Patents by Inventor Takehiko Arita
Takehiko Arita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240053073Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium flows out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to flow out.Type: ApplicationFiled: October 26, 2023Publication date: February 15, 2024Inventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
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Publication number: 20240038555Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.Type: ApplicationFiled: October 3, 2023Publication date: February 1, 2024Inventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
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Patent number: 11835278Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium is flown out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to be flown out.Type: GrantFiled: February 26, 2021Date of Patent: December 5, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
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Patent number: 11817334Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.Type: GrantFiled: February 11, 2021Date of Patent: November 14, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
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Patent number: 11692639Abstract: A temperature control fluid is introduced through a first port. The temperature control fluid introduced into the first port is discharged through a second port. A piston is configured to be moved by a pressure to open or close a path connecting the first port and the second port. A pressure control space is provided at at least one side of a moving direction of the piston when the path is opened or closed. Air is supplied into the pressure control space through a third port. A leak portion communicates with the pressure control space, and allows the air supplied into the pressure control space to leak therethrough.Type: GrantFiled: February 24, 2021Date of Patent: July 4, 2023Assignee: TOKYO ELECTRON LIMITEDInventors: Kei Kobayashi, Takehiko Arita
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Patent number: 11404251Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.Type: GrantFiled: February 1, 2018Date of Patent: August 2, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Shin Yamaguchi, Akiyoshi Mitsumori, Takehiko Arita, Koichi Murakami
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Patent number: 11237577Abstract: A temperature control system includes a first pump, a second pump, a temperature adjusting unit, a first flow passage, a second flow passage, a first valve disposed in the first flow passage, a second valve disposed in the second flow passage, a first bypass flow passage connecting the first flow passage to the second flow passage on the temperature adjusting unit side of the first and second valves, a second bypass flow passage connecting the first flow passage to the second flow passage on the flow passage side of the first and second valves, a third valve disposed in the first bypass flow passage, and a fourth valve disposed in the second bypass flow passage. At least one of a pair of the first valve and the second valve, and a pair of the third valve and the fourth valve is a pair of flow rate adjustable valves.Type: GrantFiled: September 5, 2019Date of Patent: February 1, 2022Assignee: Tokyo Electron LimitedInventors: Kei Kobayashi, Takehiko Arita
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Publication number: 20210270508Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium is flown out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to be flown out.Type: ApplicationFiled: February 26, 2021Publication date: September 2, 2021Inventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
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Publication number: 20210262583Abstract: A temperature control fluid is introduced through a first port. The temperature control fluid introduced into the first port is discharged through a second port. A piston is configured to be moved by a pressure to open or close a path connecting the first port and the second port. A pressure control space is provided at at least one side of a moving direction of the piston when the path is opened or closed. Air is supplied into the pressure control space through a third port. A leak portion communicates with the pressure control space, and allows the air supplied into the pressure control space to leak therethrough.Type: ApplicationFiled: February 24, 2021Publication date: August 26, 2021Inventors: Kei Kobayashi, Takehiko Arita
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Publication number: 20210257235Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.Type: ApplicationFiled: February 11, 2021Publication date: August 19, 2021Inventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
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Patent number: 10907864Abstract: A cooling system includes a heat exchange unit; a supply line configured to send a coolant to the heat exchange unit; a drain line configured to send the coolant drained from the heat exchange unit; a first to a nth gas-liquid separating units connected in series to a gas line in which a gas of the coolant flows; a first to a nth cooling lines extended via the first to the nth gas-liquid separating units, respectively. Both ends of the first cooling line are connected to a cooling device. The second to the nth cooling lines are provided between the drain line and a first to a (n?1)th liquid lines via the second to the nth gas-liquid separating units, respectively. The first to the nth gas-liquid separating units are respectively connected to liquid lines, and the liquid lines communicate with the supply line connected to the heat exchange unit.Type: GrantFiled: March 28, 2019Date of Patent: February 2, 2021Assignee: TOKYO ELECTRON LIMITEDInventor: Takehiko Arita
