Patents by Inventor Takehide Hayashi
Takehide Hayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11251017Abstract: A method for evaluating a secondary optical system of an electron beam inspection device provided with a primary optical system that irradiates a sample placed at an observation target position with an electron beam emitted from an electron source, and the secondary optical system that forms, on a detector, an enlarged image of an electron beam generated from the sample or an electron beam transmitted through the sample. The method includes: placing a photoelectric surface at the observation target position; irradiating the photoelectric surface with laser; forming an enlarged image of an electron beam generated from the photoelectric surface on the detector by the secondary optical system; and evaluating the secondary optical system based on an electron beam image obtained by the detector.Type: GrantFiled: June 3, 2020Date of Patent: February 15, 2022Assignee: EBARA CORPORATIONInventor: Takehide Hayashi
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Patent number: 11217421Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.Type: GrantFiled: May 20, 2020Date of Patent: January 4, 2022Assignee: EBARA CORPORATIONInventors: Takehide Hayashi, Ryo Tajima, Tatsuya Kohama, Kenji Watanabe, Tsutomu Karimata
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Publication number: 20210012997Abstract: An adjustment method for adjusting a path of an electron beam passing through an electron beam device including at least one unit having at least one lens and at least one aligner electrode, and a detector configured to detect the electron beam, the method including: a step of measuring, by a coordinate measuring machine, an assembly tolerance for each of a plurality of the units constituting the electron beam device; a step of determining a shift amount of the electron beam at a position of the at least one of the lenses; a step of determining an electrode condition for each of a plurality of the aligner electrodes included in the units in a manner such that a shift amount of the electron beam is to be the determined shift amount; and a step of setting each of the aligner electrodes to the corresponding determined electrode condition.Type: ApplicationFiled: May 20, 2020Publication date: January 14, 2021Inventors: Takehide HAYASHI, Ryo TAJIMA, Tatsuya KOHAMA, Kenji WATANABE, Tsutomu KARIMATA
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Publication number: 20200411279Abstract: A method for evaluating a secondary optical system of an electron beam inspection device provided with a primary optical system that irradiates a sample placed at an observation target position with an electron beam emitted from an electron source, and the secondary optical system that forms, on a detector, an enlarged image of an electron beam generated from the sample or an electron beam transmitted through the sample. The method includes: placing a photoelectric surface at the observation target position; irradiating the photoelectric surface with laser; forming an enlarged image of an electron beam generated from the photoelectric surface on the detector by the secondary optical system; and evaluating the secondary optical system based on an electron beam image obtained by the detector.Type: ApplicationFiled: June 3, 2020Publication date: December 31, 2020Inventor: Takehide HAYASHI
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Patent number: 10157722Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.Type: GrantFiled: June 28, 2016Date of Patent: December 18, 2018Assignee: EBARA CORPORATIONInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Yoshihiko Naito, Yasushi Toma, Tsutomu Karimata, Takehide Hayashi, Kiwamu Tsukamoto, Tatsuya Kohama, Noboru Kobayashi
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Patent number: 9728374Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.Type: GrantFiled: May 5, 2016Date of Patent: August 8, 2017Assignee: EBARA CORPORATIONInventors: Takehide Hayashi, Masahiro Hatakeyama, Shinji Yamaguchi, Masato Naka
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Publication number: 20160322192Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.Type: ApplicationFiled: May 5, 2016Publication date: November 3, 2016Inventors: Takehide HAYASHI, Masahiro HATAKEYAMA, Shinji YAMAGUCHI, Masato NAKA
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Publication number: 20160307726Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.Type: ApplicationFiled: June 28, 2016Publication date: October 20, 2016Applicant: EBARA CORPORATIONInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Yoshihiko Naito, Yasushi Toma, Tsutomu Karimata, Takehide Hayashi, Kiwamu Tsukamoto, Tatsuya Kohama, Noboru Kobayashi
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Patent number: 9368322Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.Type: GrantFiled: April 2, 2015Date of Patent: June 14, 2016Assignee: EBARA CORPORATIONInventors: Takehide Hayashi, Masahiro Hatakeyama, Shinji Yamaguchi, Masato Naka
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Publication number: 20150287570Abstract: An inspection apparatus includes beam generation means, a primary optical system, a secondary optical system and an image processing system. Irradiation energy of the beam is set in an energy region where mirror electrons are emitted from the inspection object as the secondary charged particles due to the beam irradiation. The secondary optical system includes a camera for detecting the secondary charged particles, a numerical aperture whose position is adjustable along an optical axis direction and a lens that forms an image of the secondary charged particles that have passed through the numerical aperture on an image surface of the camera. In the image processing system, the image is formed under an aperture imaging condition where the position of the numerical aperture is located on an object surface to acquire an image.Type: ApplicationFiled: April 2, 2015Publication date: October 8, 2015Inventors: Takehide HAYASHI, Masahiro HATAKEYAMA, Shinji YAMAGUCHI, Masato NAKA
