Patents by Inventor Takehiko Arita

Takehiko Arita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240053073
    Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium flows out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to flow out.
    Type: Application
    Filed: October 26, 2023
    Publication date: February 15, 2024
    Inventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
  • Publication number: 20240038555
    Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.
    Type: Application
    Filed: October 3, 2023
    Publication date: February 1, 2024
    Inventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
  • Patent number: 11835278
    Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium is flown out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to be flown out.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: December 5, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
  • Patent number: 11817334
    Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.
    Type: Grant
    Filed: February 11, 2021
    Date of Patent: November 14, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
  • Patent number: 11692639
    Abstract: A temperature control fluid is introduced through a first port. The temperature control fluid introduced into the first port is discharged through a second port. A piston is configured to be moved by a pressure to open or close a path connecting the first port and the second port. A pressure control space is provided at at least one side of a moving direction of the piston when the path is opened or closed. Air is supplied into the pressure control space through a third port. A leak portion communicates with the pressure control space, and allows the air supplied into the pressure control space to leak therethrough.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: July 4, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Kei Kobayashi, Takehiko Arita
  • Patent number: 11404251
    Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: August 2, 2022
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Shin Yamaguchi, Akiyoshi Mitsumori, Takehiko Arita, Koichi Murakami
  • Patent number: 11237577
    Abstract: A temperature control system includes a first pump, a second pump, a temperature adjusting unit, a first flow passage, a second flow passage, a first valve disposed in the first flow passage, a second valve disposed in the second flow passage, a first bypass flow passage connecting the first flow passage to the second flow passage on the temperature adjusting unit side of the first and second valves, a second bypass flow passage connecting the first flow passage to the second flow passage on the flow passage side of the first and second valves, a third valve disposed in the first bypass flow passage, and a fourth valve disposed in the second bypass flow passage. At least one of a pair of the first valve and the second valve, and a pair of the third valve and the fourth valve is a pair of flow rate adjustable valves.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: February 1, 2022
    Assignee: Tokyo Electron Limited
    Inventors: Kei Kobayashi, Takehiko Arita
  • Publication number: 20210270508
    Abstract: A temperature control medium processing apparatus configured to collect a temperature control medium from a module using the temperature control medium or refill the module with the temperature control medium includes a tank configured to store the temperature control medium therein; a first inlet path which is connected to a first inlet opening of the tank, and through which the temperature control medium is introduced; an inlet connector configured to connect the first inlet path and a path from the module; an outlet path which is connected to an outlet opening of the tank, and through which the temperature control medium is flown out; an outlet connector configured to connect the outlet path and a path to the module; and a pump provided at the outlet path, and configured to force the temperature control medium stored in the tank to be flown out.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 2, 2021
    Inventors: Hayato Sakai, Takehiko Arita, Haruka Kaneko, Satoshi Suzuki
  • Publication number: 20210262583
    Abstract: A temperature control fluid is introduced through a first port. The temperature control fluid introduced into the first port is discharged through a second port. A piston is configured to be moved by a pressure to open or close a path connecting the first port and the second port. A pressure control space is provided at at least one side of a moving direction of the piston when the path is opened or closed. Air is supplied into the pressure control space through a third port. A leak portion communicates with the pressure control space, and allows the air supplied into the pressure control space to leak therethrough.
    Type: Application
    Filed: February 24, 2021
    Publication date: August 26, 2021
    Inventors: Kei Kobayashi, Takehiko Arita
  • Publication number: 20210257235
    Abstract: A system of processing a substrate includes substrate-processing chambers; target components of temperature control disposed in the respective substrate-processing chambers; a chiller to supply a first temperature-controlling medium with a first flow rate and a second temperature-controlling medium with a second flow rate into the target components; flow controllers connected to the respective target components, each flow controller being configured to independently control a ratio of the first flow rate to the second flow rate to be fed into the corresponding target component from the chiller.