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Publication number: 20200243353Abstract: A control method of a heat medium includes a flow rate control process and a supply stop process. In the flow rate control process, a flow rate of the heat medium is decreased in a state where the heat medium is being supplied from a temperature controller configured to supply the heat medium whose temperature is controlled into a flow path formed in a heat exchange member configured to exchange heat with a temperature control target object. In the supply stop process, a supply of the heat medium into the flow path is stopped by controlling a supply valve provided at a supply line that connects the temperature controller and the flow path of the heat exchange member.Type: ApplicationFiled: January 23, 2020Publication date: July 30, 2020Inventors: Kei Kobayashi, Takehiko Arita
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Publication number: 20200117223Abstract: A temperature control system includes a first pump, a second pump, a temperature adjusting unit, a first flow passage, a second flow passage, a first valve disposed in the first flow passage, a second valve disposed in the second flow passage, a first bypass flow passage connecting the first flow passage to the second flow passage on the temperature adjusting unit side of the first and second valves, a second bypass flow passage connecting the first flow passage to the second flow passage on the flow passage side of the first and second valves, a third valve disposed in the first bypass flow passage, and a fourth valve disposed in the second bypass flow passage. At least one of a pair of the first valve and the second valve, and a pair of the third valve and the fourth valve is a pair of flow rate adjustable valves.Type: ApplicationFiled: September 5, 2019Publication date: April 16, 2020Inventors: Kei KOBAYASHI, Takehiko ARITA
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Publication number: 20190310034Abstract: A method of controlling a flow rate of fluid flowing through a passage formed in a member of a system is provided. The system includes the member, a first pipe connected to one side of the passage, a second pipe connected to another side of the passage, a third pipe connecting the first pipe and the second pipe at a side opposite the passage, a bypass pipe connecting the first pipe and the second pipe at a location closer to the member relative to the third pipe, a first valve provided at the first pipe, a bypass valve provided at the bypass pipe, and a pump provided at the third pipe, which is configured to supply the fluid to the passage. The method includes controlling the first valve, controlling the bypass valve, and controlling an operating frequency of the pump.Type: ApplicationFiled: April 1, 2019Publication date: October 10, 2019Inventors: Kei KOBAYASHI, Takehiko ARITA
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Publication number: 20190301812Abstract: A cooling system includes a heat exchange unit; a supply line configured to send a coolant to the heat exchange unit; a drain line configured to send the coolant drained from the heat exchange unit; a first to a nth gas-liquid separating units connected in series to a gas line in which a gas of the coolant flows; a first to a nth cooling lines extended via the first to the nth gas-liquid separating units, respectively. Both ends of the first cooling line are connected to a cooling device. The second to the nth cooling lines are provided between the drain line and a first to a (n?1)th liquid lines via the second to the nth gas-liquid separating units, respectively. The first to the nth gas-liquid separating units are respectively connected to liquid lines, and the liquid lines communicate with the supply line connected to the heat exchange unit.Type: ApplicationFiled: March 28, 2019Publication date: October 3, 2019Inventor: Takehiko Arita
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Publication number: 20180218886Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.Type: ApplicationFiled: February 1, 2018Publication date: August 2, 2018Inventors: Shin Yamaguchi, Akiyoshi Mitsumori, Takehiko Arita, Koichi Murakami
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Publication number: 20180218887Abstract: In a processing apparatus, a cooling table in which a coolant is flown includes first to third regions, and a path group of the coolant. The first region is provided at a center portion of the cooling table. The second region is provided to surround the first region. The third region is provided to surround the first and the second regions. The path group includes first to third paths. The first path to the third path are provided in the first region to the third region, respectively. A pipeline system of the coolant includes a first valve group and a second valve group. The first path and the second path, and the second path and the third path are connected via the first valve group. The chiller unit and the path group are connected via the second valve group.Type: ApplicationFiled: February 1, 2018Publication date: August 2, 2018Inventors: Takehiko Arita, Akiyoshi Mitsumori, Shin Yamaguchi