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Patent number: 9105444Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.Type: GrantFiled: December 4, 2013Date of Patent: August 11, 2015Assignee: EBARA CORPORATIONInventors: Kenji Watanabe, Masahiro Hatakeyama, Yoshihiko Naito, Tatsuya Kohama, Kenji Terao, Takeshi Murakami, Takehide Hayashi, Kiwamu Tsukamoto, Hiroshi Sobukawa, Norio Kimura
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Publication number: 20140091215Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.Type: ApplicationFiled: December 4, 2013Publication date: April 3, 2014Applicant: Ebara CorporationInventors: Kenji WATANABE, Masahiro HATAKEYAMA, Yoshihiko NAITO, Tatsuya KOHAMA, Kenji TERAO, Takeshi MURAKAMI, Takehide HAYASHI, Kiwamu TSUKAMOTO, Hiroshi SOBUKAWA, Norio KIMURA
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Publication number: 20140014848Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.Type: ApplicationFiled: July 19, 2013Publication date: January 16, 2014Applicant: EBARA CORPORATIONInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Yoshihiko Naito, Yasushi Toma, Tsutomu Karimata, Takehide Hayashi, Kiwamu Tsukamoto, Tatsuya Kohama, Noboru Kobayashi
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Patent number: 8624182Abstract: An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.Type: GrantFiled: August 2, 2011Date of Patent: January 7, 2014Assignee: Ebara CorporationInventors: Kenji Watanabe, Masahiro Hatakeyama, Yoshihiko Naito, Tatsuya Kohama, Kenji Terao, Takeshi Murakami, Takehide Hayashi, Kiwamu Tsukamoto, Hiroshi Sobukawa, Norio Kimura
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Patent number: 8497476Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.Type: GrantFiled: March 15, 2012Date of Patent: July 30, 2013Assignee: Ebara CorporationInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Yoshihiko Naito, Yasushi Toma, Tsutomu Karimata, Takehide Hayashi, Kiwamu Tsukamoto, Tatsuya Kohama, Noboru Kobayashi
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Publication number: 20120235036Abstract: An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.Type: ApplicationFiled: March 15, 2012Publication date: September 20, 2012Applicant: EBARA CORPORATIONInventors: Masahiro Hatakeyama, Shoji Yoshikawa, Takeshi Murakami, Kenji Watanabe, Yoshihiko Naito, Yasushi Toma, Tsutomu Karimata, Takehide Hayashi, Kiwamu Tsukamoto, Tatsuya Kohama, Noboru Kobayashi
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Publication number: 20120074316Abstract: An electro-optical inspection apparatus is provided that is capable of preventing adhesion of dust or particles to the sample surface as much as possible. A stage (100) on which a sample (200) is placed is disposed inside a vacuum chamber (112) that can be evacuated to vacuum, and a dust collecting electrode (122) is disposed to surround a periphery of the sample (200). The dust collecting electrode (122) is applied with a voltage having the same polarity as a voltage applied to the sample (200) and an absolute value that is the same or larger than an absolute value of the voltage. Thus, because dust or particles such as particles adhere to the dust collecting electrode (122), adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber containing the stage, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.Type: ApplicationFiled: August 2, 2011Publication date: March 29, 2012Inventors: Kenji WATANABE, Masahiro HATAKEYAMA, Yoshihiko NAITO, Tatsuya KOHAMA, Kenji TERAO, Takeshi MURAKAMI, Takehide HAYASHI, Kiwamu TSUKAMOTO, Hiroshi SOBUKAWA, Norio KIMURA
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Publication number: 20040234360Abstract: A special EFEM (2) is installed in front of each of about 12 to 20 manufacturing apparatuses in a bay (in the process) of a semiconductor manufacturing factory or a liquid crystal manufacturing factory. The EFEMs are interconnected through a clean tunnel (1) and continuous traveling single-wafer conveyors (15), thus constituting interconnected EFEMs. A repacking station (3) for packing wafers in a FOUP (12) and picking up a single wafer is provided near a corner of one of the interconnected EFEMs and connected to a bay-to-bay small-batch conveyor (5). In each of the interconnected EFEMs constituting a minimum clean zone, a robot (20) having a hand with wafer-rotating mechanism is disposed so as to position a wafer and to read the bar code on a wafer. Since the robot can transfer a wafer very fast and a single-wafer conveyor conveys more than 1,000 wafers per hour, a production system with little wafer waiting time is realized.Type: ApplicationFiled: April 28, 2004Publication date: November 25, 2004Inventor: Takehide Hayashi
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Patent number: 5351836Abstract: A plate-like object container includes a container body having an object-insertion/withdrawal opening formed in a side face thereof for allowing insertion and withdrawal of a plate-like object and a plurality of positioning recesses arranged inside the container body in a direction of the thickness of the object, with an outer periphery of each object being introduced and held in position at each recess. A hook section is provided on an upper face of the container body, the hook section including at least one pair of hook members and support members for supporting the hook members. Each hook member is formed like a plate extending in substantially parallel with an upper face of the container body, the hook members being disposed apart from each other inwardly of an outer periphery of the upper face of the container body.Type: GrantFiled: July 7, 1993Date of Patent: October 4, 1994Assignee: Daifuku Co., Ltd.Inventors: Shoichi Mori, Takehide Hayashi