    Type: Application
    Filed: February 11, 2021
    Publication date: August 19, 2021
    Inventors: Haruka Kaneko, Takehiko Arita, Hayato Sakai
  • Patent number: 10907864
    Abstract: A cooling system includes a heat exchange unit; a supply line configured to send a coolant to the heat exchange unit; a drain line configured to send the coolant drained from the heat exchange unit; a first to a nth gas-liquid separating units connected in series to a gas line in which a gas of the coolant flows; a first to a nth cooling lines extended via the first to the nth gas-liquid separating units, respectively. Both ends of the first cooling line are connected to a cooling device. The second to the nth cooling lines are provided between the drain line and a first to a (n?1)th liquid lines via the second to the nth gas-liquid separating units, respectively. The first to the nth gas-liquid separating units are respectively connected to liquid lines, and the liquid lines communicate with the supply line connected to the heat exchange unit.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: February 2, 2021
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Takehiko Arita
  • Publication number: 20200243353
    Abstract: A control method of a heat medium includes a flow rate control process and a supply stop process. In the flow rate control process, a flow rate of the heat medium is decreased in a state where the heat medium is being supplied from a temperature controller configured to supply the heat medium whose temperature is controlled into a flow path formed in a heat exchange member configured to exchange heat with a temperature control target object. In the supply stop process, a supply of the heat medium into the flow path is stopped by controlling a supply valve provided at a supply line that connects the temperature controller and the flow path of the heat exchange member.
    Type: Application
    Filed: January 23, 2020
    Publication date: July 30, 2020
    Inventors: Kei Kobayashi, Takehiko Arita
  • Publication number: 20200117223
    Abstract: A temperature control system includes a first pump, a second pump, a temperature adjusting unit, a first flow passage, a second flow passage, a first valve disposed in the first flow passage, a second valve disposed in the second flow passage, a first bypass flow passage connecting the first flow passage to the second flow passage on the temperature adjusting unit side of the first and second valves, a second bypass flow passage connecting the first flow passage to the second flow passage on the flow passage side of the first and second valves, a third valve disposed in the first bypass flow passage, and a fourth valve disposed in the second bypass flow passage. At least one of a pair of the first valve and the second valve, and a pair of the third valve and the fourth valve is a pair of flow rate adjustable valves.
    Type: Application
    Filed: September 5, 2019
    Publication date: April 16, 2020
    Inventors: Kei KOBAYASHI, Takehiko ARITA
  • Publication number: 20190310034
    Abstract: A method of controlling a flow rate of fluid flowing through a passage formed in a member of a system is provided. The system includes the member, a first pipe connected to one side of the passage, a second pipe connected to another side of the passage, a third pipe connecting the first pipe and the second pipe at a side opposite the passage, a bypass pipe connecting the first pipe and the second pipe at a location closer to the member relative to the third pipe, a first valve provided at the first pipe, a bypass valve provided at the bypass pipe, and a pump provided at the third pipe, which is configured to supply the fluid to the passage. The method includes controlling the first valve, controlling the bypass valve, and controlling an operating frequency of the pump.
    Type: Application
    Filed: April 1, 2019
    Publication date: October 10, 2019
    Inventors: Kei KOBAYASHI, Takehiko ARITA
  • Publication number: 20190301812
    Abstract: A cooling system includes a heat exchange unit; a supply line configured to send a coolant to the heat exchange unit; a drain line configured to send the coolant drained from the heat exchange unit; a first to a nth gas-liquid separating units connected in series to a gas line in which a gas of the coolant flows; a first to a nth cooling lines extended via the first to the nth gas-liquid separating units, respectively. Both ends of the first cooling line are connected to a cooling device. The second to the nth cooling lines are provided between the drain line and a first to a (n?1)th liquid lines via the second to the nth gas-liquid separating units, respectively. The first to the nth gas-liquid separating units are respectively connected to liquid lines, and the liquid lines communicate with the supply line connected to the heat exchange unit.
    Type: Application
    Filed: March 28, 2019
    Publication date: October 3, 2019
    Inventor: Takehiko Arita
  • Publication number: 20180218886
    Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.
    Type: Application
    Filed: February 1, 2018
    Publication date: August 2, 2018
    Inventors: Shin Yamaguchi, Akiyoshi Mitsumori, Takehiko Arita, Koichi Murakami
  • Publication number: 20180218887
    Abstract: In a processing apparatus, a cooling table in which a coolant is flown includes first to third regions, and a path group of the coolant. The first region is provided at a center portion of the cooling table. The second region is provided to surround the first region. The third region is provided to surround the first and the second regions. The path group includes first to third paths. The first path to the third path are provided in the first region to the third region, respectively. A pipeline system of the coolant includes a first valve group and a second valve group. The first path and the second path, and the second path and the third path are connected via the first valve group. The chiller unit and the path group are connected via the second valve group.
    Type: Application
    Filed: February 1, 2018
    Publication date: August 2, 2018
    Inventors: Takehiko Arita, Akiyoshi Mitsumori, Shin Yamaguchi