a stopper having a first locking member extending from a flame onto a proof-mass, a first recess formed at the proof-mass, including a bottom surface, a second locking member extending from the proof-mass onto the edge of the flame, a second recess formed at the edge of the side member of the flame and a projection member projecting from the flame toward the proof-mass, wherein each of the first locking member and the projection member is disposed on the both sides of the second recess.

Abstract: In a fall detection device, when a first composite vector value of a first acceleration component obtained from a three-axial acceleration sensor is greater than a rotating fall determining value, or smaller than a free fall determining value, a possibility of a fall is determined. When a second composite vector value of a second acceleration component obtained after a determining time interval is greater than the rotating fall determining value, and an angular difference of each testing surface is greater than an angular difference determining value, it is determined to be in the middle of a fall. Further, when a third composite vector value of a third acceleration component obtained one more time is smaller than the free fall determining value, it is determined to be in the middle of a fall.

Abstract: Multi functional sensors are described. A silicon based sensor utilizes metal layers arranged as resistors around a central pair if resistors separated by a humidity sensitive polymer with one of the central resistors being a heater. This enables temperature humidity wind speed and direction to be measured. In another embodiment an array of resistors is printed onto a flexible substrate to form the basis of an array of sensors. A soil moisture sensor, which is also useful as a leaf wetness sensor, incorporates a novel self calibrating capacitive sensor structure. The flexible substrate is rolled into a stake that can be inserted in the soil so that below ground sensors measure soil moisture and above ground sensors measure temperature, light, humidity, wind speed and direction.

Abstract: In a fall detection device, when a first composite vector value of a first acceleration component obtained from a three-axial acceleration sensor is greater than a rotating fall determining value, or smaller than a free fall determining value, a possibility of a fall is determined. When a second composite vector value of a second acceleration component obtained after a determining time interval is greater than the rotating fall determining value, and an angular difference of each testing surface is greater than an angular difference determining value, it is determined to be in the middle of a fall. Further, when a third composite vector value of a third acceleration component obtained one more time is smaller than the free fall determining value, it is determined to be in the middle of a fall.