Patents by Inventor Takehide Miyazaki
Takehide Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11889776Abstract: A variable resistance non-volatile memory element includes first and second electrodes and a variable resistance layer between the electrodes. The layer has a resistance value reversibly variable based on an electrical signal. The layer includes a first variable resistance layer that includes an oxygen deficient first metal oxide containing a first metal element and oxygen, and a second variable resistance layer that includes a composite oxide containing the first metal element, a second metal element different from the first metal element, and oxygen, and having a different degree of oxygen deficiency from the first metal oxide. The composite oxide has a lower degree of oxygen deficiency than the first metal oxide. At room temperature, the composite oxide has a smaller oxygen diffusion coefficient than a second metal oxide containing the first metal element and oxygen, and having the degree of oxygen deficiency equal to that of the composite oxide.Type: GrantFiled: June 23, 2021Date of Patent: January 30, 2024Assignee: Nuvoton Technology Corporation JapanInventors: Ryutaro Yasuhara, Satoru Fujii, Takumi Mikawa, Atsushi Himeno, Kengo Nishio, Takehide Miyazaki, Hiroyuki Akinaga, Yasuhisa Naitoh, Hisashi Shima
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Publication number: 20210320248Abstract: A variable resistance non-volatile memory element includes first and second electrodes and a variable resistance layer between the electrodes. The layer has a resistance value reversibly variable based on an electrical signal. The layer includes a first variable resistance layer that includes an oxygen deficient first metal oxide containing a first metal element and oxygen, and a second variable resistance layer that includes a composite oxide containing the first metal element, a second metal element different from the first metal element, and oxygen, and having a different degree of oxygen deficiency from the first metal oxide. The composite oxide has a lower degree of oxygen deficiency than the first metal oxide. At room temperature, the composite oxide has a smaller oxygen diffusion coefficient than a second metal oxide containing the first metal element and oxygen, and having the degree of oxygen deficiency equal to that of the composite oxide.Type: ApplicationFiled: June 23, 2021Publication date: October 14, 2021Inventors: Ryutaro YASUHARA, Satoru FUJII, Takumi MIKAWA, Atsushi HIMENO, Kengo NISHIO, Takehide MIYAZAKI, Hiroyuki AKINAGA, Yasuhisa NAITOH, Hisashi SHIMA
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Publication number: 20190357385Abstract: An immersion tank includes a tank main body in which refrigerant is stored, and a member that is disposed on the tank main body and retracts, when an electronic apparatus is loaded into the tank main body, to a bottom portion of the tank main body but extends, when the electronic apparatus is unloaded from the tank main body, upwardly from the bottom portion.Type: ApplicationFiled: March 28, 2019Publication date: November 21, 2019Applicant: FUJITSU LIMITEDInventor: Takehide Miyazaki
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Patent number: 9698505Abstract: A connector includes: a press-fit pin including a press-fit portion configured to be press-fitted into a through-hole of a circuit board and a pressed portion configured to be coupled to the press-fit portion and receive a pressing force for press-fitting the press-fit portion into the through-hole; and a press-fit member including a through-hole configured to removably hold the press-fit pin and a pressing portion configured to transfer the pressing force to the pressed portion of the press-fit pin held in the through-hole such that the press-fit portion protrudes.Type: GrantFiled: April 15, 2016Date of Patent: July 4, 2017Assignee: FUJITSU LIMITEDInventor: Takehide Miyazaki
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Publication number: 20160336663Abstract: A connector includes: a press-fit pin including a press-fit portion configured to be press-fitted into a through-hole of a circuit board and a pressed portion configured to be coupled to the press-fit portion and receive a pressing force for press-fitting the press-fit portion into the through-hole; and a press-fit member including a through-hole configured to removably hold the press-fit pin and a pressing portion configured to transfer the pressing force to the pressed portion of the press-fit pin held in the through-hole such that the press-fit portion protrudes.Type: ApplicationFiled: April 15, 2016Publication date: November 17, 2016Applicant: FUJITSU LIMITEDInventor: Takehide Miyazaki
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Patent number: 9145790Abstract: A pump includes: an impeller that moves fluid; a housing section, provided adjacent to a channel for the fluid, that communicate with the channel; and a controller that positions the impeller in the channel during a driving of the impeller and houses the impeller in the housing section during a stoppage of driving of the impeller.Type: GrantFiled: November 27, 2012Date of Patent: September 29, 2015Assignee: FUJITSU LIMITEDInventor: Takehide Miyazaki
