Patents by Inventor Takehi Sato

Takehi Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film
    Patent number: 5200362
    Abstract: A semiconductor device and a method for its fabrication are disclosed. In a preferred embodiment, a pattern of conductive traces is formed on a film of transfer material. A semiconductor device die is interconnected to the pattern of conductive traces and a resin body is formed around the die, one side of the conductive traces, and the interconnecting means. The film of transfer material forms, at this stage of the process, one side of the package. The film of transfer material is then peeled from the pattern of conductive traces and the resin body to expose the other side of the pattern of conductive traces. Contact to the other side of the pattern provides electrical contact to the senmiconductor device die.
    Type: Grant
    Filed: September 9, 1991
    Date of Patent: April 6, 1993
    Assignee: Motorola, Inc.
    Inventors: Paul T. Lin, Michael B. McShane, Sugio Uchida, Takehi Sato