Abstract: Inner panels including at least one built-in heat pipe connected in a circumferential direction are provided. In a heat pipe panel including the built-in heat pipe, apparatuses are mounted on the outer side of the plural inner panels connected in the circumferential direction to diffuse generated heat of the apparatuses to the circumferential direction of the inner panels. Webbed panels including a built-in heat pipe horizontally arranged and having heat radiation surfaces are radially arranged at corners of the inner panels as well as a heat pipe is horizontally built in and heat radiation surfaces are arranged also on outer panels facing the inner panels to thermally connect the heat pipes to one another.

Abstract: Inner panels including at least one built-in heat pipe connected in a circumferential direction are provided. In a heat pipe panel including the built-in heat pipe, apparatuses are mounted on the outer side of the plural inner panels connected in the circumferential direction to diffuse generated heat of the apparatuses to the circumferential direction of the inner panels. Webbed panels including a built-in heat pipe horizontally arranged and having heat radiation surfaces are radially arranged at corners of the inner panels as well as a heat pipe is horizontally built in and heat radiation surfaces are arranged also on outer panels facing the inner panels to thermally connect the heat pipes to one another.

Abstract: One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.

Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.

Abstract: This invention provides a heat pipe including a plurality of pipe parts for performing at least one of absorption of heat and radiation of heat through an outer surface, which are adjacent toward one direction, a flat part including a heat transfer plane created in a flat form for performing at least one of absorption of heat from and radiation of heat into outer space, created on a part of the outer surface of each of the plurality of pipe parts to be integrated with each of the pipe parts, and a fin in a flat form continuing without an uneven part from the heat transfer plane included in the flat part for providing an heat transfer plane further extended from the heat transfer plane toward an adjacent pipe part.

Abstract: One object of the present invention is to realize a heat discharger having a high precision and in which heat conduction efficiency is maintained at the bonding between the heat pipe and heat sink. A heat discharger comprises a heat pipe and a heat sink formed separately from the heat pipe and bonded to the heat pipe via solder. The contact surface portion between the heat pipe and the solder and the contact surface portion between the heat sink and the solder are made of a wettable material having a wettablility such that the contacting angle with respect to the solder is 90 degrees or less.