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Publication number: 20130243566Abstract: A pump includes: an impeller that moves fluid; a housing section, provided adjacent to a channel for the fluid, that communicate with the channel; and a controller that positions the impeller in the channel during a driving of the impeller and houses the impeller in the housing section during a stoppage of driving of the impeller.Type: ApplicationFiled: November 27, 2012Publication date: September 19, 2013Applicant: Fujitsu LimitedInventor: Takehide MIYAZAKI
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Patent number: 8004846Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.Type: GrantFiled: March 24, 2009Date of Patent: August 23, 2011Assignee: Fujitsu LimitedInventors: Akira Okada, Hirofumi Imabayashi, Hideaki Yajima, Katsumi Kanasaki, Takehide Miyazaki, Kazuya Nishida
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Patent number: 7692305Abstract: A power feed device for an electrical component which improves the quality of transmission and reduces the mounting density of a printed circuit board in the power feed device or reduces the thickness of the printed circuit board and thereby realizes smaller size, provided with a power supply for supplying power, a printed circuit board having built-in signal line patterns, and a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, power from the power supply being supplied through the conductive projections of the power bar to electrodes of the electrical component.Type: GrantFiled: December 27, 2005Date of Patent: April 6, 2010Assignee: Fujitsu LimitedInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Akira Okada
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Patent number: 7628629Abstract: A connector for electrically connecting with a first circuit board and a second circuit board, the connector includes a female connector and a male connector. The female connector includes a housing, a moveable side electrode capable of moving in the housing and an elastic member biasing the moveable side electrode, the moveable side electrode having a recess. The male connector includes a projection with a tip end being fitted into the recess of the moveable side electrode.Type: GrantFiled: February 20, 2009Date of Patent: December 8, 2009Assignee: Fujitsu LimitedInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Hideaki Yajima, Kazuya Nishida, Akira Okada
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Publication number: 20090244852Abstract: A heat radiator capable of thermally connect to a heat element includes a pair of heat conducting plates conducting heat from one side surface to other side surface of the heat conducting plate, respectively, the pair of heat conducting plates having a space between each of the heat conducting plates; and a radiation fin arranged between the pair of heat conducting plates, having elastic characteristics between the pair of heat conducting plates, and radiating heat from the heat conducting plate to the space.Type: ApplicationFiled: March 24, 2009Publication date: October 1, 2009Applicant: Fujitsu LimitedInventors: Akira Okada, Hirofumi Imabayashi, Hideaki Yajima, Katsumi Kanasaki, Takehide Miyazaki, Kazuya Nishida
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Publication number: 20090215288Abstract: A connector for electrically connecting with a first circuit board and a second circuit board, the connector includes a female connector and a male connector. The female connector includes a housing, a moveable side electrode capable of moving in the housing and an elastic member biasing the moveable side electrode, the moveable side electrode having a recess. The male connector includes a projection with a tip end being fitted into the recess of the moveable side electrode.Type: ApplicationFiled: February 20, 2009Publication date: August 27, 2009Applicant: Fujitsu LimitedInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Hideaki Yajima, Kazuya Nishida, Akira Okada
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Patent number: 7580268Abstract: A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive voltages of electrical components and the noise between the power supply and ground accompanying simultaneous switching waveforms, provided with a power supply for supplying power, a printed circuit board including a signal line pattern, a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, a ground bar provided outside of the printed circuit board, and a high dielectric layer provided at a part corresponding to the electrical component between the power bar and the ground bar, power from the power supply being fed to electrodes of the electrical component through the power bar and the ground bar.Type: GrantFiled: December 27, 2005Date of Patent: August 25, 2009Assignee: Fujitsu LimitedInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Akira Okada
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Publication number: 20070076388Abstract: A built-in capacitor type power feed device for an electrical component which solves the problems of the reduction in the noise margin of the power supply system accompanying the lower drive voltages of electrical components and the noise between the power supply and ground accompanying simultaneous switching waveforms, provided with a power supply for supplying power, a printed circuit board including a signal line pattern, a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, a ground bar provided outside of the printed circuit board, and a high dielectric layer provided at a part corresponding to the electrical component between the power bar and the ground bar, power from the power supply being fed to electrodes of the electrical component through the power bar and the ground bar.Type: ApplicationFiled: December 27, 2005Publication date: April 5, 2007Applicant: FUJITSU LIMITEDInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Akira Okada
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Publication number: 20070075431Abstract: A power feed device for an electrical component which improves the quality of transmission and reduces the mounting density of a printed circuit board in the power feed device or reduces the thickness of the printed circuit board and thereby realizes smaller size, provided with a power supply for supplying power, a printed circuit board having built-in signal line patterns, and a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, power from the power supply being supplied through the conductive projections of the power bar to electrodes of the electrical component.Type: ApplicationFiled: December 27, 2005Publication date: April 5, 2007Applicant: FUJITSU LIMITEDInventors: Takehide Miyazaki, Hirofumi Imabayashi, Katsumi Kanasaki, Akira Okada
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Patent number: 7138688Abstract: A doping method includes the step of attaching molecules or clusters to the surface of a semiconductor substrate to enable charge transfer from the molecules or clusters to the substrate surface, thereby inducing carriers underneath the substrate surface. A semiconductor device is fabricated through attachment of molecules or clusters to the surface of a semiconductor substrate. The attachment enables charge transfer from the molecules or clusters to the substrate surface to induce carriers underneath the substrate surface.Type: GrantFiled: September 5, 2003Date of Patent: November 21, 2006Assignees: National Institute of Advanced Industrial Science and Technology, NEC CorporationInventors: Toshihiko Kanayama, Takehide Miyazaki, Hidefumi Hiura
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Patent number: 7027595Abstract: A telecommunications apparatus that has a substantially box-shaped subrack having a back wiring board mounting a connector and a plurality of shell-type plug-in units inserted in the subrack so that a connector of each of the plug-in units is connected to the connector of the subrack, further includes a flexible, electrically conductive seal member elastically deformedly disposed between a lateral surface of the plug-in unit inserted into the subrack and an interior portion of the subrack so as to enclose both the plug-in unit connector.Type: GrantFiled: March 21, 2001Date of Patent: April 11, 2006Assignee: Fujitsu LimitedInventors: Takehide Miyazaki, Kazuhiro Iino, Naoya Yamazaki, Tomoyuki Hongoh, Yoshinori Hoshino, Yoshiaki Tada
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Patent number: 6859352Abstract: A capacitor sheet comprises a plurality of first capacitor blocks connecting signal/power supply electrodes of two circuit boards with through-hole electrodes, and having grounding electrodes sandwiching dielectrics around the through-hole electrodes, and a plurality of second capacitor blocks connecting the grounding electrodes in two circuit boards with the through-hole electrodes, and having the grounding electrodes sandwiching the dielectrics around the through-hole electrodes, wherein the through-hole electrodes and the grounding electrodes are connected with pattern wirings. The capacitor blocks are arranged so that the grounding electrodes in the first capacitor blocks are electrically connected to the grounding electrodes of the second capacitor blocks to be combined to a single piece.Type: GrantFiled: June 28, 2004Date of Patent: February 22, 2005Assignee: Fujitsu LimitedInventors: Katsumi Kanasaki, Hirofumi Imabayashi, Takehide Miyazaki, Akira Okada
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Publication number: 20040121567Abstract: A doping method includes the step of attaching molecules or clusters to the surface of a semiconductor substrate to enable charge transfer from the molecules or clusters to the substrate surface, thereby inducing carriers underneath the substrate surface. A semiconductor device is fabricated through attachment of molecules or clusters to the surface of a semiconductor substrate. The attachment enables charge transfer from the molecules or clusters to the substrate surface to induce carriers underneath the substrate surface.Type: ApplicationFiled: September 5, 2003Publication date: June 24, 2004Applicants: Nat'l Inst. of Advan. Industrial Science and Tech., NEC CorporationInventors: Toshihiko Kanayama, Takehide Miyazaki, Hidefumi Hiura
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Publication number: 20020061102Abstract: A telecommunications apparatus that has a substantially box-shaped subrack having a back wiring board mounting a connector and a plurality of shell-type plug-in units inserted in the subrack so that a connector of each of the plug-in units is connected to the connector of the subrack, further includes a flexible, electrically conductive seal member elastically deformedly disposed between a lateral surface of the plug-in unit inserted into the subrack and an interior portion of the subrack so as to enclose both the plug-in unit connector.Type: ApplicationFiled: March 21, 2001Publication date: May 23, 2002Inventors: Takehide Miyazaki, Kazuhiro Iino, Naoya Yamazaki, Tomoyuki Hongoh, Yoshinori Hoshino, Yoshiaki Tada